公开(公告)号：US20050011987A1

公开(公告)日：2005-01-20

申请号：US10859835

申请日：2004-06-02

Applicant: Alain Lemaire ,  Laurent Lemaire ,  Francois Ruel ,  Marcel Dion ,  Yves Martin

Inventor： Alain Lemaire ,  Laurent Lemaire ,  Francois Ruel ,  Marcel Dion ,  Yves Martin

IPC: A47K10/36 ,  B65H26/00

CPC classification number: A47K10/3662

Abstract: The invention comprises a system and a method for discriminating a roll placed in a paper roll dispenser, as well as a paper roll with a core comprising at least one passive element having an electrical conductivity different from that of the core, to be used in conjunction with the dispenser. The system comprises at least two conducting plates located within the paper roll dispenser such that when the roll is positioned within the dispenser, the plates are in proximity of the roll, the plates being electrically insulated from each other, means for detecting capacitance between the plates and generating a signal indicative of said capacitance and means for discriminatng said paper roll based on a value of the signal.

Abstract translation: 本发明包括用于区分放置在纸卷分配器中的卷的系统和方法，以及具有芯的纸卷，该纸卷包括至少一个具有不同于芯的导电性的无源元件，以被结合使用 与分配器。 该系统包括位于纸卷分配器内的至少两个导电板，使得当辊位于分配器内时，板位于辊附近，板彼此电绝缘，用于检测板之间的电容的装置 并产生指示所述电容的信号，以及用于基于所述信号的值鉴别所述纸卷的装置。

公开(公告)号：US06702186B1

公开(公告)日：2004-03-09

申请号：US09512248

申请日：2000-02-24

Applicant: Hendrik F. Hamann ,  Yves Martin ,  Hemantha Kumar Wickramasinghe

Inventor： Hendrik F. Hamann ,  Yves Martin ,  Hemantha Kumar Wickramasinghe

IPC: G06K1906

CPC classification number: G11B5/00 ,  B82Y10/00 ,  B82Y25/00 ,  G11B5/127 ,  G11B5/33 ,  G11B5/3903 ,  G11B5/3909 ,  G11B9/1409 ,  G11B9/1418 ,  G11B11/007 ,  G11B2005/0002 ,  G11B2005/0005 ,  G11B2005/001 ,  G11B2005/0016 ,  G11B2005/0021 ,  Y10S977/865 ,  Y10S977/867

Abstract: The invention discloses in one embodiment a parallel probe array (N×M) incorporating thermal near-field heaters (or writers) as well as magnetic sensors (or readers), which can be moved en bloc as well as independently of each other. To this end, the present invention uses a suitable controlling electronics for coordinating a parallel or quasi-parallel reading/writing, as well as controlling the positioning of an individual probe in an array. The control electronics enables the addressing of an individual or preselected set of probes, for controlling reading and/or writing, thereby securing the considerable advantage of versatility and efficiency of reading/writing in a parallel operation mode.

Abstract translation: 本发明在一个实施例中公开了一种并入探头阵列（NxM），其包括热近场加热器（或写入器）以及磁传感器（或读取器），其可以整体移动并且彼此独立。 为此，本发明使用合适的控制电子装置来协调并行或准并行读/写，以及控制单个探针在阵列中的定位。 控制电子器件能够寻址单个或预选的探针组，用于控制读取和/或写入，从而确保在并行操作模式下读取/写入的通用性和效率的显着优点。

公开(公告)号：US06532125B1

公开(公告)日：2003-03-11

申请号：US09408946

申请日：1999-09-30

Applicant: Hendrik F. Hamann ,  Yves Martin ,  Hemantha Kumar Wickramasinghe

Inventor： Hendrik F. Hamann ,  Yves Martin ,  Hemantha Kumar Wickramasinghe

IPC: G11B502

CPC classification number: G11B11/10536 ,  G11B5/00 ,  G11B5/012 ,  G11B13/045 ,  G11B2005/0002 ,  G11B2005/0005 ,  G11B2005/0021 ,  Y10S977/833 ,  Y10S977/943

Abstract: The invention discloses novel apparatus/methodology for writing/erasing high-density data on a digital recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in the apparatus, particularly for realizing the methodology in a substantially thermal near-field mode. The invention provides advantages of data storage densities greater than that of diffraction limited systems, for example, data storage densities of approximately greater than 100 Gbit/inch2, and writing speeds approximately greater than 100 MHz.

