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119 条记录 (耗时 0.031 秒)

    Automatic selection of reference spectra library
    1.
    发明授权
    Automatic selection of reference spectra library 有权
    自动选择参考光谱库

    公开(公告)号：US08755928B2

    公开(公告)日：2014-06-17

    申请号：US13095802

    申请日：2011-04-27

    申请人： Jimin Zhang ,  Harry Q. Lee ,  Zhihong Wang ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu

    发明人： Jimin Zhang ,  Harry Q. Lee ,  Zhihong Wang ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu

    IPC分类号： G06F19/24

    CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/05 ,  B24B49/12 ,  G01J3/28

    摘要： A computer-implemented method of generating reference spectra includes polishing a plurality of set-up substrates, the plurality of set-up substrates comprising at least three set-up substrates, measuring a sequence of spectra from each of the plurality of set-up substrates during polishing with an in-situ optical monitoring system to provide a plurality of sequences of spectra, generating a plurality of sequences of potential reference spectra from the plurality of sequences of spectra, determining which sequence of potential reference spectra of the plurality of sequences provides a best match to remaining sequences of the plurality of sequences, and storing the sequence of potential reference spectra determined to provide the best match as reference spectra, and selecting and storing the sequence of potential reference spectra.

    摘要翻译： 计算机实现的产生参考光谱的方法包括抛光多个设置基板，所述多个设置基板包括至少三个设置基板，测量来自多个设置基板中的每一个的光谱序列 在用原位光学监测系统进行抛光时提供多个光谱序列，从多个光谱序列产生多个潜在参考光谱序列，确定多个序列中的哪个潜在参考光谱序列提供一个 最佳匹配多个序列的剩余序列，并存储确定为提​​供最佳匹配的参考光谱序列作为参考光谱，以及选择和存储潜在参考光谱序列。

    Using optical metrology for within wafer feed forward process control
    3.
    发明授权
    Using optical metrology for within wafer feed forward process control 有权
    使用光学测量在晶片前馈过程控制中

    公开(公告)号：US08039397B2

    公开(公告)日：2011-10-18

    申请号：US12625489

    申请日：2009-11-24

    申请人： Jeffrey Drue David ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Zhize Zhu ,  Wen-Chiang Tu

    发明人： Jeffrey Drue David ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Zhize Zhu ,  Wen-Chiang Tu

    IPC分类号： H01L21/302

    CPC分类号： B24B37/013 ,  B24B49/12 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of a second set of parameters based on the difference, and polishing the substrate on a second platen using the adjusted parameter.

    摘要翻译： 控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生 来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数 基于所述差异的第二组参数，以及使用所述调整参数在所述第二压板上抛光所述衬底。

    Determining Physical Property of Substrate
    5.
    发明申请
    Determining Physical Property of Substrate 有权
    确定基材的物理性质

    公开(公告)号：US20090033942A1

    公开(公告)日：2009-02-05

    申请号：US12253160

    申请日：2008-10-16

    申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    IPC分类号： G01N21/55 ,  G01B11/02

    CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

    摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

    Semi-quantitative thickness determination
    9.
    发明授权
    Semi-quantitative thickness determination 有权
    半定量厚度测定

    公开(公告)号：US08352061B2

    公开(公告)日：2013-01-08

    申请号：US12271674

    申请日：2008-11-14

    申请人： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Harry Q. Lee

    发明人： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Harry Q. Lee

    IPC分类号： G06F19/00

    CPC分类号： H01L22/12 ,  B24B37/013 ,  B24B49/12 ,  H01L22/26

    摘要： While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.

    摘要翻译： 当抛光衬底时，也照射来自光源的光。 测量从基板的表面反射的光的当前光谱。 在当前光谱中识别具有第一参数值的选定峰。 使用处理器从查找表确定与第一参数相关联的第二参数的值。 根据第二参数的值，改变衬底的抛光。 可以测量在衬底的抛光之前从衬底反射的光的初始光谱，并且可以确定与初始光谱的选定峰对应的波长。

    Adaptively Tracking Spectrum Features For Endpoint Detection
    10.
    发明申请
    Adaptively Tracking Spectrum Features For Endpoint Detection 失效
    自适应跟踪光谱特征进行端点检测

    公开(公告)号：US20110256805A1

    公开(公告)日：2011-10-20

    申请号：US13090972

    申请日：2011-04-20

    申请人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Harry Q. Lee

    发明人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Harry Q. Lee

    IPC分类号： B24B49/00 ,  B24B51/00

    CPC分类号： B24B49/12 ,  B24B37/013 ,  H01L22/12 ,  H01L22/26

    摘要： A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.

    摘要翻译： 控制抛光的方法包括抛光衬底，用原位监测系统在抛光过程中监测衬底，从原位监测系统的测量产生一系列值，将非线性函数拟合到值序列， 确定非线性函数达到目标值的预计时间; 以及基于所述预计时间确定抛光终点或抛光速率的调整中的至少一个。