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公开(公告)号：US20220294169A1
公开(公告)日：2022-09-15
申请号：US17201414
申请日：2021-03-15
摘要： A method for joining two workpiece parts during a manufacturing process includes forming a first workpiece part having a first mating surface and forming a second workpiece part having a second mating surface. The first and second workpiece part may be separately distributed or may be joined for distribution. To join the parts, an energy director is formed in the first mating surface by an automated process, the energy director comprising an end portion projecting from the first mating surface such that the projecting end portion of the energy director engages the second mating surface when the first and second workpiece parts are brought into engagement with each other. In one example, the first and second workpiece parts are ultrasonically welded by pressing the parts together while vibrating at least one of the first workpiece part or the second workpiece part.
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公开(公告)号：US11374306B2
公开(公告)日：2022-06-28
申请号：US16324322
申请日：2017-08-23
发明人： Ja-myeong Koo , Jeong-gen Yoon , Young-chul Lee , Myeong-hwa Kim , Tae-hyeong Kim , Yeon-kwan Moon , Min-goo Seo , Seung-yup Lee
摘要： An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conductive first coating layer coated on one surface of the metal pad, wherein the light reflectivity of the first coating layer is lower than the light reflectivity of the metal pad.
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公开(公告)号：US20220194014A1
公开(公告)日：2022-06-23
申请号：US17691830
申请日：2022-03-10
申请人： Hesse GmbH
摘要： A method for producing an electrically conductive connection between a contact surface of a functional component and a connection component. The connection component is pressed against the contact surface of the functional component with a normal force using a bonding tool. The bonding tool and the connection component are brought in contact with same to vibrate ultrasonically. A laser beam is generated by a laser generator and directed onto the bonding tool, and preferably onto a tip of the bonding tool, whereby the tip of the bonding tool is heated. An actual temperature of the tip is contactlessly measured and the laser generator is operated intermittently and/or with an adjustable laser output such that a predefined target temperature is adjusted at the tip of the bonding tool.
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公开(公告)号：US20220190537A1
公开(公告)日：2022-06-16
申请号：US17643288
申请日：2021-12-08
申请人： Yazaki Corporation
发明人： Kotarou WADA , Naoki Takamura , Naokazu Nagasaka
摘要： A connector includes: a terminal fitting having a terminal part and a conductor connecting part; a housing in which the terminal fitting is housed; and a conductive component that is molded as a laminate body including an electrical conductor and an electrical insulator and having a through-hole, and causes the electrical conductor to be physically and electrically connected to the conductor connecting part inserted into the through-hole when the electrical conductor is soldered to the conductor connecting part. The conductor connecting part is formed in a tubular part with two ends butted each other in a contact state so that end faces that are the non-plated surfaces of the two ends do not appear on the surface, and the entire outer wall surface of the tubular part is a plating layer.
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公开(公告)号：US20220181817A1
公开(公告)日：2022-06-09
申请号：US17544936
申请日：2021-12-08
发明人： Chingtien Chen , Wei Wan , Xiaojuan Qi
IPC分类号： H01R13/504 , H01R13/6581 , H01R43/02
摘要： An electrical connector complied with HDMI 2.1 including an insulating body, multiple terminals, and a metallic shell enclosing portions of the insulating body and the terminals is provided. The ten terminals includes a first terminal Data2+, a third terminal Data2−, a fifth terminal Data Shield, a seventh terminal Data0+, a ninth terminal Data0−, an eleventh terminal Data3 Shield, a thirteenth terminal CEC, a fifteenth terminal SCL, a seventeenth terminal DDC/CEC Ground, and a nineteenth terminal Hot Plug Detec1 arranged in an arrangement direction in sequence. The nine terminals includes a second terminal Data2 Shield, a fourth terminal Data1+, a sixth terminal Data1−, an eighth terminal Data0 Shield, a tenth terminal Data3+, a twelfth terminal Data3−, a fourteenth terminal Utility, a sixteenth terminal SDA, and an eighteenth terminal +5V Power arranged in an arrangement direction in sequence.
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公开(公告)号：US11342632B2
公开(公告)日：2022-05-24
申请号：US16342710
申请日：2018-01-05
申请人： LG CHEM, LTD.
发明人： Jung-Hoon Lee , Dal-Mo Kang , Sang-Woo Ryu , Jeong-O Mun , Jin-Yong Park , Ho-June Chi
IPC分类号： H01M50/502 , B60R16/033 , H01R4/02 , H01M50/20 , H01M50/531 , B60L50/64 , B60K6/28 , H01R43/02
摘要： A battery module includes a plurality of pouch-type secondary batteries arranged to be stacked in at least one direction, each secondary battery having an electrode lead, and a bus bar made of an electrically conductive material and bonded to at least two electrode leads of corresponding secondary batteries to electrically connect the corresponding secondary batteries to each other. Each bonded electrode lead may be configured to protrude from the corresponding secondary battery in a front and rear direction, and at least one of left and right side surfaces of each bonded electrode lead may be bonded to the bus bar.
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公开(公告)号：US20220143763A1
公开(公告)日：2022-05-12
申请号：US17386579
申请日：2021-07-28
申请人： TING-JUI WANG
发明人： TING-JUI WANG
摘要： A method of mounting a connection element structure on a target is introduced and includes providing a lifting-laying tool to lift the connection element structure; moving the connection element structure to a default height above a mounting position of the target with the lifting-laying tool; and releasing or loosening the connection element structure from the lifting-laying tool to lay the connection element structure at the mounting position of the target. Therefore, the method can mount the connection element structure on the target, enhancing the efficiency of subsequent processes.
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公开(公告)号：US11322278B2
公开(公告)日：2022-05-03
申请号：US15380871
申请日：2016-12-15
申请人： The Boeing Company
发明人： John Porter
摘要： A system is provided for wire processing. The wire processing system may include a wire transport, a processing station that may provide wire to the wire transport, a processing station that may move an electrical component threaded onto the wire, and a processing station that may move the electrical component to a position on the wire for further processing.
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公开(公告)号：US20220118545A1
公开(公告)日：2022-04-21
申请号：US17505139
申请日：2021-10-19
发明人： Walter Weinerth , Wenting Yan , Sean McFadden
摘要： An apparatus includes a set of pre-welding electrodes including a shape-forming electrode having a contact face. The contact face has a shape-forming structure shaping a cross-section of a first segment of a first wire with a pre-welding shape upon compression of the contact face against the first segment. The pre-welding shape has a reentrance accommodating a second segment of a second wire to be welded to the first wire.
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公开(公告)号：US20220109257A1
公开(公告)日：2022-04-07
申请号：US17401366
申请日：2021-08-13
申请人： PEGATRON CORPORATION
发明人： Yung-Tai Lee , Kai-Wen Lee , Tse-Hao Yang , Yen-Yen Chiu
摘要： Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.
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