摘要:
A brushless motor according to the present invention is provided with: a tubular stator case; a stator core; and a rotor. The stator core includes a tubular yoke portion and a plurality of split cores. A plurality of dovetail grooves are formed in an inner peripheral surface of the yoke portion; each split core has a coil bobbin which has a mounting hole so as to penetrate in a radial direction, and a split teeth which is mounted into the mounting hole of the coil bobbin. The coil bobbin has a winding portion, and flange portions, and a clearance portion into which a winding starting end of the coil is strayed from the winding portion is formed on the inside of the one of the flange portions by reducing the thickness of the flange portion such that.
摘要:
This brushless motor according to the present invention is provided with: a tubular stator case; a stator core; a rotore; a plurality of teeth which are integrally formed on an inner peripheral surface of the stator core; a coil bobbin mounted between the mutually adjacent teeth, which has a winding portion around which a coil is wound; a lead wire; and a wiring substrate which relays a connection between the lead wire and the coil, wherein: the coil bobbin has flange portions; one of the flange portions which is located on the inward in the radial direction has an enlarged member which protrudes outward from the surface of the flange portion; a pair of terminals which is connected to the wiring substrate is provided on the enlarged portion so as to be located more inward than a tip of the tooth in the radial direction.
摘要:
In a cable connector used for connecting cables (23, 24) having a plurality of wires, cable-side insulators (26, 27) each arraying and retaining the wires in one plane are made attachable/detachable relative to a base insulator (13) retaining contacts. The cable-side insulators connect the wires to the contacts when attached to the base insulator. The base insulator has a pair of base guide portions (15) extending while confronting each other. The cable-side insulators each have a pair of cover guide portions (45) of which movement is guided by the base guide portions. At least either of the base guide portions and the cover guide portions have projection portions that bring both of them mutually into a press-fitted relation in a cable connected state.
摘要:
In a cable connector used for connecting cables (23, 24) having a plurality of wires, cable-side insulators (26, 27) each arraying and retaining the wires in one plane are made attachable/detachable relative to a base insulator (13) retaining contacts. The cable-side insulators connect the wires to the contacts when attached to the base insulator. The base insulator has a pair of base guide portions (15) extending while confronting each other. The cable-side insulators each have a pair of cover guide portions (45) of which movement is guided by the base guide portions. At least either of the base guide portions and the cover guide portions have projection portions that bring both of them mutually into a press-fitted relation in a cable connected state.
摘要:
A method of separating a wafer into individual die is disclosed. The wafer includes a substrate with organic thin-film multiple layers. A portion of the organic multiple layers is etched along a scribe line with excimer laser to form a groove to expose a portion of the substrate before sawing the substrate along the scribe line with a saw blade. Plasma etching or ion beam etching or sand blasting is an alternative to the excimer laser.
摘要:
A polyimide multilayer wiring substrate that includes a plurality of wiring layer blocks, each of which include a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by way of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting the anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure including N pieces of wiring layer blocks.
摘要:
A multi-layer wiring board has at least one stacking block with an insulating hard substrate, a grounding layer being provided in the insulating hard substrate. A plurality of wiring layers are provided over upper and lower major surfaces of the insulating hard substrate. A plurality of throughholes are provided in the insulating hard substrate for connecting wiring layers on the top and bottom surfaces of the substrate. A base block has an insulating base board, and at least one wiring layer provided over one major surface of the insulating base board. Connections electrically and mechanically connect the at least one stacking block and the base block. The stacking block and the base block may be simultaneously manufactured in parallel with others. The stacking block and the base block may be adhered to each other by an adhesive layer. Each electrical connection between the stacking block and the base block may be achieved with bumps and pads.
摘要:
A disc discharging toy for discharging discs is provided which comprises a plurality of resilient discs, a magazine for holding the discs in a stacked position, a forcibly feeding device for forcibly feeding the discs so held in the supply portion piece by piece toward a discharging position, and a discharging device for discharging the disc so fed. The discharging device includes two rollers and a motor for rotating at least one of the two rollers in a direction in which the disc is discharged.
摘要:
A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.