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公开(公告)号：US11202156B2
公开(公告)日：2021-12-14
申请号：US16760540
申请日：2018-09-06
Applicant: Goertek, Inc.
Inventor： Quanbo Zou , Yongwei Dong
Abstract: An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/μm.
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公开(公告)号：US11111131B2
公开(公告)日：2021-09-07
申请号：US16619980
申请日：2017-06-09
Applicant: GOERTEK. INC
Inventor： Quanbo Zou
Abstract: A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.
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公开(公告)号：US11107946B2
公开(公告)日：2021-08-31
申请号：US16088564
申请日：2017-12-19
Applicant: Goertek Inc.
Inventor： Xiangxu Feng , Peixuan Chen , Quanbo Zou
Abstract: The present disclosure discloses a micro-LED transfer method, a manufacturing method, device and an electronic apparatus. The transfer method comprises: in accordance with a sequence of micro-LEDs of blue, green and red, epitaxially growing micro-LEDs of two or all of the three colors on a single GaAs original substrate; epitaxially growing bumping electrodes corresponding to the micro-LEDs on a receiving substrate; bonding the micro-LEDs of the two or all of the three colors with the bumping electrodes on the receiving substrate; and removing the GaAs original substrate. The method can be used to transfer micro-LEDs of a variety of colors, in order to improve the production efficiency.
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公开(公告)号：US10944023B2
公开(公告)日：2021-03-09
申请号：US16347617
申请日：2016-11-07
Applicant: GOERTEK. INC
Inventor： Quanbo Zou
IPC: H01L33/00 , H01L25/075 , H01L33/62 , H01L23/00
Abstract: A micro-LED transfer method and manufacturing method. The micro-LED (303) transfer method comprises: bringing pickup units (305) of a transfer head in contact with micro-LEDs (303) on a carrier substrate (301), wherein the pickup units (305) are able to apply current to the micro-LEDs (303); applying current to the micro-LEDs (303) via the pickup units (305) to heat up bonding layers (302) between the micro-LEDs (303) and the carrier substrate (301) to be melted; picking up the micro-LEDs (303) from the carrier substrate (301) with the transfer head; bonding the micro-LEDs (303) onto a receiving substrate (307); and removing the transfer head from the micro-LEDs.
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公开(公告)号：US20200267480A1
公开(公告)日：2020-08-20
申请号：US16640022
申请日：2018-09-06
Inventor： Quanbo Zou , Qunwen Leng , Zhe Wang
IPC: H04R19/04
Abstract: An MEMS microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein: one of the vibration diaphragm and the first substrate is provided with a magnetic film, and the other one of the vibration diaphragm and the first substrate is provided with a magnetoresistive sensor cooperating with the magnetic film, the magnetoresistive sensor being configured to sense a change in a magnetic field of the magnetic film during a vibration of the vibration diaphragm and output a varying electrical signal.
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Patent Agency Ranking
公开(公告)号：US20200186939A1
公开(公告)日：2020-06-11
申请号：US16614984
申请日：2017-05-31
Applicant: GOERTEK, INC.
Inventor： Quanbo Zou
Abstract: A MEMS microphone and a manufacturing method thereof are provided. The MEMS microphone comprises a MEMS microphone chip and a housing with an acoustic port. The MEMS microphone chip is mounted in the housing, and a mesh plug is mounted in the acoustic port and made from a mesh material which has a mesh structure that is suitable for passage of sound.
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公开(公告)号：US20200092658A1
公开(公告)日：2020-03-19
申请号：US16609194
申请日：2017-05-05
Applicant: GOERTEK INC.
Inventor： Quanbo Zou , Zhe Wang , Jialiang Yan
Abstract: A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provided with a sound port (11) at a position that is corresponding to the MEMS acoustoelectric chip (3), wherein, the MEMS microphone further comprises a filter (5), wherein the filter (5) is embedded into a back cavity of the MEMS acoustoelectric chip (3), the filter (5) and the PCB substrate (1) have a lateral hole therebetween, and the lateral hole serves as a sound channel that is used by the MEMS acoustoelectric chip (3) to gather sound. The MEMS microphone can prevent gas shock, block the interfering to the MEMS microphone by kinetic particles, keep the acoustic performance of the MEMS microphone, and reduce the packaging size of the MEMS microphone.
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公开(公告)号：US10388634B2
公开(公告)日：2019-08-20
申请号：US15986812
申请日：2018-05-23
Applicant: Goertek, Inc.
Inventor： Quanbo Zou
IPC: H01L21/00 , H01L25/075 , H01L33/62 , H01L33/00
Abstract: A micro-LED transfer method, manufacturing method and display device are disclosed. The method comprises: coating conductive photoresist on a receiving substrate, wherein the conductive photoresist is positive-tone photoresist; bonding a carrier substrate with the receiving substrate via the conductive photoresist, wherein metal electrodes of micro-LEDs on the carrier substrate are aligned with electrodes on the receiving substrate and are bonded with the electrodes on the receiving substrate via the conductive photoresist, and the carrier substrate is a transparent substrate; selectively lifting-off micro-LEDs from the carrier substrate through laser lifting-off using a first laser; and separating the carrier substrate from the receiving substrate.
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公开(公告)号：US10306372B2
公开(公告)日：2019-05-28
申请号：US15311152
申请日：2014-08-26
Applicant: GOERTEK INC.
Inventor： Quanbo Zou , Zhe Wang
IPC: H04R3/00 , H04R17/02 , H04R9/06 , H04R19/00 , B81B7/00 , H04R19/04 , H04R31/00 , B81B3/00 , B81C1/00
Abstract: The present invention provides a method for manufacturing a fully wafer-level-packaged MEMS microphone and a microphone manufactured with the same, the method comprises: separately manufacturing a first packaging wafer, an MEMS microphone wafer and a second packaging wafer; performing wafer-to-wafer bonding for the three wafers to form a plurality of fully wafer-level-packaged MEMS microphone units; singulating the fully wafer-level-packaged MEMS microphone units to form a plurality of fully wafer-level-packaged MEMS microphones, which are fully packaged at wafer level and do not need any further process after die singulation. The method can improve cost-effectiveness, performance consistency, manufacturability, quality, scaling capability of the packaged MEMS microphone.
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公开(公告)号：US20190096859A1
公开(公告)日：2019-03-28
申请号：US15986812
申请日：2018-05-23
Applicant: Goertek, Inc.
Inventor： Quanbo Zou
IPC: H01L25/075 , H01L33/62 , H01L33/00
CPC classification number: H01L25/0753 , H01L33/007 , H01L33/0079 , H01L33/0095 , H01L33/32 , H01L33/62 , H01L2933/0066
Abstract: A micro-LED transfer method, manufacturing method and display device are disclosed. The method comprises: coating conductive photoresist on a receiving substrate, wherein the conductive photoresist is positive-tone photoresist; bonding a carrier substrate with the receiving substrate via the conductive photoresist, wherein metal electrodes of micro-LEDs on the carrier substrate are aligned with electrodes on the receiving substrate and are bonded with the electrodes on the receiving substrate via the conductive photoresist, and the carrier substrate is a transparent substrate; selectively lifting-off micro-LEDs from the carrier substrate through laser lifting-off using a first laser; and separating the carrier substrate from the receiving substrate.
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