公开(公告)号：US20250076123A1

公开(公告)日：2025-03-06

申请号：US18794273

申请日：2024-08-05

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  I-An YAO

IPC: G01J5/02 ,  G01J5/0801 ,  G01J5/20 ,  G01J5/58

Abstract: A sensing device is provided, which comprises: a substrate; a circuit layer disposed on the substrate, the circuit layer comprising a switch element; a reflector disposed on the circuit layer, the reflector comprising a first reflection part and a second reflection part separated from each other, wherein the first reflection part is electrically connected to the switch element, and the second reflection part receives a voltage; and a sensing element disposed on the reflector, the sensing element separated from the reflector by a gap, wherein the sensing element comprises a first absorbing part, a second absorbing part and a sensing part disposed on the first absorbing part and the second absorbing part; wherein in a normal direction of the sensing device, the first absorbing part and the second reflection part are not overlapped, and the second absorbing part and the first reflection part are not overlapped.

公开(公告)号：US20240361183A1

公开(公告)日：2024-10-31

申请号：US18619784

申请日：2024-03-28

Applicant: InnoLux Corporation

Inventor： I-An YAO ,  Yu-Tsung LIU

IPC: G01J5/0806

CPC classification number: G01J5/0806

Abstract: A sensing device includes: a first substrate; a plurality of sensing units disposed on the first substrate, wherein the plurality of sensing units are used for sensing light with wavelengths within a wavelength range; and a second substrate disposed opposite to the first substrate and assembled to the first substrate, wherein the second substrate has an overlapping area overlapping with the plurality of sensing units in a normal direction of the first substrate, wherein the second substrate has an optical lens in the overlapping area, the optical lens includes a plurality of micro-structures, and a pitch between the plurality of micro-structures is less than or equal to a maximum wavelength value of the wavelength range.

公开(公告)号：US20240313027A1

公开(公告)日：2024-09-19

申请号：US18676702

申请日：2024-05-29

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  Te-Yu LEE

IPC: H01L27/146 ,  G06F3/041 ,  G06F3/042 ,  G06V40/13

CPC classification number: H01L27/14634 ,  G06F3/04164 ,  G06F3/0421 ,  G06V40/1318 ,  H01L27/14636 ,  H01L27/14678

Abstract: A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. The wavelength of light penetrating the first substrate is greater than or equal to 4 μm and less than or equal to 10 μm. An electronic device including the sensing device is also provided.

公开(公告)号：US20240255351A1

公开(公告)日：2024-08-01

申请号：US18410338

申请日：2024-01-11

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  I-An YAO

IPC: G01J3/28 ,  H10N19/00

CPC classification number: G01J3/2803 ,  H10N19/00

Abstract: The present disclosure provides a sensing device and a method for manufacturing the same. The method for manufacturing the sensing device includes the following steps: providing a first temporary substrate, wherein the first temporary substrate includes: a first carrier; a first substrate disposed on the first carrier; and a plurality of sensing elements disposed on the first substrate; providing a second temporary substrate, wherein the second temporary substrate includes: a second carrier; and a second substrate disposed on the second carrier; assembling the first temporary substrate and the second temporary substrate to bond the first substrate and the second substrate; removing the first carrier and disposing the first substrate on a supporting film; and removing the second carrier, wherein the first substrate and the second substrate are respectively a flexible substrate.

公开(公告)号：US20230314232A1

公开(公告)日：2023-10-05

申请号：US18110364

申请日：2023-02-15

Applicant: InnoLux Corporation

Inventor： Chin-Lung TING ,  Te-Yu LEE ,  Yu-Tsung LIU

IPC: G01J5/20 ,  G01J5/08

CPC classification number: G01J5/20 ,  G01J5/0853 ,  G01J2005/103

Abstract: The present disclosure provides a sensing device including a substrate and a sensing pixel. The sensing pixel is disposed on the substrate and includes an electrode and a thermistor. The thermistor is electrically connected to the electrode and is separated from the substrate by an air gap. When the sensing pixel is operated in a period, the electrode receives a voltage, and a part of the thermistor moves toward the substrate, such that the thermistor is in thermal conduction with the substrate.

公开(公告)号：US20230098767A1

公开(公告)日：2023-03-30

申请号：US17896099

申请日：2022-08-26

Applicant: InnoLux Corporation

Inventor： Wei-Lin WAN ,  Yu-Tsung LIU ,  Te-Yu LEE

IPC: G01J1/04 ,  H01L27/144 ,  G01J1/42

Abstract: An optical sensing device includes a substrate; a light-sensing element disposed on the substrate; a light-shielding layer disposed on the light-sensing element, including a first opening overlapping the light-sensing element; an insulating layer disposed on the light-shielding layer, including a second opening overlapping the first opening; a light-shielding element disposed on a hole wall of the second opening; and a light-collecting element disposed on the insulating layer and overlapping the second opening.

