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公开(公告)号：US20080130000A1
公开(公告)日：2008-06-05
申请号：US11868911
申请日：2007-10-08
CPC分类号： G01B11/0683 , G01N21/55
摘要： Methods of subtracting the copper contribution to spectra obtained from a substrate during chemical mechanical polishing are described.
摘要翻译： 描述了在化学机械抛光期间减去从基板获得的光谱对铜的贡献的方法。
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42.发明授权公开(公告)号：US08977379B2
公开(公告)日：2015-03-10
申请号：US12938240
申请日：2010-11-02
IPC分类号： G06F19/00 , B24B37/04 , B24B37/013 , B24B37/20 , B24B49/12
CPC分类号： G05B19/418 , B24B37/013 , B24B37/042 , B24B37/205 , B24B49/12 , G05B2219/45232
摘要： In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译： 在一个方面，抛光方法包括抛光衬底，以及接收所选择的光谱特征的识别和所选择的光谱特征的特征以在抛光期间进行监测。 该方法包括测量在衬底被抛光时从衬底反射的光的光谱序列，其中序列的至少一些光谱由于在抛光期间被去除的材料而不同。 抛光方法包括确定光谱序列中的每个光谱的所选光谱特征的特征值，以产生特征值的序列，将功能拟合到值序列，以及确定抛光 端点或基于该功能的抛光速率的调整。
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公开(公告)号：US08751033B2
公开(公告)日：2014-06-10
申请号：US13090972
申请日：2011-04-20
IPC分类号： G06F19/00
CPC分类号： B24B49/12 , B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.
摘要翻译： 控制抛光的方法包括抛光衬底，用原位监测系统在抛光过程中监测衬底，从原位监测系统的测量产生一系列值，将非线性函数拟合到值序列， 确定非线性函数达到目标值的预计时间; 以及基于所述预计时间确定抛光终点或抛光速率的调整中的至少一个。
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公开(公告)号：US20130059499A1
公开(公告)日：2013-03-07
申请号：US13666578
申请日：2012-11-01
IPC分类号： B24B37/013 , B24B49/12
CPC分类号： H01L22/12 , B24B37/013 , B24B49/12 , H01L22/26
摘要： While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.
摘要翻译： 当抛光衬底时，也照射来自光源的光。 测量从基板的表面反射的光的当前光谱。 在当前光谱中识别具有第一参数值的选定峰。 使用处理器从查找表确定与第一参数相关联的第二参数的值。 根据第二参数的值，改变衬底的抛光。 可以测量在衬底的抛光之前从衬底反射的光的初始光谱，并且可以确定与初始光谱的选定峰对应的波长。
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公开(公告)号：US20110294400A1
公开(公告)日：2011-12-01
申请号：US13193011
申请日：2011-07-28
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： B24B51/00
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。
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46.发明申请公开(公告)号：US20110104987A1
公开(公告)日：2011-05-05
申请号：US12938240
申请日：2010-11-02
IPC分类号： B24B51/00
CPC分类号： G05B19/418 , B24B37/013 , B24B37/042 , B24B37/205 , B24B49/12 , G05B2219/45232
摘要： In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译： 在一个方面，抛光方法包括抛光衬底，以及接收所选择的光谱特征的识别和所选择的光谱特征的特征以在抛光期间进行监测。 该方法包括测量在衬底被抛光时从衬底反射的光的光谱序列，其中序列的至少一些光谱由于在抛光期间被去除的材料而不同。 抛光方法包括确定光谱序列中的每个光谱的所选光谱特征的特征值，以产生特征值的序列，将功能拟合到值序列，以及确定抛光 端点或基于该功能的抛光速率的调整。
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47.发明申请METHODS OF USING OPTICAL METROLOGY FOR FEED BACK AND FEED FORWARD PROCESS CONTROL 有权使用光学计量学方法进行回馈和进给前进过程控制公开(公告)号：US20100297916A1
公开(公告)日：2010-11-25
申请号：US12625345
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.
摘要翻译： 一种方法包括使用第一组参数来抛光第一台板上的基板，从至少两个区域获得多个测量光谱，将多个测量光谱与参考光谱进行比较，以评估至少两个 区域，比较第一区域的厚度和第二区域的厚度，确定第一区域的厚度是否落在第二区域的厚度的预定范围内，并且如果厚度不在第二区域的厚度内 预定范围，以下至少一个：a）调整第一组的至少一个参数并使用经调整的参数来研磨第一台上的第二基板，或b）调整第二组的至少一个参数并在一个 第二个压盘使用调整参数。
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公开(公告)号：US07746485B2
公开(公告)日：2010-06-29
申请号：US12253160
申请日：2008-10-16
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： G01B11/28
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。
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公开(公告)号：US20100130100A1
公开(公告)日：2010-05-27
申请号：US12625480
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of the first set of parameters based on the difference, and polishing the second substrate on the first platen using the adjusted parameter.
摘要翻译： 控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生 来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数 基于所述差异的所述第一组参数，并且使用所述调整参数来研磨所述第一台板上的所述第二基板。
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50.发明申请公开(公告)号：US20100129939A1
公开(公告)日：2010-05-27
申请号：US12625489
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of a second set of parameters based on the difference, and polishing the substrate on a second platen using the adjusted parameter.
摘要翻译： 控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生 来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数 基于所述差异的第二组参数，以及使用所述调整参数在所述第二压板上抛光所述衬底。
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