摘要:
An integrated high-voltage switching circuit includes a switch having ON and OFF states and having a parasitic gate capacitance. The switch consists of a pair of DMOS transistors integrated back to back and having a shared gate terminal, the drains of the DMOS transistors being connected to the input and output terminals of the switch respectively. The switching circuit further includes a turn-on circuit comprising a PMOS transistor having its drain connected to the shared gate terminal of the switch via a first diode, having its source connected to a global switch gate bias voltage terminal from which the PMOS transistor draws current, and having its gate electrically coupled to a switch gate control terminal that receives a switch gate control voltage input. The switch transitions from the OFF state to the ON state in response to a first transition of the switch gate control voltage input that causes the PMOS transistor to turn on, and the switch remains in the ON state in response to a second transition of the switch gate control voltage input that causes the PMOS transistor to turn off. The DMOS transistors turn on in response to the shared gate being coupled to the switch gate bias voltage when the PMOS transistor turns on.
摘要:
The present invention provides a clocked comparator which extends the time period before an input signal is measured to include most of the clock cycle, thereby increasing the amount of time available for the input signal to achieve a “steady-state” condition. After the input signal achieves a “steady-state” condition the comparator compares the input signal against a reference voltage and a decision register latches the comparator output. The decision signal may then be further latched to be made available for external circuitry in the subsequent clock cycle. A multi-phase programmable signal generator is connected to the clocked generator for generating a plurality of timing signals. The multi-phase programmable signal generator employs a plurality of single bit registers interconnected in series to form a shift register. Output signals generated by the programmable signal generator are used to drive the switches and register clocks of the clocked comparator.
摘要:
The present invention provides a clocked comparator which extends the time period before an input signal is measured to include most of the clock cycle, thereby increasing the amount of time available for the input signal to achieve a "steady-state" condition. After the input signal achieves a "steady-state" condition the comparator compares the input signal against a reference voltage and a decision register latches the comparator output. The decision signal may then be further latched to be made available for external circuitry in the subsequent clock cycle. A multi-phase programmable signal generator is connected to the clocked generator for generating a plurality of timing signals. The multi-phase programmable signal generator employs a plurality of single bit registers interconnected in series to form a shift register. Output signals generated by the programmable signal generator are used to drive the switches and register clocks of the clocked comparator.
摘要:
According to embodiments of the present technique, a system and a method for addressing transducers in a two-dimensional transducer array is disclosed. According to one aspect of the present technique, the transducers are arranged in rows and columns, and the columns are coupled to a shared transmit and receive circuitry while the rows are coupled to a row selection circuitry. In another embodiment, each transducer is coupled to a separate, dedicated transmit circuitry and the columns are coupled to a shared receive circuitry.
摘要:
A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.
摘要:
A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.
摘要:
An ultrasonic transducer probe having a highly integrated interface circuit array. Low-voltage transmit control signals from the system are transmitted on the system transmit channels via the ultrasound probe cable and into the interface circuit array. These transmit control signals are routed through the interface circuit array using a dense switching matrix. Once the low-voltage transmit control signals reach individual cells within the interface array, they are decoded and used to control local high-voltage pulser circuits to drive individual ultrasound transducer elements made up of selected subelements that are co-integrated with the interface electronics. The interface cell circuitry further comprises a high-voltage transmit/receive switch, which is closed when the high-voltage pulser is transmitting to protect the low-voltage components.
摘要:
A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.
摘要:
The present invention relates to a method for making an integrated sensor comprising providing a sensor array fabricated on a top surface of a bulk silicon wafer having a top surface and a bottom surface, and comprising a plurality of sensors fabricated on the top surface of the bulk silicon wafer. The method further comprises coupling an SOI wafer to the top surface of the bulk silicon wafer, thinning the back surface of the bulk silicon wafer, coupling a plurality of integrated circuit die to the back surface of the bulk silicon wafer, and removing the SOI wafer from the top surface of the bulk silicon wafer.
摘要:
A transceiver for use in an ultrasound system is provided. The transceiver is configured to operate in a transmit mode and a receive mode. The transceiver comprises a high voltage switch, a low voltage switch and a resistor coupled to the high voltage switch and the low voltage switch.