公开(公告)号：US20220399389A1

公开(公告)日：2022-12-15

申请号：US17740545

申请日：2022-05-10

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  Te-Yu LEE

IPC: H01L27/146 ,  G06F3/042 ,  G06V40/13 ,  G06F3/041

Abstract: A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. An electronic device including the sensing device is also provided.

公开(公告)号：US20220216351A1

公开(公告)日：2022-07-07

申请号：US17545184

申请日：2021-12-08

Applicant: InnoLux Corporation

Inventor： Wei-Lin WAN ,  Yu-Tsung LIU ,  Ming-Chih CHEN ,  Te-Yu LEE

IPC: H01L31/0216 ,  H01L31/18

Abstract: A method for manufacturing a sensing device is provided. The method includes: providing a substrate; forming a sensing unit on the substrate; forming a first light-shielding layer on the sensing unit; forming a first anti-reflection layer on the sensing unit; and patterning the first light-shielding layer and the first anti-reflection layer using a single lithography process to form a first pinhole corresponding to the sensing unit.

公开(公告)号：US20170059908A1

公开(公告)日：2017-03-02

申请号：US15246252

申请日：2016-08-24

Applicant: InnoLux Corporation

Inventor： Chung-Wen YEN ,  Yu-Tsung LIU ,  Chao-Hsiang WANG ,  Te-Yu LEE

IPC: G02F1/1368 ,  G02F1/1362 ,  G02F1/1333 ,  H01L27/12

Abstract: The display device includes a first substrate; an active layer disposed on the first substrate; a first insulation layer disposed on the active layer; a first electrode layer disposed on the first insulation layer including a gate electrode line extending along a first direction and a protruding portion extending along a second direction; a second insulation layer disposed on the first electrode layer; and a second electrode layer disposed on the second insulation layer. The second electrode layer includes a date line extending along the second direction and a conductive layer. The conductive layer includes a first conductive portion and a second conductive portion, wherein the first conductive portion has a first maximum width A along the first direction, and the second conductive portion has a second maximum width B along the first direction. The first maximum width A is less than the second maximum width B.

Abstract translation: 显示装置包括第一基板; 设置在所述第一基板上的有源层; 设置在所述有源层上的第一绝缘层; 设置在第一绝缘层上的第一电极层包括沿着第一方向延伸的栅电极线和沿第二方向延伸的突出部分; 设置在第一电极层上的第二绝缘层; 以及设置在第二绝缘层上的第二电极层。 第二电极层包括沿着第二方向延伸的日期线和导电层。 导电层包括第一导电部分和第二导电部分，其中第一导电部分沿着第一方向具有第一最大宽度A，并且第二导电部分沿着第一方向具有第二最大宽度B. 第一最大宽度A小于第二最大宽度B.

公开(公告)号：US20160209690A1

公开(公告)日：2016-07-21

申请号：US14729315

申请日：2015-06-03

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  Kuan-Yu CHIU ,  Te-Yu LEE ,  Chao-Hsiang WANG

IPC: G02F1/1368 ,  H01L27/32 ,  G02F1/1362 ,  H01L51/00 ,  G02F1/1333 ,  H01L27/12 ,  H01L29/786

CPC classification number: G02F1/1368 ,  G02F1/136227 ,  H01L27/124 ,  H01L27/3248 ,  H01L27/3258 ,  H01L27/3276 ,  H01L29/78675 ,  H01L51/0096

Abstract: A display device includes an array substrate defined with a plurality of pixel structures arranged in an array. Each of the pixel structures includes a semiconductor layer disposed over a substrate and a first metal layer disposed over the substrate. The pixel structure includes a first insulating layer disposed over the semiconductor layer, having a first opening exposing a top surface of the semiconductor layer and a sidewall surface of the first insulating layer. The pixel structure includes a metal pad disposed over the first insulating layer, being formed over the top surface of the semiconductor layer and the sidewall surface of the first insulating layer through the first opening. The pixel structure includes a second insulating layer disposed over the metal pad and the first insulating layer, having a second opening exposing the metal pad over the sidewall surface of the first insulating layer.

Abstract translation: 显示装置包括以阵列排列的多个像素结构限定的阵列基板。 每个像素结构包括设置在衬底上的半导体层和设置在衬底上的第一金属层。 像素结构包括设置在半导体层上的第一绝缘层，具有暴露半导体层的顶表面的第一开口和第一绝缘层的侧壁表面。 像素结构包括设置在第一绝缘层上的金属焊盘，其通过第一开口形成在半导体层的顶表面和第一绝缘层的侧壁表面上。 像素结构包括设置在金属焊盘和第一绝缘层上的第二绝缘层，具有将金属焊盘覆盖在第一绝缘层的侧壁表面上的第二开口。