公开(公告)号：US20060046347A1

公开(公告)日：2006-03-02

申请号：US10934109

申请日：2004-09-02

申请人： Alan Wood ,  Warren Farnworth ,  Charles Watkins ,  Peter Benson

发明人： Alan Wood ,  Warren Farnworth ,  Charles Watkins ,  Peter Benson

IPC分类号： H01L21/50

CPC分类号： H01L27/14685 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/56 ,  H01L23/3128 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/12041

摘要： A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Method of forming conductive elements such as traces, vias, and bond pads are also disclosed. More specifically, forming at least one organometallic layer to a substrate surface and selectively heating at least a portion thereof is disclosed. Also, forming a layer of conductive photopolymer over at least a portion of a surface of a substrate and removing at least a portion thereof is disclosed. A microlens having a plurality of mutually adhered layers of cured, optically transmissive material, methods of forming same, and systems so equipped are disclosed.

摘要翻译： 公开了一种封装半导体管芯或裸片的至少一部分的方法。 未固化的材料可以设置在至少一个半导体管芯的至少外围附近并且基本上整体上至少部分地固化。 还公开了形成导电元件如痕迹，通路和接合焊盘的方法。 更具体地，公开了至少一个有机金属层到基底表面并选择性地加热其至少一部分。 此外，公开了在衬底的表面的至少一部分上形成导电光聚合物层并且去除其至少一部分。 公开了一种具有多个相互粘合的固化的光透射材料层的微透镜，其形成方法以及如此装备的系统。

公开(公告)号：US20060043509A1

公开(公告)日：2006-03-02

申请号：US10925502

申请日：2004-08-24

申请人： Charles Watkins ,  David Hembree ,  Peter Benson ,  Salman Akram

发明人： Charles Watkins ,  David Hembree ,  Peter Benson ,  Salman Akram

IPC分类号： H01L21/00 ,  H01L27/14 ,  H01L31/0232

CPC分类号： H01L27/14625 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit. The imaging device further includes a cover over the image sensor and a plurality of interconnects in and/or on the cover that are electrically coupled to corresponding bond-pads of the die. The interconnects provide external electrical contacts for the bond-pads of the die. The interconnects can extend through the cover or along a surface of the cover.

公开(公告)号：US20060008739A1

公开(公告)日：2006-01-12

申请号：US11216938

申请日：2005-08-31

申请人： Alan Wood ,  Warren Farnworth ,  David Hembree ,  Sidney Rigg ,  William Hiatt ,  Peter Benson ,  Kyle Kirby ,  Salman Akram

发明人： Alan Wood ,  Warren Farnworth ,  David Hembree ,  Sidney Rigg ,  William Hiatt ,  Peter Benson ,  Kyle Kirby ,  Salman Akram

IPC分类号： G03C1/00

CPC分类号： G03F7/0037 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  G03F7/0047

摘要： Materials for use in programmed material consolidation processes, such as stereolithography, include a selectively consolidatable material and a filler. The filler may be included to optimize one or more physical properties of the material. The material is both selectively consolidatable and includes the desired physical property. Examples of physical properties that may optimized in a selectively consolidatable compound by mixing a filler material with a selectively consolidatable material include, without limitation, coefficient of thermal expansion, rigidity, fracture toughness, thermal stability, and strength.

摘要翻译： 用于程序化材料固结方法（例如立体光刻）的材料包括可选择的可固结材料和填料。 可以包括填料以优化材料的一种或多种物理性质。 该材料既可选择性地整合，并且包括所需的物理性质。 通过将填充材料与可选择性地可固结的材料混合可以在可选择地可固化的化合物中优化的物理性质的实例包括但不限于热膨胀系数，刚性，断裂韧性，热稳定性和强度。

公开(公告)号：US20060003255A1

公开(公告)日：2006-01-05

申请号：US11216599

申请日：2005-08-31

申请人： Alan Wood ,  Warren Farnworth ,  David Hembree ,  Sidney Rigg ,  William Hiatt ,  Peter Benson ,  Kyle Kirby ,  Salman Akram

发明人： Alan Wood ,  Warren Farnworth ,  David Hembree ,  Sidney Rigg ,  William Hiatt ,  Peter Benson ,  Kyle Kirby ,  Salman Akram

IPC分类号： G03C1/492

CPC分类号： G03F7/0037 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  G03F7/0047

摘要： Methods for optimizing physical properties of selectively consolidatable materials, such as photoimageable materials, include mixing filler materials with the selectively consolidatable materials. The resulting compound has the desired physical property, as well as selective consolidatability. Examples of physical properties that may optimized in a selectively consolidatable compound by mixing a filler material with a selectively consolidatable material include, without limitation, coefficient of thermal expansion, rigidity, fracture toughness, thermal stability, and strength.

