公开(公告)号：US20030224117A1

公开(公告)日：2003-12-04

申请号：US10117788

申请日：2002-04-05

Applicant: Interantional Business Machines Corporation

Inventor： Cherie R. Kagan ,  Chun Lin

IPC: B05D001/36

CPC classification number: B82Y30/00 ,  B05D1/185 ,  B05D7/52 ,  B82Y40/00 ,  Y10T428/12493 ,  Y10T428/261 ,  Y10T428/31504 ,  Y10T428/31536 ,  Y10T428/31663

Abstract: The present invention provides a process for preparing a thin film having alternating monolayers of a metal-metal bonded complex monolayer and an organic monolayer by layer-by-layer growth. The process comprises the steps of: (1) applying onto a surface of a substrate a first linker compound to produce a primer layer; (2) applying onto said primer layer a layer of a metal-metal bonded complex to produce a metal-metal bonded complex monolayer on said primer layer; (3) applying onto said metal-metal bonded complex monolayer a second linker compound; and optionally (4) sequentially repeating steps (2) and (3) at least once to produce said layer-by-layer grown thin film having alternating monolayers of a metal-metal bonded complex monolayer and an organic monolayer.

Abstract translation: 本发明提供了通过逐层生长制备具有金属 - 金属键合复合单层和有机单层的交替单层的薄膜的方法。 该方法包括以下步骤：（1）在基材的表面上施加第一接头化合物以产生底漆层; （2）在所述底漆层上施加一层金属 - 金属键合复合物，以在所述底漆层上产生金属 - 金属键合复合单层; （3）在所述金属键合复合单层上施加第二接头化合物; 和任选地（4）顺序地重复步骤（2）和（3）至少一次以产生具有金属 - 金属键合复合单层和有机单层的交替单层的逐层生长薄膜。

公开(公告)号：US20030224116A1

公开(公告)日：2003-12-04

申请号：US10158024

申请日：2002-05-30

Inventor： Erli Chen ,  Stephen Y. Chou

IPC: B05D001/36

CPC classification number: B82Y20/00 ,  G02B6/105 ,  G02B6/1225 ,  H01L23/3171 ,  H01L23/5222 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for non-conformally coating nanometer-sized surface structures includes directing the overcoat material at an oblique angle onto a substrate having a nanometer-sized surface structure so that the overcoat material is only deposited substantially on the top portions of the nanometer-sized surface structures without filling the gaps between the nanometer-sized surface structures. Because the overcoat material is deposited onto the nanometer-sized surface structures obliquely, the overcoat material gradually closes the gaps between the nanometer-sized surface structures and form a continuous layer over the nanometer-sized surface structures.

Abstract translation: 用于非保形涂覆纳米尺寸表面结构的方法包括将外涂层材料以倾斜角度引导到具有纳米尺寸表面结构的基底上，使得外涂层材料仅基本沉积在纳米尺寸表面的顶部 结构，而不填充纳米尺寸表面结构之间的间隙。 由于外涂层材料倾斜地沉积在纳米尺寸的表面结构上，外涂层材料逐渐封闭纳米尺寸表面结构之间的间隙，并在纳米尺寸的表面结构上形成连续层。

公开(公告)号：US20030215566A1

公开(公告)日：2003-11-20

申请号：US10269769

申请日：2002-10-14

Inventor： Moriss Kung ,  Kwun-Yao Ho

IPC: B05D005/12 ,  B05D001/32 ,  B05D001/36

CPC classification number: H05K3/1258 ,  H05K1/095 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4664 ,  H05K2201/0257 ,  H05K2203/0191 ,  H05K2203/0568 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: A fine patterning and fine solid via process with printing method for multi-layer substrate, which including the following steps, providing a substrate which is completed from the pre-process; placing a dielectric layer on at least one surface of the substrate; defining via and circuit on the dielectric layer with the laser ablation; printing the surface of the dielectric layer with sub-micro conductive paste and stuffing said via and circuit on the dielectric layer to form complete via and circuit structure. Finally, proceeding the planarization process on the conductive paste placed on the surface of the substrate to form the complete conductive circuit and via structure at the same time.

