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公开(公告)号：US08410470B2
公开(公告)日：2013-04-02
申请号：US12810443
申请日：2008-12-26
CPC分类号： C09K11/54 , C09K11/02 , C09K11/621 , C09K11/645
摘要： Disclosed is an ultraviolet fluorescent material having high light emission efficiency, wherein the peak wavelength of ultraviolet light to be emitted can be controlled by having a quantum dot structure wherein a fine crystal of zinc oxide having an average diameter of 1-10 nm serves as a core, and the surface of the zinc oxide fine crystal is covered with at least one of LiGaO2, LiAlO2, NaGaO2 and NaAlO2, which has a crystal structure similar to that of the zinc oxide and low lattice mismatch and hardly suffers from structural defects, or a solid solution thereof.
摘要翻译： 公开了一种具有高发光效率的紫外线荧光材料，其中可以通过具有量子点结构来控制要发射的紫外光的峰值波长，其中平均直径为1-10nm的氧化锌的细晶体用作 芯，并且氧化锌微晶的表面被LiGaO 2，LiAlO 2，NaGaO 2和NaAlO 2中的至少一种覆盖，其具有与氧化锌类似的晶体结构和低晶格失配，并且几乎不具有结构缺陷，或 其固溶体。
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公开(公告)号：US20090286417A1
公开(公告)日：2009-11-19
申请号：US11995648
申请日：2006-07-03
IPC分类号： H01R13/62
CPC分类号： H05K7/1007 , H01R13/2442
摘要： An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof is disclosed. The IC socket has an insulating housing that receives the IC package and a plurality of elastic contacts, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package. The IC socket also has a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.
摘要翻译： 公开了一种用于接收在其底面上具有多个电触点的IC封装的IC插座。 IC插座具有绝缘壳体，其接收IC封装和多个弹性触点，每个固定在绝缘壳体上的一端，并且每个触头的剩余端接触IC底面上的至少一个电触头 包。 IC插座还具有由绝缘壳体承载的弹簧构件，其确定被接纳到绝缘壳体中的IC封装的接受位置，并且抑制由于弹性触点的弯曲引起的IC封装的水平移动量 IC封装被按下。
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公开(公告)号：US20090015587A1
公开(公告)日：2009-01-15
申请号：US12170021
申请日：2008-07-09
申请人： Shinichi Hashimoto , Itsuki Kuga , Eiichi Shiki
发明人： Shinichi Hashimoto , Itsuki Kuga , Eiichi Shiki
CPC分类号： A61B8/06 , A61B8/461 , A61B8/466 , G06T15/08 , G06T2210/41
摘要： A transmitter/receiver transmits and receives ultrasonic waves to and from a desired region of a subject via an ultrasonic probe. A signal processor obtains a plurality of physical quantities from signals outputted by the transmitter/receiver having received ultrasonic echoes from the subject. A voxel-value generator generates a voxel value containing the plurality of physical quantities. An image generator generates a three-dimensional image by using the plurality of physical quantities including any of the rate, power value or dispersion of a blood flow contained in the voxel value and sequentially executing a rendering process on each voxel. A display controller controls a display to display the generated three-dimensional image.
