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公开(公告)号：US11081275B2
公开(公告)日：2021-08-03
申请号：US16414873
申请日：2019-05-17
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa , Jin Murakami
Abstract: An electronic device includes a plurality of chip components, an intermediate metal terminal, and an outer metal terminal. The intermediate metal terminal connects end surfaces of terminal electrodes of the chip components. The outer metal terminal is connectable to the terminal electrode positioned opposite to the terminal electrode connectable to the intermediate metal terminal.
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公开(公告)号：US10984950B2
公开(公告)日：2021-04-20
申请号：US16987930
申请日：2020-08-07
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Kenichi Inoue , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
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公开(公告)号：US10777353B2
公开(公告)日：2020-09-15
申请号：US16121719
申请日：2018-09-05
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Kenichi Inoue , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
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Patent Agency Ranking
公开(公告)号：US10763045B2
公开(公告)日：2020-09-01
申请号：US15702047
申请日：2017-09-12
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Masahiro Mori , Sunao Masuda , Kayou Matsunaga , Kosuke Yazawa
IPC: H01G4/248 , H01G4/232 , H01G4/38 , H01G4/30 , H01G2/06 , H01G4/224 , H01G4/12 , H01G4/008 , H01G4/012 , H01G4/33
Abstract: An electronic device including: a first chip component, having approximately rectangular parallelepiped shape; a second chip component, having approximately rectangular parallelepiped shape; and an external terminal electrically connected to a first terminal electrode and a second terminal electrode. The external terminal includes an electrode connecting component, connected to the first terminal electrode and the second terminal electrode. The electrode connecting component includes: a first component, connected to the coupling component and faces the first terminal electrode; and a second component, extends upward from the first component and faces the first terminal electrode and the second terminal electrode. Length of the second component in a width direction is shorter than a length of the first component in a width direction. Length W2 of the second component in a width direction is shorter than lengths W3, W4 of the first chip component and the second chip component in a width direction.
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公开(公告)号：US10763043B2
公开(公告)日：2020-09-01
申请号：US16197870
申请日：2018-11-21
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.
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公开(公告)号：US10714264B2
公开(公告)日：2020-07-14
申请号：US16165619
申请日：2018-10-19
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
IPC: H01G4/38 , H01G2/06 , H01R4/48 , H01R12/57 , H01R4/02 , H01G4/248 , H01G4/224 , H01R4/04 , H01G2/04 , H01G4/232 , H01G4/30 , H01G4/12
Abstract: A metal terminal is connectable to terminal electrodes of chip components arranged side by side. The metal terminal includes units corresponding to each chip. Each unit includes an electrode facing portion, a pair of upper and lower holding portions, a mount portion, and protrusions. The electrode facing portion faces the electrode of the chip. The pair of upper and lower holding portions holds the chip. The mount portion is located below the lower holding portion of the electrode facing portion. The protrusions protrude from the electrode facing portion toward the electrode. The protrusions in each unit are arranged substantially line-symmetrically to a virtual center line passing through a middle point between the upper and lower holding portions.
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公开(公告)号：US10096426B2
公开(公告)日：2018-10-09
申请号：US15391312
申请日：2016-12-27
Applicant: TDK CORPORATION
Inventor： Sunao Masuda , Katsumi Kobayashi , Masahiro Mori , Kayou Matsunaga , Norihisa Ando
Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.
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公开(公告)号：US09105405B2
公开(公告)日：2015-08-11
申请号：US14024398
申请日：2013-09-11
Applicant: TDK Corporation
Inventor： Sunao Masuda , Katsumi Kobayashi , Takashi Komatsu , Akitoshi Yoshii , Kazuyuki Hasebe , Kayou Kusano , Norihisa Ando
CPC classification number: H01G2/06 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
Abstract translation: 一种具有金属端子的陶瓷电子部件，包括在两端形成有端子电极的芯片部件，以及一对金属端子，包括具有平板部分的平板部分，所述平板部分面对面设置成使其面对所述芯片部件的端面， 通过接合部分连接到所述端子电极，以及安装部分，其连接到所述平板部分的一个端部并且大致垂直于所述平板部分延伸，其中所述安装部分具有形成约270°的角度的安装部分底面 形成相对于所述平板部分的角度以及相对于所述平板部分形成大约90度的角度的安装部分上表面，并且形成具有比所述安装部分底面更低的润湿性的阻焊区域。
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