Abstract translation: 具有以下步骤的多层基板的精细图案化和精细固体通过印刷方法，提供从预处理完成的基板; 将介质层放置在所述衬底的至少一个表面上; 通过激光烧蚀在电介质层上定义通孔和电路; 用亚微导电膏印刷电介质层的表面，并在介电层上填充所述通孔和电路以形成完整的通孔和电路结构。 最后，对放置在基板表面的导电糊进行平面化处理，同时形成完整的导电电路和通孔结构。

公开(公告)号：US20030207022A1

公开(公告)日：2003-11-06

申请号：US10136295

申请日：2002-05-02

Inventor： Avraham Shekalim ,  Ascher Shmulewitz

IPC: B05D001/36

CPC classification number: B05C5/0216 ,  B05B12/12 ,  B05B13/0442

Abstract: The present invention is a method and device, which is suitable for use in an operating theater just prior to implantation, for selectively applying a medical coating to an implantable medical device, for example a stent. Disclosed is a device for use with a stent deployed on a catheter balloon. The device is configured to apply a medical coating of a desired thickness to the surface of a stent only. This is done by use of a drop-on-demand ink-jet printing system in association with an optical scanning device. The device is further configured so as to, if necessary, apply a plurality of layered coats, each layered coat being of a different coating material, and if appropriate, different thickness. The section of the housing in which the stent is held during the coating procedure is detachable from the housing base. The detachable housing section may be easily cleaned and re-sterilized or simply disposed of.

公开(公告)号：US20030180552A1

公开(公告)日：2003-09-25

申请号：US10163033

申请日：2002-06-05

Inventor： Wim J. van Ooij ,  Senthil K. Jayaseelan ,  Eric A. Mee

IPC: B05D001/36

CPC classification number: C08J5/124 ,  B05D7/14 ,  B05D7/16 ,  B05D7/54 ,  C08J2321/00 ,  C09D4/00 ,  C09D5/44 ,  C09D5/4419 ,  C09D183/08 ,  C09D183/14 ,  C23C22/02 ,  C23C2222/20 ,  C25D13/20 ,  Y10T428/31663 ,  C08G77/26 ,  C08G77/00

Abstract: A method of treating a metal substrate by applying a coating of a silane composition having at least one substantially unhydrolyzed aminosilane having one or more secondary or tertiary amino groups. Methods of adhering a polymer (such as rubber) to a metal substrate are also provided.

Abstract translation: 通过施加具有至少一个具有一个或多个仲或叔氨基的基本上未水解的氨基硅烷的硅烷组合物的涂层来处理金属基材的方法。 还提供了将聚合物（例如橡胶）粘合到金属基底上的方法。

公开(公告)号：US20030165627A1

公开(公告)日：2003-09-04

申请号：US10359402

申请日：2003-02-05

Inventor： Robert L. Heimann ,  Bruce Flint ,  Ravi Chandran ,  Jonathan L. Bass ,  James S. Falcone JR.

IPC: B05D001/36

CPC classification number: C23C22/83 ,  C23C22/60 ,  C25D9/08

Abstract: An electroless or electrolytic process for treating metallic surfaces is disclosed. The disclosed process exposes the metallic surface to a first medium comprising at least one silicate, and then to a second medium comprising colloidal silica (additional processing steps can be employed before, between and after exposure to the first and second mediums). The first and second mediums can be electrolytic or electroless.

Abstract translation: 公开了用于处理金属表面的无电解或电解方法。 所公开的方法将金属表面暴露于包含至少一种硅酸盐的第一介质，然后暴露于包含胶体二氧化硅的第二介质（在第一和第二介质暴露之前，之后和之后可以使用附加的处理步骤）。 第一和第二介质可以是电解或无电解的。

公开(公告)号：US20030163932A1

公开(公告)日：2003-09-04

申请号：US10329601

申请日：2002-12-26

Applicant: Honda Giken Kogyo Kabushiki Kaisha

Inventor： Keiichi Samekawa ,  Yuji Itou ,  Hideyuki Sawaki ,  Minoru Suzuki ,  Yasuhiro Kume

IPC: F26B019/00 ,  F26B025/06 ,  B05D001/36 ,  B05D007/00 ,  F26B025/00

CPC classification number: B05D7/546 ,  B05D7/14 ,  F26B2210/12

Abstract: Sequentially carried out are: a sealing-agent applying step of applying a sealing agent to a predetermined portion of a vehicle body; a coating step of applying a coating material to the vehicle body after the sealing-agent applying step; and a baking step of baking the coating material to the vehicle body after the coating step. Further, a sealing-agent drying step of drying the sealing agent by heating only the predetermined portion of the vehicle body is carried out between the sealing-agent applying step and the coating step. Thus, the sealing agent applied partially to the vehicle body can be dried with a high thermal efficiency in the process of forming a coating on the vehicle body.

Abstract translation: 依次执行的是：将密封剂施加到车体的预定部分的密封剂施加步骤; 在密封剂涂布工序之后，向车体涂布涂料的涂布工序; 以及在涂布步骤之后将涂料烘烤到车体的烘烤步骤。 此外，在密封剂涂布步骤和涂布步骤之间进行密封剂干燥步骤，其通过仅加热车体的预定部分来干燥密封剂。 因此，在车身上形成涂层的过程中，部分地施加于车体的密封剂能够以高热效率被干燥。

公开(公告)号：US20030148115A1

公开(公告)日：2003-08-07

申请号：US10355018

申请日：2003-01-31

Applicant: AFG INDUSTRIES, INC.

