Abstract:
A substantially planar heater for a phase change memory may taper as it extends upwardly to contact a chalcogenide layer. As a result, the contact area between heater and chalcogenide is reduced. This reduced contact area can reduce power consumption in some embodiments.
Abstract:
An integrated device comprises a first conductive region and a first insulating region of dielectric material covering the first conductive region. A first through region of electrically conductive material extends inside the first insulating region, and is in direct electrical contact with the first conductive region. A second conductive region, arranged above the first insulating region, is in a position not aligned and not in contact with the first through region. A second insulating region of dielectric material covers the second conductive region. A second through region of electrically conductive material extends inside the second insulating region as far as the first through region and is aligned and in direct electrical contact with the first through region. A third conductive region, arranged above the second insulating region, is aligned and in direct electrical contact with the second through region.
Abstract:
A non-volatile memory device including a plurality of memory cells, each memory cell formed as MOS transistor with a source region, a drain region and a gate having sides formed therewith; and one or more dielectric spacers disposed on the sides of the gate. At least one memory cell is defined in an ON state and at least one memory cell is defined in an OFF state. The memory cells in the ON state comprise drain regions and source regions of the lightly diffused drain (LDD) type, characterized in that the at least one drain region and the at least one source region of the memory cells in the OFF state are formed by one or more high dopant regions. The memory cells in the OFF state consists of layers of silicide on top of one or more active regions defined as the source region, the drain region, and the gate.
Abstract:
A method of erasing a flash memory integrated in a chip of semiconductor material and including at least one matrix of cells with a plurality of rows and a plurality of columns made in at least one insulated body, the cells of each row being connected to a corresponding word line; the method includes the step of applying a single erasing pulse relative to a selected single one of the at least one body to a selected subset of the word lines for erasing the cells of each corresponding row made in the selected body with no intermediate check of the completion of the erasure.
Abstract:
A byte-switch structure for electrically erasable and programmable non-volatile memories, includes a MOS transistor having a drain electrode coupled to a respective metal control gate line, a source electrode coupled to a respective polysilicon byte control line which is connected to control gate electrodes of all the memory cells of a same memory byte or word and is formed in an upper polysilicon layer, and a gate electrode coupled to a respective word line. The source and drain electrodes of the MOS transistor are respectively a first and a second doped regions of a first conductivity type formed in a semiconductor layer of a second conductivity type at opposite sides of the respective word line. The first and second doped regions are formed under the respective metal control gate line, and the polysilicon byte control gate line insulatively extends under the metal control gate line to overlap said first doped region, and contacts the first doped region through a respective contact opening in an underlying stack formed by an interpoly dielectric layer, a lower polysilicon layer and an oxide layer.
Abstract:
A non-volatile memory cell and a manufacturing process therefor are discussed. The cell is integrated in a semiconductor substrate and includes a floating gate transistor having a first source region, first drain region, and gate region projecting over the substrate between the first source and drain regions. The cell also includes a selection transistor having a second source region, second drain region, and respective gate region, projecting over the substrate between the second source and drain regions. The first and second regions are lightly doped and the cell comprises mask elements.
Abstract:
During critical plasma etching steps, the wafer's surface is illuminated with electromagnetic radiation in the visible and/or in the UV spectrum having an energy and power density sufficient to increase the reverse current through protective junctions on the wafer. These protective junctions provide electrical discharge paths for electrical charges picked up by exposed conductive parts of the wafer. The induced voltages are limited to values compatible with preserving the integrity of functional dielectric layers coupled to the exposed conductive parts and to the semiconductor substrate or to another conductive part.
Abstract:
Array of electrically programmable non-volatile memory cells, each cell comprising a stacked-gate MOS transistor having a lower gate electrode, an upper gate electrode coupled to a row of the array, a first electrode associated with a column of the array and a second electrode separated from the first electrode by a channel region underlying said lower gate electrode, the first electrode, the second electrode and the channel region being formed in a layer of semiconductor material of a first conductivity type and having a second conductivity type, comprising at least one ROM memory cell which identically to the electrically programmable non-volatile memory cells comprises a stacked-gate MOS transistor and is associated with a respective row and a respective column of the array, the ROM cell including means for allowing or not allowing the electrical separation between said respective column and the second electrode of the ROM cell, if the ROM cell must store a first logic state or, respectively, a second logic state.
Abstract:
Process for manufacturing a non-volatile memory with memory cells arranged in rows and columns in a matrix structure, with source lines extending in parallel with and intercalated to said rows, the cells including MOS transistors having a floating gate and a control gate respectively formed in a first and a second polysilicon layers superimposed, the process including a first step of definition of regions of active area covered by a layer of thin oxide and delimited by regions of field oxide, a second step of deposition of the first polysilicon layer, a third step of etch of the first polysilicon layer through a first mask to separate the floating gates of cells belonging to a same row of the matrix, a fourth step of deposition of an intermediate dielectric layer and of the second polysilicon layer, a fifth step of definition of the rows through self-aligned selective etch of said second polysilicon layer, of the intermediate dielectric layer and of the first polysilicon layer, the self-aligned selective etch determining in the source lines excavations in correspondence of regions in which the first polysilicon layer has been removed during the third step, and a sixth step of dopant introduction in the regions of active area for the formation of regions of source and drain of the cells. Before the fourth step a selective introduction of dopant is provided in correspondence of regions of the common source lines in which the excavations will be formed, for the formation of doped regions deeper than the excavations.