MULTI-CAVITY PACKAGING FOR MICROELECTROMECHANICAL SYSTEM MICROPHONES

    公开(公告)号:US20230269524A1

    公开(公告)日:2023-08-24

    申请号:US18045887

    申请日:2022-10-12

    摘要: An electronic device package comprises an electronic acoustic device including a primary microphone having a frequency response having a resonance frequency, and a reference microphone having a frequency response including a resonance frequency. The primary microphone and the reference microphone are configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the primary microphone. An equalization module is configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone. The package defines a first back cavity of the primary microphone and a second back cavity of the reference microphone, the second back cavity being acoustically isolated from the first back cavity.