公开(公告)号：US20160014933A1

公开(公告)日：2016-01-14

申请号：US14769935

申请日：2014-02-19

Applicant: NEC CORPORATION

Inventor： Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Masaki CHIBA ,  Akira SHOUJIGUCHI ,  Kenichi INABA

IPC: H05K7/20 ,  B23P19/00

CPC classification number: H05K7/20818 ,  B23P19/00 ,  F28D15/0266 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20827

Abstract: [Problem]To provide an electronic apparatus cooling system having superior cooling characteristics and portability.[Solution] A rack 2 is installed within a container 1. A heat receiving apparatus 3 is disposed on a lateral face of the rack 2, and receives heat emitted within the rack 2 by a liquid-phase cooling medium gasifying and becoming a gaseous-phase cooling medium. A gaseous-phase tube 6 is disposed extending in plumb direction, and transports the gaseous-phase cooling medium from the heat receiving apparatus 3. A heat radiating apparatus 4 is disposed above the rack 2 outside the container 1, and radiates the heat which the heat receiving apparatus 3 has received by cooling the gaseous-phase cooling medium flowing from the gaseous-phase tube 6, making said gaseous-phase cooling medium into the liquid-phase cooling medium. A liquid-phase tube 7 transports the liquid-phase cooling medium from the heat radiating apparatus 4 to the heat receiving apparatus 3. The gaseous-phase tube 6 further comprises a gaseous-phase tube bend part 6c whereat cooling medium droplets, which arise from the condensation of the gaseous phase cooling medium as a result of the gaseous-phase tube 6 being exposed to the environment external to the container 1, are collected.

Abstract translation: 提供具有优异的冷却特性和便携性的电子设备冷却系统。 [解决方案]机架2安装在容器1内。热接收装置3设置在齿条2的侧面上，并且通过液相冷却介质接收气体发生的气体发生的热量， 相冷却介质。 气相管6设置在铅垂方向延伸，并从热接收装置3输送气相冷却介质。散热装置4设置在容器1外部的齿条2的上方，并辐射热量 通过冷却从气相管6流出的气相冷却介质，接收热量接收装置3，使气相冷却介质进入液相冷却介质。 液相管7将液相冷却介质从散热装置4输送到热接收装置3.气相管6还包括气相管弯曲部6c，其中冷却介质液滴由 收集由于气相管6暴露于容器1外部的环境导致的气相冷却介质的冷凝。

公开(公告)号：US20150351286A1

公开(公告)日：2015-12-03

申请号：US14649172

申请日：2013-12-03

Applicant: NEC CORPORATION

Inventor： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC: H05K7/20

CPC classification number: H05K7/20663 ,  F25B1/00 ,  F25B21/02 ,  F25B2339/047 ,  F25B2400/24 ,  H05K7/20818

Abstract: The present invention includes: a heat receiving portion that receives heat generated by an electronic apparatus and causes a phase of a first heating medium to change from a liquid phase to a gas; a heat radiating portion that causes a phase of the first heating medium to change from the gas to the liquid and supplies the first heating medium to the heat receiving portion; and a compressor that raises a temperature of the first heating medium supplied from the heat receiving portion and supplies the first heating medium to the heat radiating portion.

Abstract translation: 本发明包括：受热部，其接收由电子设备产生的热量，并使第一加热介质的相位从液相变为气体; 散热部，其使所述第一加热介质的相位从所述气体向所述液体变化，并将所述第一加热介质供给到所述受热部; 以及压缩机，其升高从所述受热部供给的所述第一加热介质的温度，并将所述第一加热介质供给到所述散热部。

公开(公告)号：US20230023287A1

公开(公告)日：2023-01-26

申请号：US17791077

申请日：2020-01-16

Applicant: NEC Corporation

Inventor： Nilmal Singh RAJPUT ,  Koichi TODOROKI ,  Takafumi NATSUMEDA ,  Mahiro HACHIYA ,  Minoru YOSHIKAWA

IPC: H05K7/20

Abstract: A cooling system (100) has a housing (101), a heat exchanger (110) and an air distribution controller (120). The housing (101) including an inlet (102) for receiving air exhausted from the server module and an outlet (103) for providing air to the server module. The heat exchanger (110) is mounted between the inlet (102) and the outlet (103), the heat exchanger (110) is configured that a refrigerant (111) contained in the heat exchanger (110) exchanges heat with air passing through the heat exchanger (110). The heat exchanger (110) accepts variation of the refrigerant liquid level. The air distribution controller (120) is mounted in an inlet side of the heat exchanger (110). The air distribution controller (120) has a movable plate which allows an airflow profile from the inlet to the heat exchanger (110) redirected. The air distribution controller (120) controls the airflow profile depending on the liquid level.

