摘要:
Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.
摘要:
The present invention provides a structural adhesive sheet specifically for use in a mirror base of an automobile interior rear-view mirror and a method for producing the same, said structural adhesive sheet comprises in parts by weight of 20-100 parts of a nitrile-butadiene rubber, 10-70 parts of a partially cured polysulfide adhesive, 5-40 parts of a bisphenol A type epoxy resin, 0.1-2.5 parts of a crosslinking agent, 0.2-2.5 parts of a softening agent, 3-20 parts of a curing agent, 1-10 parts of an accelerator, 20-100 parts of an inorganic filler, and 0.1-3.0 parts of a silane coupling agent. The structural adhesive sheet of the present invention is obtained by subjecting the above-mentioned components to a compounding process and an extrusion film forming process. The advantages of said structural adhesive sheet include good film-forming property, and simple curing process, while having high structural strength, good toughness, and excellent heat-resistance and cold-resistance after cured.
摘要:
A two-part type adhesive composition which comprises a first composition comprising (A) a nitrile butadiene rubber having an acrylonitrile content of from 10 to 30%, (B) a polymerizable (meth)acrylic liquid composition, (C) an organic peroxide and (D) a basic compound having an amine structure, and a second composition comprising (E) a reaction condensate of an amine and an aldehyde and (F) a reducing agent containing copper, is provided. In a preferred embodiment, the first composition also contains a photopolymerization initiator. A bonding method using the adhesive composition provides high adhesion and quick curing properties on the second time scale, and a high retention in durability on a high temperature and high humidity test.
摘要:
Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer, and b. an epoxy resin, the weight ratio of the two components a/b being greater than 1.5 and no additional nonpolymer hardener being used.
摘要:
A vulcanizable adhesive composition, which comprises 100 parts by weight of phenolxylylene resin or phenolbiphenyl resin, 10 to 1,000 parts by weight of resol-type phenol resin, 0 to 1,000 parts by weight of novolak-type phenol resin, 10 to 1,000 parts by weight of unvulcanized nitrile rubber and 10 to 500 parts by weight of chlorinated polyethylene, is effectively applied to (hydrogenated) nitrile rubber with a nitrile content of 18 to 48%, and has a suppression effect on a decrease in the adhesiveness even if exposed to dip in various cryogenic liquids such as flon gas, polyalkylene glycol, water, etc. for a long time.
摘要:
An adhesive tape for electronic parts, comprising(a) a heat resistant base film, and(b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer,in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer,said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.
摘要:
An adhesive for electronic parts, which can be used for bonding and cured at a relatively low temperature and has sufficient heat resistance and reliability, and an adhesive tape for electronic parts, for which the above adhesive is adapted, the adhesive being a liquid adhesive obtained by dissolving an acrylonitrile-butadiene copolymer as Component (a), a phenolic resin as Component (b), a compound having at least 2 maleimide groups as Component (c) and a diamine compound of the general formula (1) specified in claim 1, and/or a polysiloxane compound terminating with an amino group at each terminal, having a weight average molecular weight of 200 to 7,000 and having the general formula specified in claim 1, as Component (d) in an organic solvent, and in which the total amount of Components (b), (c) and (d) per 100 parts by weight of Component (a) is 10 to 900 parts by weight, the amount of Component (b) based on the total amount of Components (b), (c) and (d) is 10 to 90% by weight, and the amount of amino groups of Component (d) per mole equivalent of the maleimide groups of Component (c) is 0.01 to 2.0 mole equivalents.
摘要:
A composition based upon a blend of lower alkyl or lower alkoxyalkyl polyacrylate ester elastomers with one or more materials selected from liquid butadiene acrylonitrile copolymers and halogenated fire-retardant plasticizers. Blends with the liquid butadiene acrylonitrile copolymers include from about 5 to about 50% by weight of the copolymer and from about 50 to about 95% by weight of the polyacrylate ester elastomer. Blends with the halogenated fire-retardant plasticizer include from about 5 to about 100 parts by weight of the halogenated fire-retardant plasticizer per 100 parts of the polyacrylate ester elastomer. Hydrocarbon-resistant sealant compositions further contain effective amounts of one or more plasticizers in amounts effective to plasticize the blend together with one or more reinforcing materials. Flame-resistant sealant compositions utilize phosphate ester plasticizers and further contain one or more flame-retardant materials including alumina trihydrate, magnesium carbonate and magnesium hydroxide hydrate.
摘要:
Nitrile rubber emulsion latexes containing anionic emulsifying aids such as surfactants are treated with large amounts of cationic polymeric coagulants to form innocuous water insoluble residues. The polymeric coagulants chemically react with the anionic emulsifying aids by forming polymer adducts whereby the adducts are physically maintained in the nitrile rubber. The need for complete or thorough washing steps, which is generally tedious, expensive, and commercially impractical, is thus reduced or eliminated. Moreover, the dried latex particles have been found to have improved properties such as water resistance, adhesion, and the like.
摘要:
An adhesive composition which shows improved stickiness and adhesive property at room temperature and exhibits an excellent adhering ability in a short time is prepared by compounding(a) an acrylonitrile-containing copolymer having carbon-to-carbon double bond(b) a phenol-polysulfide resin(c) a metal oxide, and(d) a polyfunctional electrophilic reactive compound containing at least two electrophilic reactive groups.