Abstract:
A micromachine manufacturing method according to this invention includes at least the movable portion formation step of selectively etching a single-crystal silicon layer by using a movable portion formation mask pattern as a mask, thereby forming on the single-crystal silicon layer a movable portion which is coupled to the surrounding single-crystal silicon layer via a coupling portion on a buried oxide, the movable portion protective film formation step of forming a movable portion protective film on the single-crystal silicon layer so as to cover the movable portion while the movable portion is formed on the buried oxide, and the step of forming a buried protective film which covers the movable portion exposed in the substrate opening and movable portion opening, and the single-crystal silicon layer around the movable portion while the movable portion protective film is formed.
Abstract:
An integrated device has a spring having at least two split parts that are not in direct electrical contact with each other. The integrated device also has a substrate and a movable part, where both parts of the spring are configured between the substrate and the movable part to support the movable part on the substrate. The two or more split parts of the spring enable two or more independent voltages to be applied to the movable part. The split spring of the invention may be used in MEMS devices for optical switches in order to provide independent voltages to the movable part(s) in those devices.
Abstract:
A MEMS-based optical switch having improved characteristics and methods for manufacturing the same are provided. In accordance with one embodiment, an optical switch includes a single comb drive actuator having a deflecting beam structure and a mirror coupled to the actuator. The mirror is capable of being moved between an extended position interposed between waveguide channels and a retracted position apart from the waveguide channels. The actuator applies a force capable of deflecting the beam structure and moving the mirror to one of the extended positions or the retracted position and the beam structure returns the mirror to the other of the extended position or the retracted position in the absence of the application of force.
Abstract:
A micro mirror unit includes a moving part carrying a mirror portion, a frame and torsion bars connecting the moving part to the frame. The moving part, the frame and the torsion bars are formed integral from a material substrate. The frame includes a portion thicker than the moving part.
Abstract:
A MEMS system including a fixed electrode and a suspended moveable electrode that is controllable over a wide range of motion. In traditional systems where an fixed electrode is positioned under the moveable electrode, the range of motion is limited because the support structure supporting the moveable electrode becomes unstable when the moveable electrode moves too close to the fixed electrode. By repositioning the fixed electrode from being directly underneath the moving electrode, a much wider range of controllable motion is achievable. Wide ranges of controllable motion are particularly important in optical switching applications.
Abstract:
The present invention is generally directed to a method and assembly for elevating and supporting a microstructure of a MEM system generally by engaging a positioning system of the MEM system with a first elevator lifter. The MEM system generally includes a first microstructure (such as a mirror) disposed in vertically spaced relation to a substrate. The positioning system generally includes an actuator assembly movably interconnected with the substrate, an elevator pivotally interconnected with the substrate and further interconnected with the microstructure, and a tether interconnecting the actuator assembly and the elevator. The first elevator lifter is provided to engage the elevator to lift/elevate the microstructure away from the substrate generally after fabrication of the MEM system and prior to utilizing the microstructure in operation of the MEM system.
Abstract:
A bi-stable micro-actuator is formed from a first and a second silicon-on-insulator wafer fused together at an electrical contact layer. A cover with a V-groove defines an optical axis. A collimated optical signal source in the V-groove couples an optical signal to an optical port in the V-groove. A mirror surface on a transfer member blocks or reflects the optical signal. The transfer member has a point of support at the first and second end. The mirror blocks or reflects the optical axis. An expandable structure applies a compressive force between the first and second point of support of the transfer member along a compressive axis to hold the transfer member in a bowed first state or a bowed second state. A control signal applied to a heating element in the expandable structure reduces the compressive force, switching the transfer member to a second state.
Abstract:
A microelectromechanical systems (MEMS) element, MEMS optical switch and MEMS fabrication method are described. The MEMS element comprises a crystalline and moveable element is moveably attached to the substrate. The moveable element includes a perpendicular portion oriented substantially perpendicular to a plane of the substrate. The crystal structure of the perpendicular portion and substrate are substantially similar. The moveable element moveable is moveably attached to the substrate for motion substantially constrained to a plane oriented substantially perpendicular to a plane of the substrate. In at least one position, a part of a perpendicular portion of the moveable element projects beyond a surface of the substrate. The moveable element may be retained in place by a latch. The perpendicular portion may be formed substantially perpendicular portion to the substrate. An array of such structures can be implemented to work as an optical switch. The optical switch may comprise a crystalline substrate and one or more moveable elements moveably attached to the substrate The MEMS elements may be fabricated by providing a substrate; forming one or more trenches in the substrate to define a perpendicular portion of a element; and moveably attaching the moveable element to a first surface of the substrate; removing a portion of the substrate such that at least a part of the perpendicular portion projects beyond a second surface of the substrate. The various embodiments provide for a robust and reliable MEMS elements that may be simply fabricated and densely packed.
Abstract:
A zipper actuator for optical beam control has an optical port formed through the substrate. The cantilevered beam of the actuator preferably includes a paddle for switching the optical signal. Mirror structures can be provided on the paddle for beam switching. In some embodiments, MEMS or electrode latches are further provided.
Abstract:
A microelectronic reflector is fabricated by forming a first polysilicon layer on a microelectronic substrate, forming a first phosphosilicate glass (PSG) layer on the first polysilicon layer, and reactive ion etching to remove the first PSG layer from at least a portion of the first polysilicon layer. A second polysilicon layer is formed on at least a portion of the first polysilicon layer from which the first PSG layer was removed and a second PSG layer is formed on at least a second portion of the second polysilicon layer. Reactive ion etching is performed to remove the second PSG layer from at least a portion of the second polysilicon layer. A third PSG layer then is formed on at least a portion of the second polysilicon layer from which the second PSG layer was removed. Reactive ion etching is performed to remove the third PSG layer from at least a portion of the second polysilicon layer. By forming a third PSG layer, and reactive ion etching this layer, additional stress may be created in the first and/or second doped polysilicon layers that bends the ends of the doped first and/or second polysilicon layers towards the microelectronic substrate upon release of the treated polysilicon layer from the substrate, compared to doped polysilicon layers on which the third PSG layer was not formed and reactive ion etched. This increased stress may be counteracted by forming a stress-correcting layer on at least a portion of the second polysilicon layer from which the third PSG layer was removed, and then forming a reflective layer such as gold on at least a portion of the stress-correcting layer. The stress-correcting layer preferably comprises platinum, which can produce high stresses that can counteract the stresses in the first and second doped polysilicon layers, to thereby allow a flat mirror and/or beam to be produced.