Abstract translation: 本发明公开了一种用于在数字记录介质上写入/擦除高密度数据的新型装置/方法。 本发明的优选实施例的特征在于可以在该装置中使用的新颖的热近场加热器，特别是用于实现基本上热近场模式的方法。 本发明提供了数据存储密度大于衍射受限系统的优点，例如大约大于100Gbit / inch2的数据存储密度，以及大约大于100MHz的写入速度。

公开(公告)号：US06233206B1

公开(公告)日：2001-05-15

申请号：US09427169

申请日：1999-10-26

Applicant: Hendrik F. Hamann ,  Yves Martin ,  Hemantha Kumar Wickramasinghe

Inventor： Hendrik F. Hamann ,  Yves Martin ,  Hemantha Kumar Wickramasinghe

IPC: G11B1100

CPC classification number: G11B5/00 ,  B82Y10/00 ,  G11B9/1409 ,  G11B2005/0002 ,  G11B2005/0005 ,  G11B2005/0021 ,  Y10S977/833 ,  Y10S977/862 ,  Y10S977/863 ,  Y10S977/865 ,  Y10S977/867 ,  Y10S977/881

Abstract: The assembly of the present invention preferably writes by way of thermal near-field coupling between a thermal heater and a media. The thermal heater may comprise an atomic force microscope probe or a magnetic force microscope; and, preferably reads by way of a local magnetic sensor preferably comprising a magnetic force microscope which can yield spatial resolutions down to e.g., 250 Å.

Abstract translation: 本发明的组件优选地通过热式加热器和介质之间的热近场耦合来写入。 热加热器可以包括原子力显微镜探针或磁力显微镜; 并且优选地通过优选地包括磁力显微镜的本地磁传感器来读取，所述磁力显微镜可以产生低于例如250的空间分辨率。

公开(公告)号：US20120018873A1

公开(公告)日：2012-01-26

申请号：US13251371

申请日：2011-10-03

Applicant: Sushumna Iruvanti ,  Yves Martin ,  Theodore Van Kessel ,  Xiaojin Wei

Inventor： Sushumna Iruvanti ,  Yves Martin ,  Theodore Van Kessel ,  Xiaojin Wei

IPC: H01L23/495

CPC classification number: H01L23/433 ,  H01L23/10 ,  H01L23/367 ,  H01L24/32 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/83385 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/3511 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2224/8381

Abstract: A method and a package for circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.

Abstract translation: 一种具有弯曲结构的电路芯片封装的方法和封装。 所述电路芯片封装包括：具有第一热膨胀系数（CTE）的衬底; 具有安装在所述基板上的第二CTE的电路芯片; 设置在与芯片热接触的电路芯片上的金属箔; 金属盖，其具有（i）与第一CTE不同的第三CTE和（ii）底部边缘区域，金属盖设置在与金属箔热接触的金属箔上; 以及沿着金属盖的底部边缘的粘合剂层，在第一温度下固化，将盖结合到基底上，产生在第二温度下被转换成弯曲的电路芯片封装的组件。

公开(公告)号：US20110248458A1

公开(公告)日：2011-10-13

申请号：US13084713

申请日：2011-04-12

Applicant: Martin Belanger ,  Mathieu Boivin ,  Martin Gauthier ,  Yves Martin

Inventor： Martin Belanger ,  Mathieu Boivin ,  Martin Gauthier ,  Yves Martin

IPC: B62B3/00 ,  B32B3/06 ,  B32B7/12

CPC classification number: B29C65/483 ,  B29C65/524 ,  B29C65/562 ,  B29C65/565 ,  B29C66/126 ,  B29C66/322 ,  B29C66/474 ,  B29C66/54 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/72525 ,  B29C66/8322 ,  B29C70/443 ,  B62B5/0006 ,  B64D11/0007 ,  F16B5/126 ,  F16B11/006 ,  F16B21/16 ,  Y10T428/24008 ,  Y10T428/24017 ,  Y10T428/24322 ,  B29K2309/08

Abstract: Is hereby provided a method of securing a plastic part to a composite structure, the method comprising providing a composite structure, performing at least one hole in the composite structure, providing a plastic part including a surface and at least one pin extending therefrom, the at least one pin being sized and designed to mate with the at least one hole to create a clamping force capable of temporarily securing the plastic part to the composite structure, applying bonding material between the surface and the composite structure to bond the surface to the composite structure, engaging the at least one pin with the corresponding at least one hole and adding pressure to engage the at least one pin with the corresponding at least one hole and spreading the bonding material between the plastic part and the composite structure, and curing the bonding material to permanently secure the additional part to the composite structure. A plastic part adapted to be secured to a composite structure with pins thereof and a composite materials galley cart comprising parts secured thereof with pins are also hereby provided.

