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公开(公告)号：US20100152587A1
公开(公告)日：2010-06-17
申请号：US12337328
申请日：2008-12-17
IPC分类号： A61B8/00
CPC分类号： A61B8/00 , A61B8/4281 , A61B8/4483 , G01S15/8925
摘要： According to embodiments of the present technique, a system and a method for addressing transducers in a two-dimensional transducer array is disclosed. According to one aspect of the present technique, the transducers are arranged in rows and columns, and the columns are coupled to a shared transmit and receive circuitry while the rows are coupled to a row selection circuitry. In another embodiment, each transducer is coupled to a separate, dedicated transmit circuitry and the columns are coupled to a shared receive circuitry.
摘要翻译： 根据本技术的实施例，公开了一种用于寻址二维换能器阵列中的换能器的系统和方法。 根据本技术的一个方面，换能器以行和列布置，并且列被耦合到共享的发送和接收电路，而行被耦合到行选择电路。 在另一个实施例中，每个换能器耦合到单独的专用发射电路，并且列耦合到共享接收电路。
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公开(公告)号：US08176787B2
公开(公告)日：2012-05-15
申请号：US12337328
申请日：2008-12-17
CPC分类号： A61B8/00 , A61B8/4281 , A61B8/4483 , G01S15/8925
摘要： According to embodiments of the present technique, a system and a method for addressing transducers in a two-dimensional transducer array is disclosed. According to one aspect of the present technique, the transducers are arranged in rows and columns, and the columns are coupled to a shared transmit and receive circuitry while the rows are coupled to a row selection circuitry. In another embodiment, each transducer is coupled to a separate, dedicated transmit circuitry and the columns are coupled to a shared receive circuitry.
摘要翻译： 根据本技术的实施例，公开了一种用于寻址二维换能器阵列中的换能器的系统和方法。 根据本技术的一个方面，换能器以行和列布置，并且列被耦合到共享的发送和接收电路，而行被耦合到行选择电路。 在另一个实施例中，每个换能器耦合到单独的专用发射电路，并且列耦合到共享接收电路。
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公开(公告)号：US20110028845A1
公开(公告)日：2011-02-03
申请号：US12534099
申请日：2009-07-31
IPC分类号： A61B8/14
CPC分类号： G10K11/345 , A61B8/08 , A61B8/0883 , A61B8/4483 , A61B8/483 , G01S7/52019 , G01S15/8909 , G01S15/8915
摘要： An ultrasound transducer probe is disclosed comprising: an array of ultrasound transducer elements, each ultrasound transducer element associated with a corresponding unit transducer cell for providing transmit and receive functions, each unit transducer cell including a cell transmit/receive switch connected to a low voltage switch matrix via a low voltage transmit path; and a plurality of microelectronic cross-point switches for switching an externally generated analog transmit signal to one or more of the low voltage transmit paths.
摘要翻译： 公开了一种超声换能器探头，其包括：超声波换能器元件阵列，每个超声换能器元件与相应的单元换能器单元相关联，用于提供发射和接收功能，每个单位换能器单元包括连接到低压开关的单元发射/接收开关 矩阵通过低电压发射路径; 以及用于将外部产生的模拟发射信号切换到一个或多个低电压发射路径的多个微电子交叉点开关。
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公开(公告)号：US07443765B2
公开(公告)日：2008-10-28
申请号：US11018238
申请日：2004-12-21
申请人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , Bruno Hans Haider , Kenneth Wayne Rigby
发明人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , Bruno Hans Haider , Kenneth Wayne Rigby
CPC分类号： B06B1/0292 , A61B2562/028 , G01N29/0609 , G01N29/069 , G01N29/245 , G01N2291/0423 , G01N2291/106
摘要： A reconfigurable linear array of sensors (e.g., optical, thermal, pressure, ultrasonic). The reconfigurability allows the size and spacing of the sensor elements to be a function of the distance from the beam center. This feature improves performance for imaging systems having a limited channel count. The improved performance, for applications in which multiple transmit focal zones are employed, arises from the ability to adjust the aperture for a particular depth.
