公开(公告)号：US4959440A

公开(公告)日：1990-09-25

申请号：US6513

申请日：1987-01-23

申请人： Shoji Tamai ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Masahiro Ohta ,  Hideaki Oikawa ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Masahiro Ohta ,  Hideaki Oikawa ,  Akihiro Yamaguchi

IPC分类号： C08G73/00 ,  C08G73/10 ,  C09J179/08

CPC分类号： C08G73/1071 ,  C08G73/105

摘要： This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula ##STR1## (where the positions of two carbonyl radicals in a benzene ring are meta or para, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting diamine with tetracarboxylic dianhydride in organic solvents and imidizing resultant polyamic acid.The diamine in use is ether diamine and includes 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene and 1,4-bis[4-(3-aminophenoxy)benzoyl]benzene.Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride.

摘要翻译： 本发明涉及一种新型聚酰亚胺及其制备方法，聚酰亚胺的粘合剂及其应用方法。 聚酰亚胺具有下式的重复单元：其中苯环中的两个羰基的位置是间位或对位的，R是选自以下的四价基团：具有式 不少于两个碳，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团，其中芳族基团与键或交联官能团相互连接）。 聚酰亚胺可以通过二胺与四羧酸二酐在有机溶剂中反应并酰亚胺化得到的聚酰胺酸来制备。 所用的二胺是醚二胺，包括1,3-双[4-（3-氨基苯氧基）苯甲酰]苯和1,4-双[4-（3-氨基苯氧基）苯甲酰基]苯。 可以使用各种四羧酸二酐，特别优选的是均苯四酸二酐和3,3'，4,4'-二苯甲酮四羧酸二酐。

公开(公告)号：US4883718A

公开(公告)日：1989-11-28

申请号：US159850

申请日：1988-02-05

申请人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Snobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Akihiro Yamaguchi

发明人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Snobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Akihiro Yamaguchi

IPC分类号： B32B15/08 ,  H05K1/03 ,  H05K3/02

CPC分类号： B32B15/08 ,  H05K1/0346 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/31681 ,  Y10T428/31721

摘要： This invention relates to flexible copper-clad circuit substrates where copper foil is directly and firmly jointed with a polyimide film.Polyimide used is obtained conventionally by reacting diamine components including 3,3'-diaminobenzophenone, 1,3-bis(3-aminophenoxy)-bezene, 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)-phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, bis[4(3-aminophenoxy)phenyl] sulfide, bis[4-(3-aminophenoxy)phenyl] ketone and bis[4-(3-aminophenoxy)phenyl] sulfone, with tetracarboxylic acid dianhydride including pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl tetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride, in organic solvent, and by thermally or chemically imidizing resultant polyamic acid.Polyimide thus obtained has relatively lower melt viscosity and is flowable at high temperatures. Therefore, the copper foil and the polyimide film were assembled, pressed by heating under pressure and further cured to afford the flexible copper-clad circuit substrates having the polyimide film firmly jointed with the copper foil.

摘要翻译： PCT No.PCT / JP86 / 00334 Sec。 371日期1988年2月5日 102（e）日期1988年2月5日PCT Filed 1986年6月30日PCT公布。 出版物WO88 / 00428 日本公开日1988年1月14日。本发明涉及铜箔与聚酰亚胺膜直接且牢固地接合的柔性铜包覆电路基板。 所使用的聚酰亚胺通常通过使包括3,3'-二氨基二苯甲酮，1,3-双（3-氨基苯氧基） - 亚乙基，4,4'-双（3-氨基苯氧基）联苯，2,2-双[4 - （3-氨基苯氧基） - 苯基]丙烷，2,2-双[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3-六氟丙烷，双[4（3-氨基苯氧基）苯基 ]硫醚，双[4-（3-氨基苯氧基）苯基]酮和双[4-（3-氨基苯氧基）苯基]砜与四羧酸二酐包括均苯四酸二酐，3,3'，4,4'-二苯甲酮四羧酸二酐 ，3,3'，4,4'-联苯四羧酸二酐和双（3,4-二羧基苯基）醚二酐在有机溶剂中，并通过热或化学酰亚胺化得到的聚酰胺酸。 如此获得的聚酰亚胺具有相对较低的熔体粘度并且可在高温下流动。 因此，通过加压加压将铜箔和聚酰亚胺膜组装，加压固化，得到具有与铜箔牢固连接的聚酰亚胺膜的柔性铜包覆电路基板。

公开(公告)号：US4847349A

公开(公告)日：1989-07-11

申请号：US44028

申请日：1987-06-03

申请人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

发明人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C09J179/08

CPC分类号： C08G73/1039 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C09J179/08

摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radial selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals ae mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, andy is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

