公开(公告)号：US11349004B2

公开(公告)日：2022-05-31

申请号：US16984881

申请日：2020-08-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Li-Zhen Yu ,  Huan-Chieh Su ,  Lin-Yu Huang ,  Cheng-Chi Chuang ,  Chih-Hao Wang

IPC: H01L23/528 ,  H01L27/092 ,  H01L23/535 ,  H01L29/417 ,  H01L29/06 ,  H01L21/8238 ,  H01L29/423 ,  H01L21/768 ,  H01L21/8234 ,  H01L29/49 ,  H01L29/66

Abstract: Methods of forming backside vias connected to source/drain regions of long-channel semiconductor devices and short-channel semiconductor devices and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first transistor structure; a second transistor structure adjacent the first transistor structure; a first interconnect structure on a front-side of the first transistor structure and the second transistor structure; and a second interconnect structure on a backside of the first transistor structure and the second transistor structure, the second interconnect structure including a first dielectric layer on the backside of the first transistor structure; a second dielectric layer on the backside of the second transistor structure; a first contact extending through the first dielectric layer and electrically coupled to a first source/drain region of the first transistor structure; and a second contact extending through the second dielectric layer and electrically coupled to a second source/drain region of the second transistor structure, the second contact having a second length less than a first length of the first contact.

公开(公告)号：US11264326B2

公开(公告)日：2022-03-01

申请号：US16888381

申请日：2020-05-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Lin-Yu Huang ,  Li-Zhen Yu ,  Kuan-Lun Cheng ,  Chih-Hao Wang ,  Cheng-Chi Chuang ,  Chia-Hao Chang

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/522 ,  H01L21/3213

Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes an active region including a channel region and a source/drain region and extending along a first direction, and a source/drain contact structure over the source/drain region. The source/drain contact structure includes a base portion extending lengthwise along a second direction perpendicular to the first direction, and a via portion over the base portion. The via portion tapers away from the base portion.

公开(公告)号：US20220037193A1

公开(公告)日：2022-02-03

申请号：US17092773

申请日：2020-11-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Li-Zhen Yu ,  Huan-Chieh Su ,  Lin-Yu Huang ,  Cheng-Chi Chuang ,  Chih-Hao Wang

IPC: H01L21/768 ,  H01L23/528 ,  H01L23/532 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786 ,  H01L21/02 ,  H01L29/66

Abstract: Semiconductor devices including air spacers formed in a backside interconnect structure and methods of forming the same are disclosed. In an embodiment, a device includes a first transistor structure; a front-side interconnect structure on a front-side of the first transistor structure; and a backside interconnect structure on a backside of the first transistor structure, the backside interconnect structure including a first dielectric layer on the backside of the first transistor structure; a first via extending through the first dielectric layer, the first via being electrically coupled to a first source/drain region of the first transistor structure; a first conductive line electrically coupled to the first via; and an air spacer adjacent the first conductive line, the first conductive line defining a first side boundary of the air spacer.

公开(公告)号：US20210408249A1

公开(公告)日：2021-12-30

申请号：US17093345

申请日：2020-11-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Li-Zhen Yu ,  Huan-Chieh Su ,  Lin-Yu Huang ,  Cheng-Chi Chuang ,  Chih-Hao Wang

IPC: H01L29/417 ,  H01L21/768 ,  H01L21/3065

Abstract: A device includes a device layer including a first transistor, a first interconnect structure on a front-side of the device layer, and a second interconnect structure on a backside of the device layer. The second interconnect structure includes a first dielectric material on the backside of the device layer, a contact extending through the first dielectric material to a first source/drain region of the first transistor, and a first conductive layer including a first conductive line electrically connected to the first source/drain region through the contact.

公开(公告)号：US20210384316A1

公开(公告)日：2021-12-09

申请号：US16895604

申请日：2020-06-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Li-Zhen Yu ,  Lin-Yu Huang ,  Chia-Hao Chang ,  Cheng-Chi Chuang ,  Yu-Ming Lin ,  Chih-Hao Wang

IPC: H01L29/66 ,  H01L21/768

Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes a gate structure sandwiched between and in contact with a first spacer feature and a second spacer feature, a top surface of the first spacer feature and a top surface of the second spacer feature extending above a top surface of the gate structure, a gate self-aligned contact (SAC) dielectric feature over the first spacer feature and the second spacer feature, a contact etch stop layer (CESL) over the gate SAC dielectric feature, a dielectric layer over the CESL, a gate contact feature extending through the dielectric layer, the CESL, the gate SAC dielectric feature, and between the first spacer feature and the second spacer feature to be in contact with the gate structure, and a liner disposed between the first spacer feature and the gate contact feature.