摘要翻译： 传感器的可重构线性阵列（例如光学，热学，压力，超声波）。 可重新配置允许传感器元件的尺寸和间距是与梁中心距离的函数。 该功能提高了具有有限通道数的成像系统的性能。 对于使用多个透射聚焦区域的应用而言，改进的性能来自于为特定深度调整孔径的能力。
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公开(公告)号：US07952260B2
公开(公告)日：2011-05-31
申请号：US12725536
申请日：2010-03-17
申请人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Gideon Wodnicki
发明人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Gideon Wodnicki
CPC分类号： A61B8/00 , A61B1/0005 , B06B1/0622 , G01S7/5208 , G01S15/8925 , G01S15/8927 , G03B42/06
摘要： An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
摘要翻译： 超声成像系统（100）。 示例性系统（100）包括形成在子阵列（140）中的多个换能器元件（136）和多个子阵列电路单元（160'），每个电路单元（160'）连接到子阵列 换能器元件（136）。 每个单元（160'）中的电路包括多个集成电路（330,340,350），其中至少第一（340）个集成电路以堆叠配置形成在第二（330）集成电路上 。 在示例图中，第一集成电路（340）包括沿着其表面（342）的第一多个第一接合焊盘（345），并且第二集成电路（330）包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线（344），以在它们之间提供输入/输出信号连接。
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公开(公告)号：US08659148B2
公开(公告)日：2014-02-25
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L23/34
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。
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公开(公告)号：US20120133001A1
公开(公告)日：2012-05-31
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。
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公开(公告)号：US08961421B2
公开(公告)日：2015-02-24
申请号：US11737414
申请日：2007-04-19
CPC分类号： G01S7/52017 , Y10T307/74 , Y10T307/858
摘要： A transceiver for use in an ultrasound system is provided. The transceiver is configured to operate in a transmit mode and a receive mode. The transceiver comprises a high voltage switch, a low voltage switch and a resistor coupled to the high voltage switch and the low voltage switch.
摘要翻译： 提供了一种用于超声系统的收发器。 收发器被配置为在发送模式和接收模式下操作。 收发器包括高压开关，低压开关和耦合到高压开关和低压开关的电阻器。
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公开(公告)号：US20100020645A1
公开(公告)日：2010-01-28
申请号：US12180873
申请日：2008-07-28
IPC分类号： H04R17/00
CPC分类号： B06B1/0629 , G01S7/5208 , G01S15/8927 , G10K11/004
摘要： A method for dynamically reconfiguring elements in an ultrasound transducer array is provided. The method includes defining two or more groups of the elements in the array, wherein each element individually comprises a first switch, and a second switch; providing boundary definitions information to the elements in the array to define boundaries for the two or more groups; and locally determining switch configuration state within the array for the first and second switch of one or more elements based on the boundary definitions. Further, a switch matrix configured to locally determine switch settings is provided. Furthermore, a system comprising an array of ultrasonic transducer subelements is provided.
摘要翻译： 提供了一种用于动态重新配置超声换能器阵列中的元件的方法。 该方法包括定义阵列中的两组或多组元件，其中每个元件分别包括第一开关和第二开关; 向阵列中的元素提供边界定义信息以定义两个或更多个组的边界; 并且基于边界定义，本地确定阵列内的开关配置状态用于一个或多个元件的第一和第二开关。 此外，提供了配置成局部地确定开关设置的开关矩阵。 此外，提供了包括超声波换能器子元件阵列的系统。
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公开(公告)号：US07451651B2
公开(公告)日：2008-11-18
申请号：US11636822
申请日：2006-12-11
申请人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
发明人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
IPC分类号： G01N29/00
CPC分类号： G01D11/245 , B06B1/0292 , B06B1/0629 , G01N29/2437 , G01N2291/106 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/16145 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/01322 , Y10T29/49004 , Y10T29/49007 , H01L2924/00 , H01L2224/05099
摘要： A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
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