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    Hinge assembly
    41.
    发明授权
    Hinge assembly 失效
    铰链总成

    公开(公告)号：US08474102B2

    公开(公告)日：2013-07-02

    申请号：US12548645

    申请日：2009-08-27

    申请人： Jin-Xin Wang ,  Liang Wei ,  Jian Li

    发明人： Jin-Xin Wang ,  Liang Wei ,  Jian Li

    IPC分类号： E05D3/10

    CPC分类号： G06F1/1681 ,  Y10T16/54 ,  Y10T16/5402 ,  Y10T16/54028 ,  Y10T16/5403 ,  Y10T16/5472

    摘要： A hinge assembly includes a first pivot unit including a shaft, a bracket, an engaging member, a locking member, and an elastic member. The shaft has a non-circular sleeve portion. The bracket is rotatably sleeved on the shaft. The engaging member has a sleeving hole with a shape substantially corresponding to a cross-section of the sleeve portion of the shaft. The locking member has a sleeving hole with a shape substantially corresponding to a cross-section of the sleeve portion of the shaft. The locking member is non-rotatably latched to the engaging member. The elastic member is sleeved on the shaft to resist the components on the shaft.

    摘要翻译： 铰链组件包括包括轴，支架，接合构件，锁定构件和弹性构件的第一枢转单元。 轴具有非圆形套筒部分。 支架可旋转地套在轴上。 接合构件具有套筒孔，其形状基本上对应于轴的套筒部分的横截面。 锁定构件具有一个具有基本上对应于轴的套筒部分的横截面的形状的套筒孔。 锁定构件不可旋转地锁定到接合构件。 弹性构件套在轴上以抵抗轴上的部件。

    Hinge mechanism
    42.
    发明授权
    Hinge mechanism 失效
    铰链机构

    公开(公告)号：US08474101B2

    公开(公告)日：2013-07-02

    申请号：US12978550

    申请日：2010-12-25

    申请人： Jin-Xin Wang ,  Jian Li ,  Lian-Cheng Huang ,  Han-Zheng Zhang

    发明人： Jin-Xin Wang ,  Jian Li ,  Lian-Cheng Huang ,  Han-Zheng Zhang

    IPC分类号： E05D3/06

    CPC分类号： G06F1/1681 ,  H04M1/022 ,  Y10T16/54 ,  Y10T16/541 ,  Y10T16/547

    摘要： A hinge mechanism includes two pivot shafts substantially parallel to each other, two main gears non-rotatably respectively sleeved on the pivot shafts, a transmission assembly positioned between the two pivot shafts to transmit a torque of one of the two main gears to the other in a reverse direction, and a connecting member defining two shaft holes. The pivot shafts are respectively rotatably received in the shaft holes. Two contact assemblies are respectively mounted on the pivot shafts abutting the connecting member. One of the connecting member and each main gear forms at least one detent, and the other defines at least one recess correspondingly. The at least one detent is received in the at least one recess.

    摘要翻译： 铰链机构包括两个基本上彼此平行的枢轴，两个不可旋转地分别套在枢转轴上的主齿轮，一个位于两个枢转轴之间的变速器组件，以将两个主齿轮中的一个的转矩传递给另一个 一个反向的方向，以及一个限定两个轴孔的连接件。 枢轴分别可旋转地容纳在轴孔中。 两个接触组件分别安装在邻接连接构件的枢转轴上。 连接构件和每个主齿轮中的一个形成至少一个棘爪，而另一个限定了至少一个凹部。 所述至少一个棘爪被容纳在所述至少一个凹部中。

    FLEXIBLE REPLICATION WITH SKEWED MAPPING IN MULTI-CORE CHIPS
    43.
    发明申请
    FLEXIBLE REPLICATION WITH SKEWED MAPPING IN MULTI-CORE CHIPS 有权

    公开(公告)号：US20130145210A1

    公开(公告)日：2013-06-06

    申请号：US13309402

    申请日：2011-12-01

    申请人： Jian Li ,  William Evan Speight

    发明人： Jian Li ,  William Evan Speight

    IPC分类号： G06F12/08 ,  G06F11/20

    CPC分类号： G06F1/1692

    摘要： For a flexible replication with skewed mapping in a multi-core chip, a request for a cache line is received, at a receiver core in the multi-core chip from a requester core in the multi-core chip. The receiver and requester cores comprise electronic circuits. The multi-core chip comprises a set of cores including the receiver and the requester cores. A target core is identified from the request to which the request is targeted. A determination is made whether the target core includes the requester core in a neighborhood of the target core, the neighborhood including a first subset of cores mapped to the target core according to a skewed mapping. The cache line is replicated, responsive to the determining being negative, from the target core to a replication core. The cache line is provided from the replication core to the requester core.

