中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

9 records (took 0.031 seconds)

    Micro-LED display device and a manufacturing method thereof
    1.
    发明授权
    Micro-LED display device and a manufacturing method thereof 有权

    公开(公告)号：US11581291B2

    公开(公告)日：2023-02-14

    申请号：US16643307

    申请日：2017-07-24

    Applicant: GOERTEK INC.

    Inventor： Peixuan Chen ,  Quanbo Zou ,  Xiangxu Feng ,  Tao Gan ,  Xiaoyang Zhang

    IPC: H01L25/075 ,  H01L33/00 ,  G09F9/33 ,  H01L21/683 ,  H01L21/78 ,  H01L33/48

    Abstract: A micro-LED display device and a manufacturing method thereof are disclosed. The method comprises: forming micro-LEDs (202) on a carrier substrate (201), wherein the carrier substrate (201) is transparent for a laser which is used in laser lifting-off; filling trenches between the micro-LEDs (202) on the carrier substrate (201) with a holding material (209); performing a laser lifting-off on selected ones of the micro-LEDs (202) to lift off them from the carrier substrate (201), wherein the selected micro-LEDs (202) are held on the carrier substrate (201) through the holding material (209); bonding the selected micro-LEDs (202) onto a receiving substrate (207) of the micro-LED display device; separating the selected micro-LEDs (202) from the carrier substrate (201) to transfer them to the receiving substrate (207).

    Method of transferring micro-LEDs from a gallium arsenide substrate
    3.
    发明授权
    Method of transferring micro-LEDs from a gallium arsenide substrate 有权

    公开(公告)号：US11107946B2

    公开(公告)日：2021-08-31

    申请号：US16088564

    申请日：2017-12-19

    Applicant: Goertek Inc.

    Inventor： Xiangxu Feng ,  Peixuan Chen ,  Quanbo Zou

    IPC: H01L21/00 ,  H01L33/00 ,  H01L33/62

    Abstract: The present disclosure discloses a micro-LED transfer method, a manufacturing method, device and an electronic apparatus. The transfer method comprises: in accordance with a sequence of micro-LEDs of blue, green and red, epitaxially growing micro-LEDs of two or all of the three colors on a single GaAs original substrate; epitaxially growing bumping electrodes corresponding to the micro-LEDs on a receiving substrate; bonding the micro-LEDs of the two or all of the three colors with the bumping electrodes on the receiving substrate; and removing the GaAs original substrate. The method can be used to transfer micro-LEDs of a variety of colors, in order to improve the production efficiency.

    Projection module and electronics apparatus
    6.
    发明授权
    Projection module and electronics apparatus 有权

    公开(公告)号：US11099466B2

    公开(公告)日：2021-08-24

    申请号：US16475758

    申请日：2017-01-09

    Applicant: GOERTEK. INC

    Inventor： Peixuan Chen ,  Quanbo Zou ,  Xiangxu Feng

    IPC: G03B21/20 ,  H04N9/31 ,  G03B21/00

    Abstract: A projection module and an electronics apparatus are provided. The projection module comprises: a projection chip, having micro semiconductor light emitting devices thereon; and a projection lens unit, wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface.

    Micro-LED transfer method, manufacturing method and device
    9.
    发明授权
    Micro-LED transfer method, manufacturing method and device 有权

    公开(公告)号：US10896927B2

    公开(公告)日：2021-01-19

    申请号：US16320019

    申请日：2016-08-22

    Applicant: GOERTEK INC.

    Inventor： Quanbo Zou ,  Peixuan Chen ,  Xiangxu Feng

    IPC: H01L27/15 ,  H01L33/62 ,  H01L33/60 ,  H01L33/00 ,  H01L25/075

    Abstract: A micro-LED transfer method, manufacturing method and device are provided. The micro-LED transfer method comprises: obtaining a laser-transparent carrier substrate having a first surface and a second surface with micro-LEDs; forming a protection layer on at least one of the first surface and the second surface and a third surface of a receiving substrate, wherein the third surface is to receive the micro-LEDs to be transferred via pads; bringing the micro-LEDs to be transferred into contact with the pads on the third surface; and irradiating the micro-LEDs to be transferred with laser from the first surface to lift-off the micro-LEDs to be transferred from the carrier substrate wherein the protection layer configured to protect the third surface from the irradiation of the laser.

Patent Agency Ranking