Inventor： Darin Glenn ,  Herb Johnson ,  Rand Dannenberg ,  Peter A. Sieck ,  Joe Countrywood

IPC: C23C014/00 ,  B05D001/36

CPC classification number: C03C17/3618 ,  C03C17/36 ,  C03C17/3626 ,  C03C17/3639 ,  C03C17/3644 ,  C03C17/3652 ,  C03C17/366 ,  C03C2217/78 ,  G02B5/282 ,  Y10T428/12618 ,  Y10T428/24975 ,  Y10T428/265

Abstract: A low-emissivity multilayer coating includes, in order outward from the substrate, a first layer including a layer containing titanium oxide, a layer containing silicon nitride, or a sublayer layer containing titanium oxide in combination with a sublayer containing silicon nitride; a second layer including Ag; a third layer including at least one layer selected from titanium oxide layers and silicon nitride layers; a fourth layer including Ag; and a fifth layer including silicon nitride. The color of the coatings can be varied over a wide range by controlling the thicknesses of the layers of titanium oxide, silicon nitride and Ag. A diffusion barrier of oxidized metal protects relatively thin, high electrical conductivity, pinhole free Ag films grown preferentially on zinc oxide substrates. Oxygen and/or nitrogen in the Ag films improves the thermal and mechanical stability of the Ag. Dividing the first layer of titanium oxide, the Ag layers, and/or the third layer with a sublayer of oxidized metal can provide greater thermal and mechanical stability to the respective layers.

公开(公告)号：US20030134050A1

公开(公告)日：2003-07-17

申请号：US10316092

申请日：2002-12-11

Inventor： Tatsuo Kunishi ,  Toshi Numata ,  Junichi Saitoh ,  Yukio Sakabe

IPC: B05D005/12 ,  B05D001/36 ,  B05D001/18

CPC classification number: H01G4/248 ,  C23C18/31 ,  C23C18/32 ,  C23C18/54 ,  H01G2/065 ,  H05K3/246

Abstract: The present invention provides a method for forming a desired plating film on a desired place at a reasonable cost. When workpieces are mixed in a plating solution containing Ni ions with a great number of Zn particles having an average diameter of 1 mm and having an electrochemically base immersion potential with respect to the precipitation potential of Ni, the Zn particles are dissolved and generates electrons, the potential of Cu electrodes in contact with the Zn particles is shifted to an electrochemically base potential side, and hence the Ni ions are precipitated on the electrodes, thereby forming Ni plating films on the surfaces of the electrodes. In a manner equivalent to the above, when Zn particles are immersed in a plating solution containing Sn ions, the Zn particles are dissolved and generates electrons, the potential of the Ni plating films in contact with the Zn particles is shifted to an electrochemically base potential side, and hence the Sn ions are precipitated on the Ni plating films, thereby forming Sn plating films.

Abstract translation: 本发明提供了一种以合理的成本在期望的地方形成期望的镀膜的方法。 当将工件在含有Ni离子的电镀溶液中与大量平均直径为1mm的Zn颗粒混合并且相对于Ni的析出电位具有电化学碱浸渍电位时，Zn颗粒被溶解并产生电子， 与Zn粒子接触的Cu电极的电位移动到电化学碱电位侧，因此在电极上析出Ni离子，从而在电极表面形成Ni镀膜。 以与上述相同的方式，当Zn颗粒浸入含有Sn离子的镀液中时，Zn颗粒溶解并产生电子，与Zn颗粒接触的Ni镀膜的电位移动到电化学碱电位 从而在Ni镀膜上析出Sn离子，形成Sn镀膜。

公开(公告)号：US20030129429A1

公开(公告)日：2003-07-10

申请号：US10308321

申请日：2002-12-03

Inventor： Matthew M. DeAngelis

IPC: B05D001/36

CPC classification number: B05D7/587 ,  B05D3/0493 ,  B05D5/12 ,  B05D2508/00 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/49021 ,  Y10T29/4908 ,  Y10T428/31786 ,  B05D2420/03 ,  B05D2420/01 ,  B05D2420/02

Abstract: A degassed polyester varnish is applied to the transduction driver to increase surface dielectric strength (insulation resistance), driver voltage breakdown, physical protection, and heat and water resistance. A vacuum chamber application process is used to apply the polyester varnish. The disclosed coating technique is applicable to all transducer drive materials and all transducer types.

Abstract translation: 将脱气的聚酯清漆施加到转导驱动器以增加表面介电强度（绝缘电阻），驱动器电压击穿，物理保护以及耐热和耐水性。 使用真空室涂布工艺来涂布聚酯清漆。 所公开的涂覆技术适用于所有传感器驱动材料和所有传感器类型。