公开(公告)号：US20240286226A1

公开(公告)日：2024-08-29

申请号：US18572631

申请日：2022-06-28

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO

IPC: B23K26/57 ,  B23K26/06 ,  B23K26/08 ,  B23K101/40

CPC classification number: B23K26/57 ,  B23K26/0648 ,  B23K26/08 ,  B23K2101/40

Abstract: Provided is a laser processing apparatus including: a support unit that supports an object; a light source that outputs laser light; a spatial light modulator that modulates the laser light output from the light source in correspondence with a modulation pattern and outputs the modulated laser light; a converging lens that converges the laser light output from the spatial light modulator toward the object, and forms a converging spot of the laser light in the object; a movement unit that relatively moves the converging spot with respect to the object; and a control unit that controls at least the light source, the spatial light modulator, and the movement unit. The modulation pattern is controlled so that a beam shape of the converging spot becomes an inclined shape on at least the first surface side in relation to the center of the converging spot.

公开(公告)号：US20240181560A1

公开(公告)日：2024-06-06

申请号：US18285520

申请日：2022-03-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO

IPC: B23K26/0622 ,  B23K26/38

CPC classification number: B23K26/0622 ,  B23K26/38

Abstract: A laser machining method performed by a laser machining device includes: a first step of flattening an irradiation surface through laser annealing by irradiating a surface or a back surface of an object with a laser beam, the object including a functional element layer on a surface side; and a second step of forming a modified layer inside the object by irradiating the irradiation surface, which is flattened in the first step, with a laser beam. A pulse pitch of the laser beam is shorter than a pulse pitch of the laser beam.

公开(公告)号：US20240051067A1

公开(公告)日：2024-02-15

申请号：US18266842

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/351 ,  B23K26/064 ,  B23K26/04

CPC classification number: B23K26/351 ,  B23K26/064 ,  B23K26/048

Abstract: A laser processing method includes: a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street; and a second step of, after the first step, irradiating the street with laser light based on information regarding the street such that a surface layer of the street is removed in a first region of the street and the surface layer remains in a second region of the street. The information regarding the street includes information indicating that, when a modified region is formed in the wafer along a line passing through the street, a fracture extending from the modified region does not reach the street along the line in the first region, and reaches the street along the line in the second region.

公开(公告)号：US20230335421A1

公开(公告)日：2023-10-19

申请号：US17908288

申请日：2021-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Iku SANO

IPC: H01L21/67 ,  G01N21/95 ,  B23K26/03 ,  B23K26/53

CPC classification number: H01L21/67253 ,  G01N21/9501 ,  B23K26/032 ,  B23K26/53 ,  H01L21/67092 ,  B23K2103/56

Abstract: An inspection device includes a laser irradiation unit irradiating a wafer with laser light, a display displaying information, and a control unit. The control unit is constituted to execute deriving of an estimated processing result including information a modified region and a crack extending from the modified region formed on the wafer when the wafer is irradiated with the laser light by the laser irradiation unit on the basis of set recipes (processing conditions), and controlling the display so as to display an estimated processing result image depicting both a graphic image of the wafer and a graphic image of the modified region and the crack in the wafer in consideration of positions of the modified region and the crack in the wafer derived as the estimated processing result.

公开(公告)号：US20220331909A1

公开(公告)日：2022-10-20

申请号：US17642998

申请日：2020-09-16

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Iku SANO ,  Takeshi SAKAMOTO

IPC: B23K26/53 ,  B23K26/03

Abstract: A laser processing device includes a stage; a laser irradiation unit configured to irradiate the wafer with laser light; an image capturing unit configured to detect light propagated through a semiconductor substrate; and a control portion configured to execute controlling the laser irradiation unit such that one or a plurality of modified regions are formed inside the semiconductor substrate when the wafer is irradiated with the laser light, deriving a position of a tip of an upper crack on a rear surface side, which is a crack extending from the modified region to the rear surface side of the semiconductor substrate, on the basis of a signal output from the image capturing unit having detected the light, and determining whether or not a crack reaching state has been realized on the basis of the position of the tip of the upper crack on the rear surface side.

公开(公告)号：US20220331908A1

公开(公告)日：2022-10-20

申请号：US17642990

申请日：2020-09-16

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Iku SANO ,  Takeshi SAKAMOTO

IPC: B23K26/53 ,  B23K26/03

Abstract: A laser processing device includes a stage; a laser irradiation unit; an image capturing unit; a control portion configured to execute controlling the laser irradiation unit such that one or a plurality of modified regions are formed inside the semiconductor substrate when the wafer is irradiated with the laser light, determining whether or not a crack extending from the modified region is in a crack reaching state where the crack has reached a front surface side of the semiconductor substrate on the basis of a signal output from the image capturing unit, and deriving information related to adjustment of irradiation conditions of the laser irradiation unit on the basis of determination results.

公开(公告)号：US20220331907A1

公开(公告)日：2022-10-20

申请号：US17641519

申请日：2020-09-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Takeshi SAKAMOTO

IPC: B23K26/53 ,  B23K26/067 ,  H01L21/67 ,  H01L21/268

Abstract: A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part. The controller controls the spatial light modulator so that a converging point of the 0th-order light in the Z direction is located on an opposite side of a converging point of non-modulated light of the laser light with respect to an ideal converging point of the 0th-order light.

公开(公告)号：US20220009038A1

公开(公告)日：2022-01-13

申请号：US17288620

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/53 ,  B23K26/08 ,  B23K26/04 ,  B23K26/06

Abstract: A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.

公开(公告)号：US20220005737A1

公开(公告)日：2022-01-06

申请号：US17281458

申请日：2019-10-02

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yasutaka SUZUKI ,  Iku SANO

IPC: H01L21/66 ,  H01L21/268

Abstract: An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a front surface and the modified region closest to the front surface of the semiconductor substrate. The objective lens positions a virtual focus symmetrical with a focus with respect to the front surface in the inspection region. The light detection part detects light propagating from the back surface side of the semiconductor substrate to the back surface side via the front surface.

公开(公告)号：US20210398855A1

公开(公告)日：2021-12-23

申请号：US17281505

申请日：2019-10-02

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yasutaka SUZUKI ,  Iku SANO

IPC: H01L21/78 ,  H01L21/66 ,  B23K26/53 ,  B23K26/00 ,  B23K26/03

Abstract: An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect a tip position of a fracture in an inspection region between a back surface and the modified region closest to the back surface of the semiconductor substrate. The objective lens aligns a focus from the back surface side in an inspection region. The light detection part detects light propagating from the front surface side of the semiconductor substrate to the back surface side.