摘要翻译： 发射机/接收机经由超声波探头向被摄体的期望区域发送超声波和从受检者的期望区域接收超声波。 信号处理器从已经从被摄体接收到超声回波的发射机/接收机输出的信号中获得多个物理量。 体素值生成器生成包含多个物理量的体素值。 图像生成器通过使用包含体素值中包含的血流速率，功率值或色散的多个物理量，并对每个体素依次执行渲染处理来生成三维图像。 显示控制器控制显示器以显示生成的三维图像。
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44.发明授权Process for producing isoprenoid compounds by microorganisms and a method for screening compounds with antibiotic or weeding activity 失效通过微生物生产类异戊二烯化合物的方法和用抗生素或除草活性筛选化合物的方法公开(公告)号：US07364885B2
公开(公告)日：2008-04-29
申请号：US11695320
申请日：2007-04-02
申请人： Koichiro Miyake , Shinichi Hashimoto , Hiroaki Motoyama , Akio Ozaki , Haruo Seto , Tomohisa Kuzuyama , Shunji Takahashi
发明人： Koichiro Miyake , Shinichi Hashimoto , Hiroaki Motoyama , Akio Ozaki , Haruo Seto , Tomohisa Kuzuyama , Shunji Takahashi
IPC分类号： C12P5/00
CPC分类号： C12N9/1085 , A01N63/02 , C12N9/0006 , C12N9/1022 , C12N15/52 , C12P7/66 , C12P23/00 , C12Q1/18 , C12Y202/01007 , G01N2430/20
摘要： The present invention provides a process for producing isoprenoid compounds or proteins encoded by DNA using DNA that contains one or more of the DNA encoding proteins having activity to improve efficiency in the biosynthesis of isoprenoid compounds effective in pharmaceuticals for cardiac diseases, osteoporosis, homeostasis, prevention of cancer, and immunopotentiation, health food and anti-fouling paint products against barnacles; the DNA; the protein; and a method for screening a substance with antibiotic and weeding activities comprising screening a substance inhibiting enzymatic reaction on the non-mevalonate pathway.
摘要翻译： 本发明提供了使用含有一种或多种编码DNA的蛋白质来生产类异戊二烯化合物或由DNA编码的蛋白质的方法，所述DNA编码蛋白质具有提高有效用于心脏疾病，骨质疏松症，体内平衡，预防的药物中类异戊二烯化合物的生物合成的效率的活性 的癌症，免疫增强，保健食品和防腐漆产品针对藤壶; DNA; 蛋白质; 以及用抗生素和除草活性筛选物质的方法，其包括在非甲羟戊酸途径上筛选抑制酶反应的物质。
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公开(公告)号：US07349217B2
公开(公告)日：2008-03-25
申请号：US10837226
申请日：2004-04-30
申请人： Shinichi Hashimoto
发明人： Shinichi Hashimoto
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.
摘要翻译： IC插座组件包括用于抵靠IC封装的上表面散热由此产生的热的散热器，以及用于将散热器固定到壳体的固定构件。 固定构件包括：框架，安装在电路板的表面上，壳体安装在框架上; 背板，安装在电路板的相对表面上，具有接合臂，其通过电路板的孔插入并接合框架; 一对固定在接合臂上的装载梁; 以及由加载梁轴向支撑的用于将散热器推向壳体的一对杆。
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公开(公告)号：US20080037236A1
公开(公告)日：2008-02-14
申请号：US11869478
申请日：2007-10-09
申请人： Shinichi Hashimoto
发明人： Shinichi Hashimoto
IPC分类号： H05K7/02
CPC分类号： H05K7/1053 , H01R13/639
摘要： An IC socket assembly includes an IC socket, constituted by: a plurality of electrical contacts; an IC package mounting surface; an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and the IC package. The IC package has a frame member provided about the periphery of a main body thereof.
摘要翻译： IC插座组件包括：IC插座，其由多个电触头构成; IC封装安装面; 用于将所述多个电触点保持在所述IC封装安装表面处的绝缘插座壳体; 以及用于将安装在所述IC封装安装表面上的IC封装件推向所述多个电触头以与其建立电连接的推动构件; 和IC封装。 IC封装具有围绕其主体的周边设置的框架构件。
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公开(公告)号：US20060186765A1
公开(公告)日：2006-08-24
申请号：US11410021
申请日：2006-04-25
申请人： Shinichi Hashimoto
发明人： Shinichi Hashimoto
IPC分类号： H01L41/08
CPC分类号： B06B1/0622 , A61B8/546
摘要： An ultrasonic probe includes a plurality of transducers arranged in XY directions, a plurality of backing members stacked along the X or Y direction, in back of the transducers, and a plurality of heat conductive sheets sandwiched between the plurality of backing members and higher in heat conductivity than the backing members.