Abstract translation: 因此提供了将塑料部件固定到复合结构的方法，该方法包括提供复合结构，在复合结构中执行至少一个孔，提供包括表面的塑料部分和从其延伸的至少一个销， 至少一个销尺寸和设计成与所述至少一个孔配合以产生能够暂时将所述塑料部件固定到所述复合结构上的夹紧力，在所述表面和所述复合结构之间施加结合材料以将所述表面粘合到所述复合结构 将所述至少一个销与相应的至少一个孔接合并且增加压力以将所述至少一个销与相应的至少一个孔接合并将所述粘合材料铺展在所述塑料部分和所述复合结构之间，并且固化所述接合材料 将附加部件永久固定到复合结构体上。 还提供了一种塑料部件，其适于被固定到具有销的复合结构和复合材料厨房车，其包括用销固定的部件。

公开(公告)号：US07697291B2

公开(公告)日：2010-04-13

申请号：US11751334

申请日：2007-05-21

Applicant: Yves Martin ,  Theodore G. Van Kessel

Inventor： Yves Martin ,  Theodore G. Van Kessel

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

Abstract translation: 本发明是用于冷却半导体热源的方法和装置。 在一个实施例中，提供了散热器，并且包括用于支撑半导体热源的衬底和耦合到衬底的散热器。 通道设置在散热器和基板之间。 该通道具有至少一个由散热器限定的壁。 由散热器限定的通道壁的表面积为半导体热源的底面的表面积的约10至约100倍。 冷却剂，例如液态金属，在通道内循环。

公开(公告)号：US20080101870A1

公开(公告)日：2008-05-01

申请号：US11814303

申请日：2006-01-17

Applicant: Yves Martin ,  Jean-François Desplat

Inventor： Yves Martin ,  Jean-François Desplat

IPC: E02B17/00

CPC classification number: B63B35/4413 ,  B63B1/107 ,  B63B2001/128

Abstract: The support (1) includes a working deck (2) and floatation members (3) supporting this deck (2). According to the invention, the spacing between the vertical axes (Z) passing through the centre of the floatation members (3) is such that the sum of the moments, taken in relation to the horizontal axis passing through the centre of the support (1) is perpendicular to the swell direction, of the vertical excitation forces of the swell on the floatation members (3) situated on one side of the vertical plane (P) passing through this horizontal axis is equal to the corresponding sum associated with the floatation members (3) situated on the other side of this plane, when the swell period is equal to the period of a swell having this direction and of which the yearly probability of being encountered on the site or the support where it is installed is 1/100.

Abstract translation: 支撑件（1）包括支撑该甲板（2）的工作甲板（2）和浮起部件（3）。 根据本发明，通过浮选构件（3）的中心的垂直轴线（Z）之间的间距使得相对于穿过支撑件（1）的中心的水平轴线获得的力矩之和 ）垂直于膨胀方向，位于通过该水平轴线的垂直平面（P）的一侧上的浮动构件（3）上的膨胀的垂直激励力等于与浮动构件相关联的相应总和 （3）位于该平面的另一侧，当膨胀周期等于具有该方向的膨胀周期，并且其在现场遇到的年度概率或安装位置的支撑位是1/100 。

公开(公告)号：US07288840B2

公开(公告)日：2007-10-30

申请号：US11037670

申请日：2005-01-18

Applicant: Bruce K. Furman ,  Yves Martin ,  Theodore G. van Kessel

Inventor： Bruce K. Furman ,  Yves Martin ,  Theodore G. van Kessel

IPC: H01L23/34

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.

Abstract translation: 一种用于冷却表面的装置，其具有由具有高导热性的材料制成的金属结构，并且被设计成在使金属结构和表面之间的机械应力最小化的同时提供有效的表面冷却。

公开(公告)号：US20070238282A1

公开(公告)日：2007-10-11

申请号：US11220878

申请日：2005-09-06

Applicant: Bruce Furman ,  Yves Martin ,  Theodore Kessel

Inventor： Bruce Furman ,  Yves Martin ,  Theodore Kessel

IPC: H01L21/44

CPC classification number: H01L23/3736 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T428/1452 ,  Y10T428/1476 ,  Y10T428/31678 ,  H01L2924/00

Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includes applying an adhesive to the interface surface. A metal film is then bonded to the adhesive, thereby easily adapting the interface surface for bonding to the liquid metal.

Abstract translation: 在一个实施例中，本发明是用于芯片冷却的方法和装置。 用于将液态金属接合到界面表面（例如，集成电路芯片的表面或散热器的相对表面）的本发明方法的一个实施例包括将粘合剂施加到界面表面。 然后将金属膜粘合到粘合剂上，从而容易地使界面表面适应于液体金属的粘结。