    LIGHTING BULB
    44.
    发明申请
    LIGHTING BULB 审中-公开
    照明灯

    公开(公告)号：US20130135858A1

    公开(公告)日：2013-05-30

    申请号：US13327783

    申请日：2011-12-16

    申请人： Hsien-Chang Wu ,  Jian Li ,  Wei Zhou ,  Jun Zhang

    发明人： Hsien-Chang Wu ,  Jian Li ,  Wei Zhou ,  Jun Zhang

    IPC分类号： F21V5/04 ,  F21V15/01 ,  F21V29/00

    CPC分类号： F21V29/77 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V5/04 ,  F21V23/006 ,  F21V29/74 ,  F21V31/04 ,  F21Y2115/10

    摘要： A lighting bulb is provided. The lighting bulb has a housing, a lighting unit and an electrical connector. The housing is configured for accommodating a circuit board and a heat-dissipating sealant is filled in the housing. The lighting unit is coupled to the circuit board for emitting the light and the electrical connector is configured for providing power to the circuit board and the lighting unit. A protruding member disposed on the inner surface of the housing and the circuit board form a mechanical interference against the floating force of the heat-dissipating sealant to the circuit board.

    摘要翻译： 提供一个照明灯泡。 灯泡具有外壳，照明单元和电连接器。 壳体被配置为容纳电路板，并且散热密封剂填充在壳体中。 照明单元耦合到用于发射光的电路板，并且电连接器被配置为向电路板和照明单元提供电力。 设置在壳体的内表面上的突出构件和电路板形成对散热密封剂对电路板的浮力的机械干扰。

    SEMICONDUCTOR DIE ASSEMBLIES WITH ENHANCED THERMAL MANAGEMENT, SEMICONDUCTOR DEVICES INCLUDING SAME AND RELATED METHODS
    45.
    发明申请
    SEMICONDUCTOR DIE ASSEMBLIES WITH ENHANCED THERMAL MANAGEMENT, SEMICONDUCTOR DEVICES INCLUDING SAME AND RELATED METHODS 有权
    具有增强热管理的半导体组件，包括其的半导体器件及相关方法

    公开(公告)号：US20130119527A1

    公开(公告)日：2013-05-16

    申请号：US13613235

    申请日：2012-09-13

    申请人： Shijian Luo ,  Xiao Li ,  Jian Li

    发明人： Shijian Luo ,  Xiao Li ,  Jian Li

    IPC分类号： H01L23/34 ,  F28F7/00

    CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/42 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06589 ,  H01L2924/15311

    摘要： A semiconductor die assembly comprises a plurality of semiconductor dice in a stack. Another semiconductor die is adjacent to the stack and has a region, which may comprise a relatively higher power density region, extends peripherally beyond the stack. Conductive elements extend between and electrically interconnect integrated circuits of semiconductor dice in the stack and of the other semiconductor die. Thermal pillars are interposed between semiconductor dice of the stack, and a heat dissipation structure, such as a lid, is in contact with an uppermost die of the stack and the high power density region of the other semiconductor die. Other die assemblies, semiconductor devices and methods of managing heat transfer within a semiconductor die assembly are also disclosed.

    摘要翻译： 半导体管芯组件包括堆叠中的多个半导体管芯。 另一个半导体管芯与堆叠相邻并且具有可以包括相对较高功率密度区域的区域，其周边延伸超过堆叠。 导电元件在堆叠和另一个半导体管芯中的半导体管芯的集成电路之间延伸并电互连。 热柱被插入在堆叠的半导体管芯之间，并且诸如盖子的散热结构与堆叠的最上面的管芯和另一个半导体管芯的高功率密度区域接触。 还公开了其他管芯组件，半导体器件和管理半导体管芯组件内的热传递的方法。

    Techniques for dynamically sharing a fabric to facilitate off-chip communication for multiple on-chip units
    48.
    发明授权
    Techniques for dynamically sharing a fabric to facilitate off-chip communication for multiple on-chip units 失效
    用于动态共享结构以促进多个片上单元的片外通信的技术

    公开(公告)号：US08346988B2

    公开(公告)日：2013-01-01

    申请号：US12786716

    申请日：2010-05-25

    申请人： Jian Li ,  William E. Speight ,  Lixin Zhang

    发明人： Jian Li ,  William E. Speight ,  Lixin Zhang

    IPC分类号： G06F3/00 ,  G06F13/00

    CPC分类号： G06F1/3203 ,  G06F1/3253 ,  G06F9/5011 ,  Y02D10/151 ,  Y02D10/22

    摘要： A technique for sharing a fabric to facilitate off-chip communication for on-chip units includes dynamically assigning a first unit that implements a first communication protocol to a first portion of the fabric when private fabrics are indicated for the on-chip units. The technique also includes dynamically assigning a second unit that implements a second communication protocol to a second portion of the fabric when the private fabrics are indicated for the on-chip units. In this case, the first and second units are integrated in a same chip and the first and second protocols are different. The technique further includes dynamically assigning, based on off-chip traffic requirements of the first and second units, the first unit or the second unit to the first and second portions of the fabric when the private fabrics are not indicated for the on-chip units.

    摘要翻译： 一种用于共享一个结构以促进片上单元的片外通信的技术包括：当针对片上单元指示专用结构时，动态分配实现第一通信协议的第一单元到该结构的第一部分。 该技术还包括当为片上单元指示专用结构时，动态地将实现第二通信协议的第二单元分配给该结构的第二部分。 在这种情况下，第一和第二单元集成在相同的芯片中，并且第一和第二协议是不同的。 该技术还包括：当私有结构未被指示用于片上单元时，基于第一单元或第二单元的片外流量要求将第一单元或第二单元动态地分配给该结构的第一和第二部分 。