摘要翻译： PCT No.PCT / JP86 / 00335 Sec。 371日期：1987年6月3日 102（e）1987年6月3日PCT PCT日期1986年6月30日PCT公布。 出版物WO87 / 01378 公开了具有下式（I）的重复单元的聚酰亚胺及其具有下式（II）的重复单元的聚酰胺酸前体。 （Ⅰ）（Ⅱ）（其中Y是选自由键，碳原子数为1〜10的二价烃，六氟化异亚丙基，羰基，硫基，亚磺酰基，磺酰基和氧化物组成的组的径向，R为 是选自具有2个或更多个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团的四价基团，其中芳族基团与键或交联官能团相互连接） 。 聚酰亚胺和聚酰胺酸的典型实例包括其中Y为硫基，R为Y，R为III或IV，且为异丙叉基，R为IV。 聚合物可以由相应的二胺和四羧酸二酐制备。 本发明的聚酰亚胺或聚酰胺酸对于高温粘合剂是优异的。

公开(公告)号：US4795798A

公开(公告)日：1989-01-03

申请号：US18496

申请日：1987-02-25

申请人： Shoji Tamai ,  Saburo Kawashima ,  Masahiro Ohta ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Saburo Kawashima ,  Masahiro Ohta ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

IPC分类号： C08G73/10

CPC分类号： C08G73/105

摘要： This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'- biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.

摘要翻译： 本发明公开了具有良好的透光率和优异的高温流动性的高温粘合剂，其包含具有由下式（I）表示的重复单元的聚酰亚胺（I）（其中R是选自 由具有不少于2个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团组成的组，其中芳族基团与键或交联官能团相互连接）。 聚酰亚胺通过以二胺组分2,2-二[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3 - 六氟丙烷与四羧酸二酐的反应制备聚酰胺酸得到， 作为均苯四酸二酐，3,3'，4,4'-联苯四羧酸二酐，双（3,4-二羧基苯基）醚二酐和3,3'4,4'-二苯甲酮四羧酸二酐，进一步进行所得物的闭环反应 聚酰胺酸脱水。

公开(公告)号：US5321096A

公开(公告)日：1994-06-14

申请号：US35043

申请日：1993-03-22

申请人： Yuichi Okawa ,  Nobuhito Koga ,  Hideaki Oikawa ,  Tadashi Asanuma ,  Akihiro Yamaguchi

发明人： Yuichi Okawa ,  Nobuhito Koga ,  Hideaki Oikawa ,  Tadashi Asanuma ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08L71/00 ,  C08L79/08 ,  C08L81/06 ,  C08F283/04 ,  C08G69/48

CPC分类号： C08L71/00 ,  C08G73/101 ,  C08L79/08 ,  C08L81/06

摘要： A thermoplastic resin composition comprise 99.9.about.50 parts by weight of one or more thermoplastic resin selected from the group consisting of aromatic polyimide, aromatic polyetherimide, aromatic polyamideimide, aromatic polyethersulfone and aromatic polyether ketone and 0.1.about.50 parts by weight of one or more liquid crystal type aromatic polyimide having recurring structural units represented by the formula (1): ##STR1## wherein R.sub.1 .about.R.sub.5 is a hydrogen atom, fluorine atom, trifluoromethyl, methyl, ethyl or cyano and may be the same or different, and R is a tetravalent radical having 6.about.27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member.The present invention can provide thermoplastic resin compositions which have remarkably good processability and excellent thermal stability in addition to essentially excellent properties of each resin.

摘要翻译： 热塑性树脂组合物包含99.9重量份的一种或多种选自芳族聚酰亚胺，芳族聚醚酰亚胺，芳族聚酰胺酰亚胺，芳族聚醚砜和芳族聚醚酮的热塑性树脂和0.1重量份的一种或多种液体 具有由式（1）表示的重复结构单元的结晶型芳族聚酰亚胺：（1）n原子，氟原子，三氟甲基，甲基，乙基或氰基，可以相同或不同，R是具有 6个碳原子，并且选自由直链或桥构件相互连接的单芳族基团，缩合多芳族基团和非缩合芳族基团组成的组。 本发明可以提供具有非常好的加工性和优异的热稳定性的热塑性树脂组合物，除了每种树脂的基本上优异的性能。

公开(公告)号：US5459233A

公开(公告)日：1995-10-17

申请号：US143148

申请日：1993-12-07

申请人： Shoji Tamai ,  Masahiro Ohta ,  Saburo Kawashima ,  Katsuaki Iiyama ,  Hideaki Oikawa ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Masahiro Ohta ,  Saburo Kawashima ,  Katsuaki Iiyama ,  Hideaki Oikawa ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08L79/08 ,  C08G69/26