公开(公告)号：US11177383B2

公开(公告)日：2021-11-16

申请号：US16785985

申请日：2020-02-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hao Chang ,  Sheng-Tsung Wang ,  Lin-Yu Huang ,  Chia-Lin Chuang ,  Cheng-Chi Chuang ,  Yu-Ming Lin ,  Chih-Hao Wang

IPC: H01L29/49 ,  H01L21/764 ,  H01L23/522 ,  H01L29/08 ,  H01L29/66 ,  H01L29/78 ,  H01L21/762 ,  H01L21/311 ,  H01L21/02

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin over the base. The semiconductor device structure includes a gate stack wrapping around a first upper portion of the fin. The semiconductor device structure includes a first stressor and a second stressor respectively over opposite first sides of the fin. The semiconductor device structure includes a spacer structure between the gate stack and the first stressor. The semiconductor device structure includes a first spacer layer covering a sidewall of the gate stack, the spacer structure, and the first stressor. The semiconductor device structure includes a dielectric layer over the first spacer layer. The semiconductor device structure includes an etch stop layer between the first spacer layer and the dielectric layer. The semiconductor device structure includes a seal structure between the second upper portion and the third upper portion.

公开(公告)号：US20210273113A1

公开(公告)日：2021-09-02

申请号：US16939909

申请日：2020-07-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hao Chang ,  Lin-Yu Huang ,  Han-Jong Chia ,  Bo-Feng Young ,  Yu-Ming Lin

IPC: H01L29/78 ,  H01L21/28 ,  H01L29/51

Abstract: A method includes providing a structure having a substrate, gate stacks and source/drain (S/D) features over the substrate, S/D contacts over the S/D features, one or more dielectric layers over the gate stacks and the S/D contacts, and a via structure penetrating the one or more dielectric layers and electrically connecting to one of the gate stacks and the S/D contacts. The method further includes forming a ferroelectric (FE) stack over the structure, wherein the FE stack includes an FE layer and a top electrode layer over the FE layer, wherein the FE stack directly contacts the via structure; and patterning the FE stack, resulting in a patterned FE stack including a patterned FE feature and a patterned top electrode over the patterned FE feature.

公开(公告)号：US11069811B2

公开(公告)日：2021-07-20

申请号：US16548423

申请日：2019-08-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Lin-Yu Huang ,  Jia-Chuan You ,  Chia-Hao Chang ,  Tien-Lu Lin ,  Yu-Ming Lin ,  Chih-Hao Wang

IPC: H01L29/78 ,  H01L29/66 ,  H01L21/768 ,  H01L21/308

Abstract: A method for forming a semiconductor device structure is provided. The method for forming the semiconductor device structure includes forming a first mask layer covering the gate stack, forming a contact alongside the gate stack and the first mask layer, recessing the contact, etching the first mask layer, and forming a second mask layer covering the contact and a portion of the first mask layer.

公开(公告)号：US20210066470A1

公开(公告)日：2021-03-04

申请号：US16895534

申请日：2020-06-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Lin-Yu Huang ,  Li-Zhen Yu ,  Chia-Hao Chang ,  Cheng-Chi Chuang ,  Yu-Ming Lin ,  Chih-Hao Wang

IPC: H01L29/66 ,  H01L29/423 ,  H01L21/3213 ,  H01L21/311 ,  H01L21/3105

Abstract: The present disclosure provides embodiments of a semiconductor structure having bi-layer self-aligned contact. The semiconductor structure includes a gate stack disposed on a semiconductor substrate and having a first height, a spacer disposed on a sidewall of the gate stack and having a second height greater than the first height, and a first etch stop layer disposed on a sidewall of the gate spacer and having a third height greater than the second height. The semiconductor structure further includes a first dielectric layer disposed over the gate stack and contacting the gate spacer and the first etch stop layer and a second dielectric layer disposed on the first dielectric layer and contacting the first etch stop layer.

公开(公告)号：US10937884B1

公开(公告)日：2021-03-02

申请号：US16571715

申请日：2019-09-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Wang ,  Lin-Yu Huang ,  Chia-Lin Chuang ,  Chia-Hao Chang ,  Cheng-Chi Chuang ,  Yu-Ming Lin ,  Chih-Hao Wang

IPC: H01L29/49 ,  H01L29/45 ,  H01L29/78 ,  H01L29/66 ,  H01L21/764 ,  H01L21/28

Abstract: A semiconductor device structure includes a gate stack and an adjacent source/drain contact structure formed over a semiconductor substrate. The semiconductor device structure includes a first gate spacer structure extending from a sidewall of the gate stack to a sidewall of the source/drain contact structure, and a second gate spacer structure formed over the first gate spacer structure and between the gate stack and the source/drain contact structure. The second gate spacer structure includes first and second gate spacer layers adjacent to the sidewall of the gate stack and the sidewall of the source/drain contact structure, respectively, and a third gate spacer layer separating the first gate spacer layer from the second gate spacer layer, so that an air gap is sealed by the first, second, and the third gate spacer layers and the first gate spacer structure.