公开(公告)号：US20220279684A1

公开(公告)日：2022-09-01

申请号：US17624917

申请日：2019-07-09

Applicant: NEC Corporation

Inventor： Yoshinori MIYAMOTO ,  Takafumi NATSUMEDA ,  Minoru YOSHIKAWA

IPC: H05K7/20 ,  F25B49/02

Abstract: A cooling system includes: a local cooler that is positioned near a server serving as a heat source and that evaporates a refrigerant by directly receiving heat from the server to generate a gas-phase refrigerant; a compressor that compresses the gas-phase refrigerant; an outdoor unit that condenses the gas-phase refrigerant supplied from the compressor by dissipating heat from the gas-phase refrigerant; an expansion valve that depressurizes the refrigerant supplied from the outdoor unit and sends the refrigerant to the local cooler; a pair of detectors that are respectively provided at an inlet side and an outlet side of the compressor and detect a state of the gas-phase refrigerant supplied from the local cooler; and a proportional control valve and a high-speed on-off valve that are operated based on a refrigerant state ratio calculated from a detection value of the detectors.

公开(公告)号：US20220151115A1

公开(公告)日：2022-05-12

申请号：US17440328

申请日：2019-03-18

Applicant: NEC Corporation

Inventor： Nirmal Singh RAJPUT ,  Yoshinori MIYAMOTO ,  Hisato SAKUMA ,  Minoru YOSHIKAWA

IPC: H05K7/20 ,  G05B15/02 ,  F24F11/63

Abstract: A system (20) for controlling an air conditioner (12) includes a plurality of pressure sensors (19) and a controller (13). Each of the pressure sensors (19) is positioned at an air inlet (15) of each of the racks (11). The controller (13) is configured to receive pressure values from the pressure sensors (19) and control an airflow rate of the cooling air supplied from the air conditioner (12) based on the pressure values. The controller (13) is configured to set a target pressure value for each pressure sensor (19) (S300), acquire a current pressure value for each pressure sensor (S401), calculate a pressure drop value for each pressure sensor (19) between the current pressure value and the target pressure value (S402), and adjust the airflow rate based on a maximum value among the plurality of the pressure drop values (S403 to S410).

公开(公告)号：US20220151113A1

公开(公告)日：2022-05-12

申请号：US17440315

申请日：2020-02-14

Applicant: NEC Corporation

Inventor： Mahiro HACHIYA ,  Minoru YOSHIKAWA ,  Takashi OHTSUKA ,  Nobuo KANEKO

IPC: H05K7/20 ,  H05K7/14

Abstract: To efficiently cool down heat of a heating element 20, this electronic device 100 is provided with a circuit board 10 having a heating element 20 that is attached to a first main surface 11 thereof, a case 30 having an opening part 31 that is formed in a surface facing the heating element 20 and housing a refrigerant COO therein, and a connection part 40 connecting the opening part 31 and the heating element 20 so as to enclose the refrigerant COO, the connecting part has a thickness of at most 0.21 mm.

公开(公告)号：US20220074632A1

公开(公告)日：2022-03-10

申请号：US17464924

申请日：2021-09-02

Applicant: NEC Corporation

Inventor： Mahiro HACHIYA ,  Minoru YOSHIKAWA

IPC: F25B41/45 ,  F25B41/20 ,  F24F1/38

Abstract: An outdoor unit includes a fan, a heat exchanger, a vapor pipe, a liquid pipe, and a refrigerant flowing through these pipes, in which the heat exchanger is a parallel flow heat exchanger divided into a plurality and connected in parallel between the vapor pipe and the liquid pipe. The heat exchanger is connected from the vapor pipe via a vapor branch pipe, and the heat exchanger is connected from the vapor pipe via the vapor branch pipe. In addition, the liquid pipe is connected from the heat exchanger via the liquid branch pipe, and the liquid pipe is connected from the heat exchanger via the liquid branch pipe.

公开(公告)号：US20210368648A1

公开(公告)日：2021-11-25

申请号：US16963392

申请日：2019-01-21

Applicant: NEC Corporation

Inventor： Masaki CHIBA ,  Minoru YOSHIKAWA ,  Hisato SAKUMA ,  Takafumi NATSUMEDA

IPC: H05K7/20

Abstract: To provide a cooling device capable of cooling a heat-generating body using simple configuration, the cooling device comprises two evaporators, two condensers, a compressor and an expansion valve, and is configured so that any one among a first flow path setting, a second flow path setting, a third flow path setting, and a fourth flow path setting can be selected.

公开(公告)号：US20210010763A1

公开(公告)日：2021-01-14

申请号：US16923615

申请日：2020-07-08

Applicant: NEC Corporation

Inventor： Koichi TODOROKI ,  Minoru YOSHIKAWA ,  Masaki CHIBA

IPC: F28F9/02 ,  F28F1/10 ,  H05K7/20

Abstract: A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.

公开(公告)号：US20210010757A1

公开(公告)日：2021-01-14

申请号：US17040731

申请日：2019-03-29

Applicant: NEC Corporation

Inventor： Mahiro HACHIYA ,  Minoru YOSHIKAWA

IPC: F28D15/04 ,  H01L23/427 ,  G06F1/20

Abstract: This electronic apparatus 100 comprises a heating element 20, and a case 30. The case 30 has an opening hole 31. In order that a refrigerant COO will be sealed between the case 30 and the heating element 20, the outer periphery part of a first heating element external surface 21, which is the external surface of the heating element 20, is attached to the outer periphery part of the opening hole 31. Also, the refrigerant COO is a refrigerant that is capable of phase change from a liquid refrigerant LP-COO to a gas phase refrigerant GP-COO. As a result, it is possible to more efficiently cool the heat of the heating element 20.