公开(公告)号：US20120267801A1

公开(公告)日：2012-10-25

申请号：US13536382

申请日：2012-06-28

申请人： Ki Youn Jang ,  Sungmin Song ,  JoHyun Bae

发明人： Ki Youn Jang ,  Sungmin Song ,  JoHyun Bae

IPC分类号： H01L23/28

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.

摘要翻译： 一种集成电路封装系统，包括：包括电触点的支撑结构; 在支撑结构上的焊料掩模，焊接掩模包括焊接掩模法兰，焊接掩模法兰直接在支撑结构的第一表面上; 在支撑结构上的集成电路; 以及封装在集成电路上并与焊盘法兰接触。 一种模具系统，其包括具有沿着第一模具底面的突起的第一模具，所述突起在第一腔和凹部之间。

公开(公告)号：US20090072375A1

公开(公告)日：2009-03-19

申请号：US11857188

申请日：2007-09-18

申请人： Sungmin Song ,  SeungYun Ahn ,  JoHyun Bae ,  Jong-Woo Ha

发明人： Sungmin Song ,  SeungYun Ahn ,  JoHyun Bae ,  Jong-Woo Ha

IPC分类号： H01L23/02

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system with multi-chip module is provided including: providing an upper substrate having an upper chip thereon; positioning a lower chip under the upper chip, the lower chip having bottom interconnects thereon; encapsulating the upper chip and the lower chip with a chip encapsulant on the upper substrate with the bottom interconnects exposed; mounting the lower chip over a lower substrate with a gap between the chip encapsulant and the lower substrate; and filling the gap with a package encapsulant or chip attach adhesive.

摘要翻译： 提供一种具有多芯片模块的集成电路封装系统，包括：提供其上具有上芯片的上基板; 将下芯片定位在上芯片下方，下芯片在其上具有底部互连; 将上芯片和下芯片用芯片密封剂封装在上基板上，底部互连暴露; 将下芯片安装在下基板上，并在芯片密封剂和下基板之间具有间隙; 并用封装密封剂或芯片附着粘合剂填充间隙。

公开(公告)号：US20080150119A1

公开(公告)日：2008-06-26

申请号：US11615919

申请日：2006-12-22

申请人： Ki Youn Jang ,  Sungmin Song ,  JoHyun Bae

发明人： Ki Youn Jang ,  Sungmin Song ,  JoHyun Bae

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging the first mold on the support structure with the first cavity over at least a portion of the integrated circuit and the projection and the recess between the at least a portion of the integrated circuit and the electrical contact; and injecting encapsulation material into the first cavity.

摘要翻译： 一种集成电路封装系统，包括：提供包括集成电路和与其相邻的电接触的支撑结构; 提供具有第一空腔的第一模具，其具有突起和用于收集闪光的凹部; 将所述第一模具与所述集成电路的至少一部分上的所述第一空腔与所述支撑结构上的所述第一模具接合，并且所述突起和所述集成电路的所述至少一部分与所述电触点之间的所述凹部; 以及将包封材料注入到所述第一腔中。