利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

189 条记录 (耗时 0.057 秒)

    Method and air-cooling unit with dynamic airflow and heat removal adjustability
    42.
    发明授权
    Method and air-cooling unit with dynamic airflow and heat removal adjustability 有权
    方法和空气冷却装置具有动态气流和散热可调性

    公开(公告)号：US07630795B2

    公开(公告)日：2009-12-08

    申请号：US12031961

    申请日：2008-02-15

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： G05D23/00 ,  F25D23/12 ,  H05K7/20

    CPC分类号： F28D15/00 ,  F28F27/00 ,  F28F2250/08 ,  H05K7/20745 ,  H05K7/2079 ,  H05K7/20836

    摘要： Method and air-cooling unit are provided for dynamically adjusting airflow rate through and heat removal rate of the air-cooling unit to facilitate cooling of one or more electronics racks of a data center. The air-cooling unit includes a housing, an air-moving device, and an air-to-liquid heat exchanger. The air-moving device moves air through the housing from the air inlet side to the air outlet side thereof, and the heat exchanger cools the air passing through the housing. A control unit controls the air-moving device and the flow of liquid coolant through the heat exchanger to automatically, dynamically adjust airflow rate and heat removal rate of the air-cooling unit to achieve a current airflow rate target and current heat removal rate target therefore. The current targets are based on airflow rate through and heat load generated by one or more associated electronics racks of the data center.

    摘要翻译： 提供了一种方法和空气冷却装置，用于动态地调节空气冷却装置的气流速率和散热率，以便于冷却数据中心的一个或多个电子机架。 空气冷却单元包括壳体，空气移动装置和空气对液体热交换器。 空气移动装置将空气从空气入口侧移动到其空气出口侧，并且热交换器冷却通过壳体的空气。 控制单元通过热交换器控制空气移动装置和液体冷却剂的流动，自动地动态地调节空气冷却装置的气流速率和排热速率，从而实现目前的气流速度目标和目前的除热率目标 。 目前的目标是基于数据中心的一个或多个相关的电子机架产生的气流速率和热负荷。

    Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow
    43.
    发明授权
    Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow 失效
    采用空气 - 液体热交换和分叉空气流的冷却电子系统

    公开(公告)号：US07492593B2

    公开(公告)日：2009-02-17

    申请号：US12049632

    申请日：2008-03-17

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20754

    摘要： Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.

    摘要翻译： 使用冷却液增强电子系统的空气冷却，以冷却进入系统的空气，并消除由电子设备消散的热量。 冷却的电子系统包括具有抽屉的框架，其中包含要冷却的电子元件。 框架包括一个带空气入口的前部和一个带有空气出口的后部。 框架包围框架，并且包括位于空气入口上方的前盖，位于空气出口上方的后盖，并且第一和第二侧面空气在框架的相对侧返回。 至少一个空气移动装置在电子抽屉之间建立空气流。 空气流在后盖处分叉并经由第一和第二侧面空气返回和前盖返回到进气口。 空气对液体的热交换器冷却流过电子抽屉的空气。

    Liquid-based cooling apparatus for an electronics rack
    45.
    发明授权
    Liquid-based cooling apparatus for an electronics rack 失效
    用于电子机架的液体冷却装置

    公开(公告)号：US07450385B1

    公开(公告)日：2008-11-11

    申请号：US11763678

    申请日：2007-06-15

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/20781 ,  F28F9/0275 ,  H05K7/20772 ,  Y10T29/5313

    摘要： A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate swivel connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.

    摘要翻译： 提供了一种用于促进电子机架的电子抽屉的冷却的冷却装置。 该装置包括构造成用于安装到电子机架的双折门组件。 门组件包括第一门和第二门，每个门被配置为单独地铰接安装到电子机架上。 该装置还包括冷却剂分配装置，其中冷却剂供应歧管安装到第一门，并且其冷却剂返回歧管安装到第二门。 单独的旋转连接件与冷却剂供应和返回歧管流体连通地联接，以便于冷却剂供给和从歧管返回并且用于促进门相对于电子机架的枢转运动。 多个冷却剂分配端口设置在供应和返回歧管内，并且设置成便于冷却剂供应和返回到电子抽屉。

    Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
    47.
    发明授权
    Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus 失效
    喷射孔板，具有用于直接冲击冷却装置的突出喷射孔结构

    公开(公告)号：US07362574B2

    公开(公告)日：2008-04-22

    申请号：US11462735

    申请日：2006-08-07

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  H01L23/24 ,  F28D15/00

    CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10S165/908 ,  H01L2224/0401

    摘要： A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

    摘要翻译： 提供冷却装置和直接冷却冲击模块，以及其制造方法。 冷却装置和直接冲击冷却模块包括歧管结构和用于将冷却剂喷射到待冷却表面上的喷射孔板。 喷射孔板包括用于在要冷却的表面引导冷却剂的多个喷射孔，其是配置有多个喷射孔结构的整体板。 每个喷射孔结构从喷射孔板的下表面朝向要冷却的表面突出，并且包括相应的喷射孔。 喷射孔结构被间隔开以限定其间的冷却剂流出物去除区域，其有助于将冷却剂流出物从被冷却到其周边区域的电子部件的中心区域上方移除，从而减少喷射孔板上的压降。

    Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system
    48.
    发明授权
    Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system 有权
    用于使用闭环热交换系统的电子机架的冷却的装置和方法

    公开(公告)号：US07286351B2

    公开(公告)日：2007-10-23

    申请号：US11124525

    申请日：2005-05-06

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20745

    摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing a closed loop heat exchange system. The closed loop heat exchange system includes a first heat exchanger, a second heat exchanger, and a coolant distribution loop connecting the first heat exchanger and the second heat exchanger. When operational, the coolant distribution loop allows coolant to circulate between the first heat exchanger and the second heat exchanger. The closed loop heat exchange system couples to the electronics rack with the first heat exchanger disposed at an air inlet side of the electronics rack, and the first heat exchanger and the second heat exchanger disposed in different inlet-to-outlet air flow paths through the electronics rack to reduce an imbalance in air flow temperature of the different inlet-to-outlet air flow paths through the electronics rack.

    摘要翻译： 提供了设备和方法，以便于采用闭环热交换系统的电子机架的冷却。 闭环热交换系统包括第一热交换器，第二热交换器和连接第一热交换器和第二热交换器的冷却剂分配回路。 当操作时，冷却剂分配回路允许冷却剂在第一热交换器和第二热交换器之间循环。 闭环热交换系统与设置在电子机架的空气入口侧的第一热交换器耦合到电子机架，并且第一热交换器和第二热交换器设置在不同的入口到出口的气流通道中 电子机架，以减少通过电子机架的不同入口到出口气流路径的空气流温度不平衡。

    Electronic device substrate assembly with impermeable barrier and method of making
    49.
    发明授权
    Electronic device substrate assembly with impermeable barrier and method of making 有权
    具有不渗透屏障的电子器件基板组件及其制造方法

    公开(公告)号：US06587345B2

    公开(公告)日：2003-07-01

    申请号：US10047497

    申请日：2001-11-09

    申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons ,  Prabjit Singh

    发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons ,  Prabjit Singh

    IPC分类号： H05K720

    CPC分类号： H01L23/04 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19105 ,  Y10T29/4935 ,  H01L2924/00

    摘要： An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device. When incorporated into an electronic module assembly including a module cap, the substrate assembly provides physical separation between a cooling fluid introduced into the module cap, and both the substrate and electronic devices.

    摘要翻译： 电子模块基板组件和制造方法，该组件在电子装置和水性冷却剂之间提供良好的导热性，同时保持冷却剂和电子装置之间的物理分离，以及减轻由材料的热膨胀系数的失配引起的机械应力 设备组件。 该组件包括基底，至少一个电子器件和预先形成的导热的不可渗透屏障。 阻挡层被预成形为多个区域，其中一些区域结合到其它结构。 一个阻挡区域优选地形成与衬底周边的流体密封密封。 至少一个其它屏障区域与所述至少一个电子器件形成低热阻结合。 当结合到包括模块帽的电子模块组件中时，衬底组件提供了引入模块盖的冷却流体与衬底和电子设备两者之间的物理分离。