公开(公告)号：US20190077656A1

公开(公告)日：2019-03-14

申请号：US15698706

申请日：2017-09-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen COOK ,  Kurt WACHTLER ,  Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS

IPC: B81C1/00 ,  G04F5/14

CPC classification number: B81C1/00793 ,  B81B3/0089 ,  B81B7/0038 ,  B81B2201/058 ,  B81B2203/0315 ,  G04F5/14 ,  H01L21/00

Abstract: Methods for depositing a measured amount of a species in a sealed cavity. In one example, a method for depositing molecules in a sealed cavity includes depositing a selected number of microcapsules in a cavity. Each of the microcapsules contains a predetermined amount of a first fluid. The cavity is sealed after the microcapsules are deposited. After the cavity is sealed the microcapsules are ruptured to release molecules of the first fluid into the cavity.

公开(公告)号：US20190071306A1

公开(公告)日：2019-03-07

申请号：US15697525

申请日：2017-09-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS ,  Benjamin Stassen COOK ,  Adam Joseph FRUEHLING

IPC: B81C1/00 ,  H01L23/08 ,  H01L21/768

CPC classification number: B81C1/00047 ,  B81B2203/0315 ,  B81C1/00539 ,  G04F5/14 ,  H01L21/76898 ,  H01L23/08

Abstract: An illustrate method (and device) includes etching a cavity in a first substrate (e.g., a semiconductor wafer), forming a first metal layer on a first surface of the first substrate and in the cavity, and forming a second metal layer on a non-conductive structure (e.g., glass). The method also may include removing a portion of the second metal layer to form an iris to expose a portion of the non-conductive structure, forming a bond between the first metal layer and the second metal layer to thereby attach the non-conductive structure to the first substrate, sealing an interface between the non-conductive structure and the first substrate, and patterning an antenna on a surface of the non-conductive structure.

公开(公告)号：US20190071304A1

公开(公告)日：2019-03-07

申请号：US15696245

申请日：2017-09-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS ,  Benjamin Stassen COOK ,  James F. HALLAS ,  Randy LONG

IPC: B81B7/00 ,  H03L7/26 ,  G01L7/08 ,  G04F5/14

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

公开(公告)号：US20180326462A1

公开(公告)日：2018-11-15

申请号：US15591311

申请日：2017-05-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Daniel Lee REVIER ,  Benjamin Stassen COOK ,  David Patrick MAGEE ,  Stephen John FEDIGAN

IPC: B08B3/10 ,  G01H13/00 ,  G01D5/24

CPC classification number: B08B3/102 ,  G01D5/24 ,  G01H13/00

Abstract: An apparatus includes a mass detection circuit coupled to a surface covered with a plurality of electrodes. The mass detection circuit is configured to detect a mass of a first droplet present on the surface. The apparatus further includes a transducer circuit coupled to a transducer, which is coupled to the surface and form a lens unit. The transducer circuit configured to excite a first vibration of the surface at a resonant frequency to form a high displacement region on the surface. The apparatus also includes a voltage excitation circuit coupled to the plurality of electrodes. In response to the detection of the mass of the first droplet, the voltage excitation circuit is configured to apply a sequence of differential voltages on one or more consecutive electrodes which moves the first droplet to the high displacement region.