摘要:
A perpendicular magnetic head including a media heating element that is fabricated within the magnetic head structure. The heating element is preferably fabricated above the first magnetic pole layer close to the ABS surface of the head. In one embodiment, following the fabrication of the heating element, a second magnetic pole probe layer that includes the second magnetic pole tip is fabricated. In an alternative head embodiment, a second magnetic pole shaping layer is fabricated upon the heating element, followed by the fabrication of the probe layer that includes the second magnetic pole tip. The heating element is an electrically resistive heating element that is preferably comprised of NiCr or NiFe.
摘要:
A magnetic head including a media heating device that is fabricated within the magnetic head structure. The media heating device includes an electrically resistive element that is fabricated above the first magnetic pole layer close to the ABS surface of the head. A P1 pole pedestal is fabricated above the heating element. Electrical insulation layers are fabricated beneath and above the heating element to prevent electrical shorting to the P1 pole layer and the P1 pole pedestal that are disposed beneath and above the heating element, respectively.
摘要:
A method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure. The method uses an aligned process where the base plate imprint is fabricated on an electrically insulating layer and the reversed image is fabricated and etched into the coil insulation material, e.g., hard bake photoresist to alleviate the problems associated with complete ion removal of the seed layer between high aspect ratio coils. The method would also not be prone to plating non-uniformities (voids), and would not be subject to seed layer undercutting in a wet etch step process.
摘要:
Following the deposition of an insulation layer, a patterned P2 pole tip seed layer is deposited. Significantly, the pole tip seed layer is not deposited beneath the induction coil area of the magnetic head. A dielectric layer is next deposited and a patterned RIE etching mask that includes both a P2 pole tip trench opening and an induction coil trench opening is fabricated upon the dielectric layer. Thereafter, in a single RIE etching step, the P2 pole tip trench is etched through the dielectric material down to the seed layer, and the induction coil trench is etched through the dielectric material down to the insulation layer. The P2 pole tip is first electroplated up into its trench, an induction coil seed layer is next deposited, and the induction coil is then electroplated up into the induction coil trench.
摘要:
A magnetic head is made of a shield layer having first and second recesses defined in first and second end regions which surround a central region. Bias and lead layers are formed in the first and the second recesses, and a read sensor is formed in the central region. Advantageously, edges of the bias and lead layers are formed below edges of the read sensor to thereby define a magnetic track width of the read sensor. Also, the sensor profile is substantially flat so that a gap layer over the read sensor can provide for adequate insulation.
摘要:
A method of making a magnetic read/write head using a single lithographic step to define both a write coil and a pole tip structure. The use of a thin image resist layer over a hard reactive-ion etch mask and image transfer techniques allows very high resolution optical lithography which can accommodate formation of a very compact coil and pole structure. The use of a single high resolution lithography step on a planarized structure to define both a write pole tip and a write coil coplanar with the write pole tip avoids the problems of reflective notching associated with lithography to define the pole tip in the vicinity of non-planar features of the coil structure and also eliminates alignment inaccuracies inherent in separate lithography processes for the coil and pole.
摘要:
First and second portions of a first shield layer on each side of a planar shield portion below a read sensor are recessed for receiving first and second insulative prefill layers which minimize electrical shorting between first and second hard bias layers and first and second lead layers to the first shield layer. The first and second prefill layers are close to first and second side edges of the read sensor so as to minimize shorting between the layers. By varying the depth of the first and second recesses in the first shield layer the first read gap layer or the second read gap layer can be planarized or, alternatively, each of the first and second read gap layers can be partially planarized, as desired.
摘要:
A read/write head is provided with an embedded planar dual coil write structure. The head includes generally parallel shield, shield/pole, and pole layers. The shield/pole layer abuts a generally coplanar planarization layer in one embodiment. A circuitous recess is defined in the shield/pole and planarization layer, spanning the junction twice and encircling a central hub of adjoining shield/pole and planarization layer material. A write structure is located in the recess, with the shield/pole layer, planarization layer, and embedded write structure forming a substantially flat surface for building the pole layer. The write structure includes first and second substantially co-planar multi-turn flat coils, where turns of the first write coil are interspersed with turns of the second write coil. The first and second write coils reside in the circuitous recess, winding around the central hub. An insulating material separates the first and second coils.
摘要:
A read/write head is provided with an embedded planar dual coil write structure. The head includes generally parallel shield, shield/pole, and pole layers. The shield/pole layer abuts a generally coplanar planarization layer in one embodiment. A circuitous recess is defined in the shield/pole and planarization layer, spanning the junction twice and encircling a central hub of adjoining shield/pole and planarization layer material. A write structure is located in the recess, with the shield/pole layer, planarization layer, and embedded write structure forming a substantially flat surface for building the pole layer. The write structure includes first and second substantially co-planar multi-turn flat coils, where turns of the first write coil are interspersed with turns of the second write coil. The first and second write coils reside in the circuitous recess, winding around the central hub. An insulating material separates the first and second coils.
摘要:
An MR read head has first and second lead layers protected by first, second and third insulation layers in addition to the first and second insulative gap layers substantially all the way from the side edges of an MR sensor to terminals. The first and second insulation layers do not extend outside of the first and second lead layer sites so that greater heat dissipation can be realized from the MR sensor. Each lead layer comprises first and second lead layer films. Where these films overlap for electrical connection their top and bottom surfaces are protected by the first and second insulation layers and their edges are protected by the third insulation layer. Where the first lead layer film extends from the second lead layer film toward the respective terminal its bottom surface is protected by the first insulation layer and its top surface and its side edges are protected by the third insulation layer. Only three masks are required for fabricating or constructing these components. The first liftoff mask is employed for defining the first insulation layer and the first lead layer film. The second liftoff mask is employed for depositing the second lead layer film on the first lead layer film with an end of the second lead layer film for defining the track width of the MR sensor and making a contiguous junction with a respective side edge of the MR sensor and then depositing a second insulation layer on the second lead layer film. A third liftoff mask is employed for masking the MR sensor site and the second lead layer film of the first and second lead layers so that the height of the MR sensor can be defined and the third insulation layer deposited.