摘要翻译： 超声波探头包括沿XY方向布置的多个换能器，沿着X或Y方向在换能器的后面堆叠的多个背衬构件，以及夹在多个背衬构件之间的多个导热片，并且在加热时更高 电导率比背衬构件。
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公开(公告)号：US20060035539A1
公开(公告)日：2006-02-16
申请号：US11202277
申请日：2005-08-11
申请人： Hiroshi Shirai , Shinichi Hashimoto
发明人： Hiroshi Shirai , Shinichi Hashimoto
IPC分类号： H01R4/48
CPC分类号： H01R13/2442
摘要： An integrated circuit socket comprises an insulative housing having an integrated circuit package receiving recess provided with a plurality of contact receiving openings arranged in a matrix. Contacts are arranged in the contact receiving openings. Each of the contacts has a base fixed to the contact receiving opening and a contact arm that extends away from the base. The contact arm has a contact portion with a contact point at an uppermost end. The contact portion overlaps with the contact arm of an adjacent one of the contacts. First partition walls separate the contact receiving openings in a direction substantially perpendicular to a direction in which the contact arms extend. The uppermost ends are arranged below tops of the first partition walls.
摘要翻译： 集成电路插座包括具有集成电路封装容纳凹槽的绝缘壳体，所述集成电路封装容纳凹槽设置有以矩阵形式布置的多个触点容纳孔。 接触件布置在接触开口中。 每个触头具有固定到触头接收开口的基座和远离基座延伸的接触臂。 接触臂具有在最上端具有接触点的接触部分。 接触部分与相邻接触件的接触臂重叠。 第一分隔壁在大致垂直于接触臂延伸的方向的方向上分开接触开口。 最上端设置在第一分隔壁的顶部下方。
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公开(公告)号：US06908319B2
公开(公告)日：2005-06-21
申请号：US10702261
申请日：2003-11-05
申请人： Naotaka Sasame , Shinichi Hashimoto
发明人： Naotaka Sasame , Shinichi Hashimoto
IPC分类号： H01R13/52 , H01R13/453 , H01R13/648 , H01R13/44
CPC分类号： H01R13/4536 , H01R13/6485
摘要： The present invention provides an electrical connector with a plurality of contacts therein and a conductive shutter rotatable between a closed position covering the plurality of contacts and an open position exposing the plurality of contacts. A shield member encircles the plurality of contacts and is configured to make electrical contact with the conductive shutter when the conductive shutter is in the closed position. A mating connector and a connector arrangement are also provided.
摘要翻译： 本发明提供了一种电连接器，其中具有多个触点，并且导电快门可在覆盖多个触点的闭合位置和暴露多个触点的打开位置之间旋转。 屏蔽构件环绕多个触点，并且构造成当导电快门处于关闭位置时与导电快门电接触。 还提供了配合连接器和连接器装置。
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公开(公告)号：US20050068752A1
公开(公告)日：2005-03-31
申请号：US10955440
申请日：2004-09-30
申请人： Shinichi Hashimoto , Hiroshi Shirai
发明人： Shinichi Hashimoto , Hiroshi Shirai
CPC分类号： H05K7/1069
摘要： Deformation of a socket housing during connection of an IC package is prevented, and reliable electrical connections are secured in an IC socket assembly. The IC socket assembly is constituted by a plurality of electrical contacts; an insulative socket housing for holding the electrical contacts arranged in a matrix; a reinforcing plate having an opening at its center, through which the electrical contacts are exposed, for supporting the lower portion of the socket housing; a cover member, which is rotatably supported by the reinforcing plate, for cooperating with the reinforcing plate to sandwich and hold the IC package therebetween and to press the IC package against the electrical contacts; and reinforcing beams, which are supported by the reinforcing plate and provided across opposing edges of the opening, for supporting the socket housing.
摘要翻译： 防止在IC封装连接期间插座壳体的变形，并且在IC插座组件中确保可靠的电连接。 IC插座组件由多个电触头构成; 用于保持布置成矩阵的电触点的绝缘插座壳体; 加强板，其中心具有开口，电触头暴露于该开口，用于支撑插座壳体的下部; 盖构件，其被加强板可旋转地支撑，用于与加强板配合以夹持并保持IC封装，并且将IC封装压靠在电触点上; 以及加强梁，其由加强板支撑并且设置在开口的相对边缘上，用于支撑插座壳体。
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