METHOD FOR THE PRODUCTION OF METAL-COATED BASE LAMINATES
    42.
    发明申请
    METHOD FOR THE PRODUCTION OF METAL-COATED BASE LAMINATES 审中-公开
    用于生产金属基层压板的方法

    公开(公告)号:US20100176090A1

    公开(公告)日:2010-07-15

    申请号:US12601581

    申请日:2008-05-20

    IPC分类号: B32B37/02 C23F1/02

    摘要: The invention relates to a method for producing metal-coated base laminates having a support (51) made of an electrically nonconductive material (37), which is coated on at least one side with a metal layer (25, 53). In a first step, a base layer (11) is applied onto a substrate (3) with a dispersion (5), which contains electrolessly and/or electrolytically coatable particles in a matrix material. The matrix material is at least partially cured and/or dried. A metal layer is subsequently formed on the base layer (11) by electroless and/or electrolytic coating. The support (51) made of the electrically nonconductive material (37) is laminated onto the metal layer (25). The support (51) laminated with the metal layer (25) and at least a part of the base layer (11) are subsequently removed from the substrate (3).

    摘要翻译: 本发明涉及一种用于制造金属涂覆的基底层压板的方法,其具有由非导电材料(37)制成的支撑体(51),其在至少一侧上涂覆有金属层(25,53)。 在第一步骤中,将基底层(11)用分散体(5)施加到基底(3)上,所述分散体(5)在基质材料中包含无电解和/或电解涂覆的颗粒。 基质材料至少部分固化和/或干燥。 随后通过无电解和/或电解涂覆在基底层(11)上形成金属层。 由非导电材料(37)制成的支撑体(51)层压到金属层(25)上。 随后从衬底(3)移除与金属层(25)和基底层(11)的至少一部分层压的支撑件(51)。

    ELECTROPLATING DEVICE AND METHOD
    44.
    发明申请
    ELECTROPLATING DEVICE AND METHOD 审中-公开
    电镀设备和方法

    公开(公告)号:US20090178930A1

    公开(公告)日:2009-07-16

    申请号:US12297330

    申请日:2007-04-05

    IPC分类号: C25D5/00 C25D17/00

    摘要: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    摘要翻译: 本发明涉及一种用于至少一个导电基底或非导电基底上的结构化或全表面导电表面的电解涂层的装置,其包括至少一个浴,一个阳极和一个阴极,该浴含有电解质 含有至少一种金属盐的溶液,金属离子沉积在基材的导电表面上以形成金属层,同时使阴极与待涂覆的基底表面接触,并且将基底输送通过浴,其中 阴极包括安装在相应的轴(1,5,14)上的至少两个盘(2,4,10),使得它们可以旋转,盘(2,4,10)彼此接合。 本发明还涉及一种在根据本发明的装置中进行的至少一种基底的电解涂覆的方法。 最后,本发明还涉及根据本发明的装置在不导电支撑件上的导电结构的电解涂层的用途。