CPC分类号： C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08L79/08

摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

公开(公告)号：US5346982A

公开(公告)日：1994-09-13

申请号：US72691

申请日：1993-06-07

申请人： Shoji Tamai ,  Katsuaki Iiyama ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Katsuaki Iiyama ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G69/26

CPC分类号： C08G73/1071 ,  Y10S526/935

摘要： A polyimide-based heat-resistant adhesive having excellent peel strength and heat resistance comprising polyimide composed of 10 to 99% by mole of structural units having the formula (1) and 1 to 90% by mole of structural units having the formula (2) or comprising polyamic acid precursor which corresponds to the polyimide. ##STR1##

摘要翻译： 具有优异的剥离强度和耐热性的聚酰亚胺系耐热粘合剂，其包含10〜99摩尔％的具有式（1）的结构单元和1〜90摩尔％的具有式（2）的结构单元的聚酰亚胺， 或包含对应于聚酰亚胺的聚酰胺酸前体。 （1） （2）

公开(公告)号：US5283313A

公开(公告)日：1994-02-01

申请号：US795748

申请日：1991-11-21

申请人： Wataru Yamashita ,  Shoji Tamai ,  Akihiro Yamaguchi

发明人： Wataru Yamashita ,  Shoji Tamai ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08K7/02 ,  C08L77/00 ,  C08L77/10 ,  C08L79/08 ,  C08G8/02 ,  C08G69/26

CPC分类号： C08G73/1071 ,  C08G73/1014 ,  C08G73/1067 ,  C08K7/02

摘要： A readily processable polyimide being blocked at the terminal of a polymer molecule with a divalent radical derived from dicarboxylic acid anhydride represented by the formula (IV): ##STR1## wherein Z is a divalent radical selected from the group consisting of a monoaromatic radical which is substantially unsubstituted or substituted with a radical having no reactivity with amine or carboxylic acid anhydride and has from 5 to 15 carbons atoms, condensed polyaromatic radical or noncondensed aromatic radical connected each other with a direct bond or a bridge member, and having a fundamental skeleton represented by recurring structural units of the formula (III): wherein X and Y are --O-- or --CO-- and differ each other; preparation process of the polyimide; and resin composition containing the polyimide and fibrous reinforcement.

摘要翻译： 在具有由式（IV）表示的二羧酸酐衍生的二价基团的聚合物分子的末端封闭的易加成聚酰亚胺：（*化学结构*）（Ⅳ）其中Z是选自以下的二价基团： 的单芳族基团，其基本上未被取代或被不与胺或羧酸酐反应并且具有5至15个碳原子的基团取代，缩合的多芳族基团或非缩合的芳族基团彼此直接连接或桥接成员， 具有由式（III）的重复结构单元表示的基本骨架：（*化学结构*）（III）其中X和Y是-O-或-CO-并且彼此不同; 聚酰亚胺的制备工艺; 和含有聚酰亚胺和纤维增强物的树脂组合物。

公开(公告)号：US5278276A

公开(公告)日：1994-01-11

申请号：US9091

申请日：1993-01-26

申请人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

发明人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C09J179/08

CPC分类号： C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C09J179/08

摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

摘要翻译： 公开了具有下式（I）的重复单元的聚酰亚胺及其具有下式（II）的重复单元的聚酰胺酸前体; （*化学结构*）（I）（*化学结构*）（II）（其中Y是选自由键，碳数1〜10的二价烃，六氟化异亚丙基，羰基，硫代，亚磺酰基， 磺酰基和氧化物，R是选自具有2个或更多个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非稠合多芳族基团中的四价基团，其中芳族基团相互连接 具有键或交联功能）。 聚酰亚胺和聚酰胺酸的典型实例包括其中Y为硫基，R为（*化学结构*）（III）（*化学结构*）（IV）Y为键，R为III或IV，Y为异丙叉基 而R是IV。 聚合物可以由相应的二胺和四羧酸二酐制备。 本发明的聚酰亚胺或聚酰胺酸对于高温粘合剂是优异的。

公开(公告)号：US5252700A

公开(公告)日：1993-10-12

申请号：US871517

申请日：1992-04-21

申请人： Hideaki Okikawa ,  Shoji Tamai ,  Katsuaki Iiyama ,  Saburo Kawashima ,  Akihiro Yamaguchi ,  Tadashi Asanuma

发明人： Hideaki Okikawa ,  Shoji Tamai ,  Katsuaki Iiyama ,  Saburo Kawashima ,  Akihiro Yamaguchi ,  Tadashi Asanuma

IPC分类号： C08G73/10 ,  C09J179/08 ,  H05K3/38 ,  C08G69/26 ,  C08G63/00

CPC分类号： C08G73/1071 ,  C08G73/1014 ,  C08G73/1017 ,  C09J179/08 ,  H05K3/386 ,  Y10S525/928

摘要： The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.