摘要翻译： 用于优化选择性可固结材料（例如可光成像材料）的物理性质的方法包括将填料与可选择的可固结材料混合。 所得化合物具有所需的物理性质以及选择性的可固化性。 通过将填充材料与可选择性地可固结的材料混合可以在可选择地可固化的化合物中优化的物理性质的实例包括但不限于热膨胀系数，刚性，断裂韧性，热稳定性和强度。

公开(公告)号：US20060001139A1

公开(公告)日：2006-01-05

申请号：US11216617

申请日：2005-08-31

申请人： Alan Wood ,  Warren Farnworth ,  David Hembree ,  Sidney Rigg ,  William Hiatt ,  Peter Benson ,  Kyle Kirby ,  Salman Akram

发明人： Alan Wood ,  Warren Farnworth ,  David Hembree ,  Sidney Rigg ,  William Hiatt ,  Peter Benson ,  Kyle Kirby ,  Salman Akram

IPC分类号： H01L23/02

CPC分类号： G03F7/0037 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  G03F7/0047

摘要： A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface.

摘要翻译： 在半导体衬底的薄化或后研磨以及后稀化处理期间与半导体衬底一起使用的支撑结构包括基本上沿半导体衬底的外周延伸并且围绕半导体衬底的外周延伸的部分，以使薄化半导体 基板具有刚性。 支撑结构可以被配置为环或作为基本上覆盖半导体衬底的有源表面并且在由有源表面承载的每个半导体器件上形成保护结构的构件。

公开(公告)号：US20050275750A1

公开(公告)日：2005-12-15

申请号：US10863994

申请日：2004-06-09

申请人： Salman Akram ,  Peter Benson ,  Warren Farnworth ,  William Hiatt

发明人： Salman Akram ,  Peter Benson ,  Warren Farnworth ,  William Hiatt

IPC分类号： H01L27/146 ,  H01L31/0232 ,  H04N5/225 ,  H04N9/64

CPC分类号： H04N5/2253 ,  H01L27/14609 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L31/02325 ,  H01L2224/48091 ,  H04N5/2254 ,  H01L2924/00014

摘要： The following disclosure describes several embodiments of (1) methods for wafer-level packaging of microelectronic imagers, (2) methods of forming electrically conductive interconnects in microelectronic imagers, (3) methods for forming optical devices for microelectronic imagers, and (4) microelectronic imagers that have been packaged using wafer-level packaging processes. Wafer-level packaging of microelectronic imagers is expected to significantly enhance the efficiency of manufacturing microelectronic imagers because a plurality of imagers can be packaged simultaneously using highly accurate and efficient processes developed for packaging semiconductor devices. Moreover, wafer-level packaging of microelectronic imagers is expected to enhance the quality and performance of such imagers because the semiconductor fabrication processes can reliably align an optical device with an image sensor and space the optical device apart from the image sensor by a desired distance with a higher degree of precision.

摘要翻译： 以下公开内容描述了（1）用于微电子成像器的晶片级封装的方法的几个实施例，（2）在微电子成像器中形成导电互连的方法，（3）用于形成微电子成像器的光学器件的方法，以及（4）微电子 使用晶圆级封装工艺封装的成像仪。 预期微电子成像器的晶片级封装将显着提高制造微电子成像器的效率，因为可以使用开发用于封装半导体器件的高精度和有效的工艺同时封装多个成像器。 此外，微电子成像器的晶片级封装有望提高这种成像器的质量和性能，因为半导体制造工艺可以可靠地将光学器件与图像传感器对准，并将光学器件与图像传感器分开，并将其与图像传感器隔开期望的距离， 更高的精度。

公开(公告)号：US20050254133A1

公开(公告)日：2005-11-17

申请号：US10845303

申请日：2004-05-13

申请人： Salman Akram ,  Peter Benson

发明人： Salman Akram ,  Peter Benson

IPC分类号： G02B3/00 ,  G02B7/02 ,  G02B13/00 ,  G02B27/10 ,  H01L27/146 ,  H01L31/0232 ,  H04N5/225

CPC分类号： G02B13/0085 ,  G02B3/0012 ,  G02B3/0056 ,  G02B7/02 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2924/15174 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014

摘要： Microelectronic imagers, optical devices for microelectronic imagers, methods for manufacturing integrated optical devices for use with microelectronic imagers, and methods for packaging microelectronic imagers. The optical devices are manufactured in optical device assemblies that provide efficient and highly accurate fabrication of the optics that are used in microelectronic imagers. The optical device assemblies are particularly useful for packaging a plurality of microelectronic imagers at the wafer level. Wafer-level packaging is expected to significantly enhance the efficiency of manufacturing microelectronic imagers because a plurality of imagers can be packaged simultaneously using highly accurate and efficient processes developed for packaging processors, memory devices and other semiconductor devices.

