公开(公告)号：US20220060814A1

公开(公告)日：2022-02-24

申请号：US17152292

申请日：2021-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Yongseop YOON ,  Hyeokki HONG

IPC: H04R1/32 ,  H04R17/02 ,  H04R17/10 ,  G01H13/00

Abstract: Provided is a directional acoustic sensor. The acoustic sensor includes a support a plurality of resonators provided on the support, and extending in a length direction. Each resonator of the plurality of resonators may include a base; and a frame provided on the base and extending continuously along a length of the base in the length direction. The base may have a thickness less than that of the frame.

公开(公告)号：US20210281242A1

公开(公告)日：2021-09-09

申请号：US17327117

申请日：2021-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE

IPC: H03H9/54 ,  H03H9/24 ,  G01H11/08 ,  H04R17/02 ,  H04R17/10 ,  H03H9/13

Abstract: A filter system includes a first resonator having a first resonant frequency, and a second resonator having a second resonant frequency different from the first resonant frequency, and electrically connected to the first resonator. A first response characteristic of the first resonator and a second response characteristic of the second resonator with respect to a frequency include a first section in which a first phase of the first resonator is equal to a second phase of the second resonator, and a second section in which the first phase is different from the second phase by 180 degrees. A first electrode of the first resonator is reversely connected to a second electrode of the second resonator.

公开(公告)号：US20190200119A1

公开(公告)日：2019-06-27

申请号：US16127565

申请日：2018-09-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: H04R1/34 ,  H04R1/04 ,  H04R7/04

Abstract: A directional microphone is provided which includes a substrate having a cavity that penetrates therethrough, a resonator array of at least one resonator, and a cover member. Each of the resonator array and the cover member covers covering at least a part of the cavity.

公开(公告)号：US20180038901A1

公开(公告)日：2018-02-08

申请号：US15450416

申请日：2017-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Yongseop YOON ,  Choongho RHEE

IPC: G01R23/16 ,  H03H9/24

CPC classification number: G01R23/16 ,  G01H3/08 ,  G01H11/08 ,  H03H9/2426 ,  H04R1/245 ,  H04R17/02 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A spectrum analyzer includes: a support substrate; and a plurality of resonators that have center frequencies different from each other, one end of each of the plurality of resonators being fixed to the support substrate. The plurality of resonators are arranged so that an interval between resonators having adjacent center frequencies is secured by a certain value or greater, thus reducing coupling and increasing analysis accuracy.

公开(公告)号：US20160045935A1

公开(公告)日：2016-02-18

申请号：US14686459

申请日：2015-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongseop YOON ,  Sungchan KANG ,  Seokwhan CHUNG

IPC: B06B1/02 ,  B81B7/00 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B81B7/008 ,  B81C1/00031

Abstract: Example embodiments relate to a capacitive micromachined ultrasonic transducer (CMUT) having a nanopillar structure and a method of fabricating the same. The CMUT may include a conductive device substrate, a support defining a plurality of cavities corresponding to elements on the device substrate, a membrane on the support to form the plurality of cavities, an upper electrode on the membrane, and a plurality of nanopillars on at least one of the membrane and the device substrate exposed to the plurality of cavities.

Abstract translation: 示例实施例涉及具有纳米柱结构的电容微机械超声换能器（CMUT）及其制造方法。 CMUT可以包括导电器件衬底，限定对应于器件衬底上的元件的多个空腔的支撑件，支撑件上的膜以形成多个空腔，膜上的上电极以及在其上的多个纳米柱 膜和装置基板中的至少一个暴露于多个空腔。

公开(公告)号：US20160007959A1

公开(公告)日：2016-01-14

申请号：US14728341

申请日：2015-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Byunggil JEONG ,  Sangha PARK ,  Hyungjae SHIN

IPC: A61B8/00

CPC classification number: A61B8/4444 ,  A61B2562/166 ,  B06B1/0292 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Provided are capacitive micromachined ultrasonic transducer (CMUT) probes that use wire bonding. A CMUT probe includes a CMUT chip which includes a plurality of first electrode pads which are disposed on a first surface thereof, a printed circuit board (PCB) which is disposed on the first surface of the CMUT chip and which is configured to expose the plurality of first electrode pads, a plurality of second electrode pads which are disposed on the PCB and which correspond to respective ones of the plurality of first electrode pads, and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads.

Abstract translation: 提供使用引线接合的电容微加工超声波换能器（CMUT）探针。 CMUT探针包括CMUT芯片，其包括设置在其第一表面上的多个第一电极焊盘，布置在CMUT芯片的第一表面上的印刷电路板（PCB），其被配置为暴露多个 的第一电极焊盘，多个第二电极焊盘，其布置在PCB上并且对应于多个第一电极焊盘中的相应电极焊盘，以及多个电线，其将多个第一电极焊盘中的每一个连接到 对应的多个第二电极焊盘之一。