公开(公告)号：US11817534B1

公开(公告)日：2023-11-14

申请号：US17856958

申请日：2022-07-02

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Sami Torvinen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: H01L33/60 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US11385399B1

公开(公告)日：2022-07-12

申请号：US17704393

申请日：2022-03-25

Applicant: TactoTek Oy

Inventor： Vinski Bräysy ,  Jarmo Sääski ,  Mikko Heikkinen ,  Ilpo Hänninen ,  Pasi Korhonen ,  Giovanni Ferri

IPC: F21V8/00

Abstract: An integrated functional multilayer structure includes substrate film, circuitry provided upon the substrate film including a first light source and a monolithic lightguide layer, the lightguide layer includes a first surface and an opposite second surface, the second surface facing the first light source and a portion of the first surface containing, a pre-defined outcoupling area for the light emitted by the first light source and transmitted within the lightguide layer, the lightguide layer further containing a light leakage prohibition region and the attenuation of emitted light effectuated on a direct optical path between the first light source and the outcoupling area is less than the attenuation effectuating on a optical path between the first light source and the light leakage prohibition region. A related method of manufacture is also presented.

公开(公告)号：US20210157047A1

公开(公告)日：2021-05-27

申请号：US17152978

申请日：2021-01-20

Applicant: TACTOTEK OY

Inventor： Antti Keränen ,  Mikko Heikkinen

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US10986733B2

公开(公告)日：2021-04-20

申请号：US15813397

申请日：2017-11-15

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03 ,  B29L31/34

Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.

公开(公告)号：US10813222B2

公开(公告)日：2020-10-20

申请号：US16747614

申请日：2020-01-21

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03 ,  B29L31/34

Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

公开(公告)号：US10667396B2

公开(公告)日：2020-05-26

申请号：US15687095

申请日：2017-08-25

Applicant: TactoTek Oy

Inventor： Antti Keranen ,  Ronald Haag ,  Mikko Heikkinen

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/40 ,  H05K3/28

Abstract: Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.

公开(公告)号：US10660211B2

公开(公告)日：2020-05-19

申请号：US15030883

申请日：2014-09-25

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keranen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03 ,  B29L31/34

Abstract: A method for manufacturing an electromechanical structure includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the film in relation to a desired three-dimensional shape of the film, forming the film into the substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film.

公开(公告)号：US10561019B2

公开(公告)日：2020-02-11

申请号：US15687157

申请日：2017-08-25

Applicant: TactoTek Oy

Inventor： Tero Heikkinen ,  Antti Keranen ,  Mikko Heikkinen ,  Jarmo Saaski

IPC: H05K1/03 ,  F21V3/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/46 ,  F21Y115/10 ,  F21Y115/15

Abstract: Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

公开(公告)号：US10251278B2

公开(公告)日：2019-04-02

申请号：US16123479

申请日：2018-09-06

Applicant: TACTOTEK OY

Inventor： Mikko Heikkinen ,  Jarmo Saaski

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/12 ,  H05K3/32 ,  H05K3/28

Abstract: A method for manufacturing a multilayer structure for an electronic device includes obtaining a flexible substrate film; printing a number of conductor traces on the flexible substrate film; providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further includes a second surface area adjacent to the first surface area; molding first thermoplastic material on the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; and molding second thermoplastic material on the adjacent second surface area and on at least part of the first surface area, wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity.

公开(公告)号：US09990455B1

公开(公告)日：2018-06-05

申请号：US15840549

申请日：2017-12-13

Applicant: TactoTek Oy

Inventor： Hasse Sinivaara ,  Tuomas Heikkilä ,  Antti Keränen

IPC: G06F17/50 ,  G05B19/4099

CPC classification number: G06F17/5072 ,  G05B19/4099 ,  G05B2219/45031 ,  G06F17/5018 ,  G06F17/5081 ,  G06F2217/02 ,  G06F2217/04 ,  G06F2217/06 ,  G06F2217/12

Abstract: An electronic arrangement for facilitating circuit layout design in connection with three-dimensional (3D) target designs, the arrangement including at least one communication interface for transferring data, at least one processor for processing instructions and other data, and a memory for storing the instructions and other data. The at least one processor being configured, in accordance with the stored instructions, to cause: obtaining and storing information in a data repository hosted by the memory, receiving design input characterizing 3D target design to be produced from a substrate, determining a mapping between locations of the 3D target design and the substrate, and establishing and providing digital output comprising human and/or machine readable instructions indicative of the mapping to a receiving entity, such as a manufacturing equipment, e.g. printing, electronics assembly and/or forming equipment.