摘要翻译： 微电子成像器，用于微电子成像器的光学器件，用于制造用于微电子成像器的集成光学器件的方法，以及用于封装微电子成像器的方法。 光学器件在光学器件组件中制造，其提供用于微电子成像器的光学器件的有效且高精度的制造。 光学器件组件特别适用于在晶片级封装多个微电子成像器。 预期晶圆级封装将显着提高制造微电子成像器的效率，因为可以使用为封装处理器，存储器件和其它半导体器件开发的高精度和有效的工艺来同时封装多个成像器。

公开(公告)号：US20050116179A1

公开(公告)日：2005-06-02

申请号：US10869237

申请日：2004-06-16

申请人： Francis Aguirre ,  Michele Craton ,  Jack Lai ,  David Phillips ,  Peter Benson ,  Dave Hofeldt

发明人： Francis Aguirre ,  Michele Craton ,  Jack Lai ,  David Phillips ,  Peter Benson ,  Dave Hofeldt

IPC分类号： A61C13/15 ,  A61C19/00 ,  F21K99/00 ,  G02B6/06 ,  G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4249 ,  A61C19/003 ,  A61C19/004 ,  F21K9/69 ,  F21V29/80 ,  G02B6/06 ,  G02B6/4201 ,  G02B6/4206 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4269 ,  G02B6/4298

摘要： A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.

摘要翻译： 辐射修改装置包括多个固态辐射源，以产生修改第一材料的辐射，例如通过固化或通过极化产生对准。 固态辐射源可以以阵列图案布置。 以相应的阵列图案布置的光学聚光器接收来自相应固态辐射源的辐射。 集中辐射由多个光波导接收，光波导也以相应的阵列图形排列。 每个光波导包括用于接收辐射的第一端和用于输出辐射的第二端。 辐射修改设备可以用于连续的基片，片，片部分，点固化和/或3D辐射固化过程。

公开(公告)号：US20050116178A1

公开(公告)日：2005-06-02

申请号：US10869236

申请日：2004-06-16

申请人： Francis Aguirre ,  Peter Benson ,  Michele Craton ,  David Hofeldt ,  Jack Lai ,  David Phillips

发明人： Francis Aguirre ,  Peter Benson ,  Michele Craton ,  David Hofeldt ,  Jack Lai ,  David Phillips

IPC分类号： A61C13/15 ,  A61C19/00 ,  F21K99/00 ,  G02B6/06 ,  G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4249 ,  A61C19/003 ,  A61C19/004 ,  F21K9/69 ,  F21V29/80 ,  G02B6/06 ,  G02B6/4201 ,  G02B6/4206 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4269 ,  G02B6/4298

摘要： A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.

公开(公告)号：US20050116176A1

公开(公告)日：2005-06-02

申请号：US10726257

申请日：2003-12-02

申请人： Francis Aguirre ,  Michele Craton ,  Jack Lai ,  David Phillips ,  Peter Benson ,  Gordon Henson ,  Michael Meis

发明人： Francis Aguirre ,  Michele Craton ,  Jack Lai ,  David Phillips ,  Peter Benson ,  Gordon Henson ,  Michael Meis

IPC分类号： A61C13/15 ,  A61C19/00 ,  F21K99/00 ,  G02B6/06 ,  G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4249 ,  A61C19/003 ,  A61C19/004 ,  F21K9/69 ,  F21V29/80 ,  G02B6/06 ,  G02B6/4201 ,  G02B6/4206 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4269 ,  G02B6/4298

摘要： A radiation curing apparatus comprises a plurality of solid state radiation sources to generate radiation that cures a first material. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The curing apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.

摘要翻译： 辐射固化装置包括多个固态辐射源，以产生固化第一材料的辐射。 固态辐射源可以以阵列图案布置。 以相应的阵列图案布置的光学聚光器接收来自相应固态辐射源的辐射。 集中辐射由多个光波导接收，光波导也以相应的阵列图形排列。 每个光波导包括用于接收辐射的第一端和用于输出辐射的第二端。 固化装置可以用于连续的基材，片，片部分，点固化和/或3D辐射固化过程。