摘要:
A coin checking device for a vending machine capable of electrically examining whether an inserted coin is a true coin or a counterfeit one as well as kind of the coin. The device detects a waveform representing passage of the coin and also whether the peak level of the waveform appears in a predetermined window or not and, if the peak level is detected in the window, judges that the inserted coin is a true one.
摘要:
In an internal combustion engine, a first oil chamber includes a curved surface portion provided on the upstream side in an oil flow direction and an inclined surface portion provided on the downstream side. The engine is so constructed that oil drops from upper oil passages onto the curved surface portion on the upstream side of the first oil chamber and the inclined surface portion on the downstream side. The curved surface portion on the upstream side has a curved shape which is convex downward, and the inclined surface portion on the downstream side has a slope shape which is inclined downward with respect to the horizontal direction. The curved shape of the curved surface portion on the upstream side is connected to the inclined surface portion before a tangent line of the curved surface portion turns to the horizontal direction.
摘要:
To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking.
摘要:
To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of backbone carbon atoms of the polyvinyl acetal being 100 or more, and a polyisocyanate having an isocyanate content of 1% to 50% by weight is used as a dielectric resin films material arranged between first and second counter electrodes facing each other. At least the polyvinyl acetal is subjected to high-pressure homogenization in which a shearing force is applied such that a pressure applied to the polyvinyl acetal is 50 MPa or more when the material is passed through a path having a diameter of 0.125 mm and a length of 5 mm, so that the solubility is increased to allow a curing reaction to proceed uniformly. The cured article has a glass transition temperature of 130° C. or higher and a breakdown voltage of 350 V/μm or more.
摘要:
A device includes a detection unit that detects states of eyelids of a user, and a control unit that performs operations in response to the states of the eyelids of the user detected by the detection unit.
摘要:
This electric power fuse has a fuse element that is formed continuously and integrally by a plurality of heat dissipating parts formed from a conductive film by the conductive film being formed on a ceramic substrate and a plurality of isolating parts. The conductive film is constituted of printed layers formed by printing one or more times on the surface of the ceramic substrate, and the number of laminations of printed layers formed in the heat dissipating parts is greater than or equal to the number of laminations of the printed layers constituting the isolating parts.
摘要:
An object is to provide a semiconductor element module having high reliability, superior electric connection and thermal connection and capable of securing sufficient cooling performance, and also to provide a method for manufacturing the same. The semiconductor element module (1) comprises an IGBT (2) and a diode (3) having electrodes formed on surfaces of both sides thereof, a ceramic substrate (7), in which thermal conductivity is high, having wiring circuit layers (4, 5) formed on the surface thereof for bonding to surfaces of one side of the IGBT (2) and the diode (3), a ceramic substrate (8), in which thermal conductivity is high, having a wiring circuit layer (6) formed on the surface thereof for bonding to surfaces of other side of the IGBT (2) and the diode (3), and a sealing member (11) which is sandwiched between the outer edges of the ceramic substrates (7, 8) for sealing inside thereof; and these members are bonded by room-temperature bonding.
摘要:
An object is to provide a semiconductor element module having high reliability, superior electric connection and thermal connection and capable of securing sufficient cooling performance, and also to provide a method for manufacturing the same. The semiconductor element module (1) comprises an IGBT (2) and a diode (3) having electrodes formed on surfaces of both sides thereof, a ceramic substrate (7), in which thermal conductivity is high, having wiring circuit layers (4, 5) formed on the surface thereof for bonding to surfaces of one side of the IGBT (2) and the diode (3), a ceramic substrate (8), in which thermal conductivity is high, having a wiring circuit layer (6) formed on the surface thereof for bonding to surfaces of other side of the IGBT (2) and the diode (3), and a sealing member (11) which is sandwiched between the outer edges of the ceramic substrates (7, 8) for sealing inside thereof; and these members are bonded by room-temperature bonding.
摘要:
According to the present invention, n (n=S is a positive integer) pieces of interrupting grids (22-1, 22-2, 22-3, - - - , 22-(n-1) and 22-n) are provided, each of the interrupting grids encompasses P pieces of narrow cut-off canals arranged in parallel. The both side of each of the narrow cut-off canals are concaved so that the narrow cut-off canal has a waisted-mortar shape. The waisted-mortar shape is delineated by m pieces of elliptical holes (Q1, Q2, Q3, - - - , Qm-1 and Qm (m=P−1 is a positive integer)) arranged adjacently in parallel and semi-elliptical holes (cut ID portions) provided on both sides the alignment of elliptical holes. Then, n pieces of the interrupting grids 22-1, 22-2, 22-3, - - - , 22-(n-1) and 22-n are arranged in series through jointing zones (heat-radiation zones) (21-1, 21-2, 21-3, - - - , 21-(n-) and 21-n) having a length of 2.5 millimeters or less measured in the series direction. A thickness of each of the interrupting grids is tH=10-60 micrometers, and a thickness of each of the jointing zones (heat-radiation zones) is tR=80-150 micrometers.
摘要:
An electro-optical device includes: a substrate; a plurality of wiring lines which is formed on the substrate; and an IC which is mounted on the substrate so as to be electrically connected to the plurality of wiring lines. At least a pair of wiring lines among the plurality of wiring lines include a first conductive layer formed on the substrate and a second conductive layer formed on at least the first conductive layer. The first conductive layer and the second conductive layer have different resistance values. The first conductive layer of one of the pair of wiring lines has a plurality of first resistors each extending toward the other wiring line, and the second conductive layer of the other wiring line has a second resistor extending toward the one wiring line. The plurality of first resistors is connected to the second resistor.