摘要:
A rotary-head type magnetic tape recorder for recording a video signal and an audio signal on a magnetic tape by means of a rotary head controlled on the basis of the video signal. Difference is determined between a rate at which the digital audio signal is recorded on the recording medium and which is determined by the video signal and a rate of input data determined by a sampling frequency of the audio signal for a number N of samples of the digital signal to be included within one field period synchronized with the video signal. The number of samples for one field of input data is set by preparing on the basis of the result of detection of the difference in rate a first field containing a number of samples greater than the number N within and a second field containing a number of samples smaller than the number N. Blocks for recording the PCM audio signal on the recording medium are prepared by adding a first error detection/ correction code to the audio signal for every n symbols, while the symbols are imparted with amounts of delay differing from one another and subjected to diagonal incomplete interleave for thereby adding a second error detection/correction code. After addition of a block synchronizing signal, recording is performed on the tape. By adopting the variable fields, matching can be attained between the asynchronous audio and video signal fields. Reproduction capability notwithstanding of burst error is enhanced by incomplete diagonal interleave. Difference in time lag between the video signal and the audio signal involved in the reproduction thereof can be suppressed to a minimum.
摘要:
In PCM signal recording method and apparatus using rotary heads for converting two channels of autio PCM signals each consisting of 12-bit words to a data consisting of 8-bit words and recording the converted data, there is provided means for converting the PCM signals to two data each consisting of eight high order bits of each of two words of the PCM signals, and an 8-bit data consisting of the remaining four low order bits of the respective words. The converted PCM data are recorded on a record tape in a format such that PCM signals having i words/channel which are to be recorded on first and second tracks are divided into a first half and a second half, even data in the first half and odd data in the second half constitute the data to be recorded on the first track, and odd data in the first half and even data in the second half constitute the data to be recorded on the second track.
摘要:
A multitrack PCM reproducing apparatus for reproducing PCM signals recorded on a plurality of tracks in a distributed relation, comprises a signal selector circuit sequentially selecting the PCM signals reproduced from the individual tracks, an A/D converter converting the reproduced signals selected by the signal selector circuit into digital signals, a memory circuit storing the digital signals obtained by the A/D conversion, a single digital filter equalizing for each track the waveform of the digital signals stored in the memory circuit, and a signal processor circuit demodulating the PCM signals on the basis of the digital signals processed by the digital filter.
摘要:
The present disclosure provides a buried channel semiconductor structure in which a crystallographic wet etch is used to tailor the profile of etched regions formed into a multilayered substrate which includes a compound semiconductor layer located atop a buried semiconductor channel material layer. The use of crystallographic wet etching on a compound semiconductor allows one to tailor the shape of a source recess region and a drain recess region formed into a multilayered substrate. This allows for the control of gate overlap/underlap. Also, the use of crystallographic wet etching on a compound semiconductor allows independent control of the length of an underlying buried semiconductor channel region.
摘要:
The present disclosure reduces and, in some instances, eliminates the density of interface states in III-V compound semiconductor materials by providing a thin crystalline interlayer onto an upper surface of a single crystal III-V compound semiconductor material layer to protect the crystallinity of the single crystal III-V compound semiconductor material layer's surface atoms prior to further processing of the structure.
摘要:
This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.
摘要:
This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.