摘要:
The present invention relates to processes for application of a metal layer on a substrate via deposition of a metal from a metal salt solution by a chemical and/or electroplating method, a significant factor in these processes being that carbon nanotubes are present in the substrate surface. The present invention moreover relates to the use of carbon nanotubes for application of a metal layer on a substrate.
摘要:
The invention relates to a method for producing structured, electrically-conductive surfaces (3, 11) on an electrically nonconductive support (1), in which the structured and/or full-area electrically-conductive surfaces (3) of a first plane are applied onto the support (1) in a first step, an insulating layer (9) is applied in a second step at the positions where structured and/or full-area electrically-conductive surfaces (11) of a second plane cross the structured and/or full-area electrically-conductive surfaces (3) of the first plane and no electrical contact is intended to take place between the structured and/or full-area electrically-conductive surfaces of the first plane (3) and of the second plane (11), in a third step the structured and/or full-area electrically-conductive surfaces (11) of the second plane are applied according to the first step, and the second and third steps are optionally repeated.
摘要:
Method for producing electrically conductive, structured or full-area surfaces on a support, in which a structured or full-area base layer onto the support in a first step by using a dispersion, which contains electrically conductive particles in a matrix material, the matrix material is at least partially cured and/or dried in a second step, the electrically conductive particles are exposed in a third step by at least partially breaking the matrix, and a metal layer is formed on the structured or full-area base layer in a fourth step by electroless and/or electrolytic coating.
摘要:
The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.
摘要:
Method for producing structured electrically conductive surfaces on a substrate, which comprises the following steps: a) structuring a base layer containing electrolessly and/or electrolytically coatable particles on the substrate by ablating the base layer according to a predetermined structure with a laser, b) activating the surface of the electrolessly and/or electrolytically coatable particles and c) applying an electrically conductive coating onto the structured base layer.
摘要:
The present invention relates to a dispersion for the application of a metal layer on a non-electrically-conductive substrate comprising an organic binder component, a metal component, and also a solvent component. The invention further relates to processes for the production of the dispersion, processes for the production of a non-structured or structured metal layer with the aid of the dispersion, and also to the resultant substrate surfaces and their use.
摘要:
The present invention relates to a dispersion for the application of a metal layer on a non-electrically-conductive substrate comprising an organic binder component, a metal component, and also a solvent component. The invention further relates to processes for the production of the dispersion, processes for the production of a non-structured or structured metal layer with the aid of the dispersion, and also to the resultant substrate surfaces and their use.
摘要:
The present invention relates to a process for producing a metallized textile surface having one or more articles needing or generating electric current. A formulation having at least one metal powder is applied as a component atop a textile surface patternedly or uniformly. At least one article needing or generating electric current is fixed in at least two locations where formulation was applied. A further metal is deposited on the textile surface.
摘要:
The invention relates to a process for producing electrodes for solar cells, the electrode being configured as an electrically conductive layer on a substrate for solar cells, in which, in a first step, a dispersion comprising electrically conductive particles is transferred from a carrier to the substrate by irradiating the dispersion with a laser and, in a second step, the dispersion transferred to the substrate is dried and/or hardened to form the electrically conductive layer.
摘要:
The invention relates to a method for producing polymer-coated metal foils, comprising the following steps: (a) applying a base layer (7) onto a support foil (3), with a dispersion (5) which comprises electrolessly and/or electrolytically coatable particles in a matrix material, (b) at least partially drying and/or at least partially curing the matrix material, (c) forming a metal layer (19) on the base layer (7) by electroless and/or electrolytic coating of the base layer (7) comprising the electrolessly or electrolytically coatable particles, (d) applying a polymer (23) to the metal layer (19). Furthermore, the invention relates to a use of the polymer-coated metal foil for the production of printed circuit boards.