公开(公告)号：US10473920B2

公开(公告)日：2019-11-12

申请号：US15245805

申请日：2016-08-24

Applicant: STMicroelectronics S.r.l.

Inventor： Giorgio Allegato ,  Sonia Costantini ,  Federico Vercesi ,  Roberto Carminati

IPC: G02B26/10 ,  B81C1/00 ,  G02B26/08

Abstract: Disclosed herein is a micro-electro mechanical (MEMS) device including a substrate, and a MEMS mirror stack on the substrate. A first bonding layer seals against ingress of environmental contaminants and mechanically anchors the MEMS mirror stack to the substrate. A cap layer is formed on the MEMS mirror stack. A second boding layer seals against ingress of environmental contaminants and mechanically anchors the cap layer to the MEMS mirror stack.

公开(公告)号：US10461209B2

公开(公告)日：2019-10-29

申请号：US15140880

申请日：2016-04-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Massimo Cataldo Mazzillo ,  Antonella Sciuto ,  Dario Sutera

IPC: H01L31/107 ,  H01L31/0224 ,  H01L31/18

Abstract: An avalanche photodiode for detecting ultraviolet radiation, including: a silicon carbide body having a first type of conductivity, which is delimited by a front surface and forms a cathode region; an anode region having a second type of conductivity, which extends into the body starting from the front surface and contacts the cathode region; and a guard ring having the second type of conductivity, which extends into the body starting from the front surface and surrounds the anode region.

公开(公告)号：US20190326867A1

公开(公告)日：2019-10-24

申请号：US16378872

申请日：2019-04-09

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto DANIONI ,  Alessandro MORCELLI

IPC: H03F3/70 ,  H04R19/04

Abstract: In at least one embodiment, an interface electronic circuit for a capacitive acoustic transducer having a sensing capacitor is provided. The interface electronic circuit includes an amplifier, a voltage regulator, a common-mode control circuit, and a reference generator. The amplifier has an input coupled to an electrode of the sensing capacitor. The voltage regulator is configured to receive a regulator reference voltage, generate a regulated voltage based on the regulator reference voltage, and supply the regulated voltage to a supply input of the amplifier. The common-mode control circuit controls a common-mode voltage present on the input of the amplifier based on a common-mode reference voltage. The reference generator receives a supply voltage and generates the regulator reference voltage and the common-mode reference voltage with respective values that are variable as a function of the supply voltage.

公开(公告)号：US20190326231A1

公开(公告)日：2019-10-24

申请号：US16389849

申请日：2019-04-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Santo Alessandro SMERZI ,  Michele CALABRETTA ,  Alessandro SITTA ,  Crocifisso Marco Antonio RENNA ,  Giuseppe D'ARRIGO

IPC: H01L23/00 ,  H01L23/06 ,  H01L23/14 ,  H01L21/52

Abstract: A process for manufacturing a strained semiconductor device envisages: providing a die of semiconductor material, in which elementary components of the semiconductor device have been integrated by means of initial front-end steps; and coupling, using the die-attach technique, the die to a support, at a coupling temperature. The aforesaid coupling step envisages selecting the value of the coupling temperature at a value higher than an operating temperature of use of the semiconductor device, and moreover selecting the material of the support so that it is different from the material of the die in order to determine, at the operating temperature, a coupling stress that is a function of the different values of the coefficients of thermal expansion of the materials of the die and of the support and of the temperature difference between the coupling temperature and the operating temperature. Furthermore, additional stress can be enhanced by means of different embodiments involving the support, such as ring or multi-layer frame.

公开(公告)号：US10453833B2

公开(公告)日：2019-10-22

申请号：US15839501

申请日：2017-12-12

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L23/498 ,  H01L25/065 ,  H01L21/56 ,  H05K1/18 ,  H01L27/02 ,  H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L23/66 ,  H01L23/00 ,  H01L21/683 ,  H01L25/10 ,  H01L21/66

Abstract: An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.

公开(公告)号：US20190319617A1

公开(公告)日：2019-10-17

申请号：US16375233

申请日：2019-04-04

Applicant: STMicroelectronics S.r.l.

Inventor： Francesco Pulvirenti ,  Salvatore Cassata ,  Salvatore Giuseppe Privitera

IPC: H03K17/687 ,  H03K17/16 ,  G01R19/00

Abstract: A dead-time circuit includes a signal propagation path from a first input node receiving a PWM modulated control signal to an output node, such signal propagation path switchable between a non-conductive state and a conductive state, such that the signal at the first input node is transferred to the output node when the signal propagation path is in the conductive state. The dead-time circuit further includes a differentiator circuit block coupled to a second input node and to the signal propagation path, the second input node configured to be coupled to an intermediate node of a half-bridge circuit. The differentiator circuit block switches the signal propagation path between the non-conductive state and the conductive state as a function of a time derivative of a signal at the second input node. At least one time-delay circuit component delays transfer of the signal at the first input node to the output node.

公开(公告)号：US20190319538A1

公开(公告)日：2019-10-17

申请号：US16385284

申请日：2019-04-16

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (Alps) SAS

Inventor： Francois Druilhe ,  Patrik Arno ,  Alessandro Inglese ,  Michele Alessandro Carrano

IPC: H02M3/158 ,  H02M1/36

Abstract: A power supply system includes a voltage application source, and a switched mode power supply having an output coupled to the voltage application source through a first path and through a second path different from the first path. A first node is coupled to the output of the switched mode power supply, the switched mode power supply being configured to couple the first node to the voltage application source through the first path in a first operating mode and through the second path in a different second operating mode. A digital regulator is coupled to the first node. A digital circuit is coupled to an output of the digital regulator. An analog regulator is coupled to the first node and an analog circuit coupled to an output of the analog regulator.

公开(公告)号：US20190312136A1

公开(公告)日：2019-10-10

申请号：US16377080

申请日：2019-04-05

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro Paolo BRAMANTI ,  Alberto PAGANI

IPC: H01L29/76 ,  H01L29/10 ,  H01L29/423

Abstract: A device includes a particle propagation channel, a particle deflector, a particle source, and a particle sink. The particle deflector facilitates ballistic transport of particles from a particle inflow portion through a particle flow deflection portion to a particle outflow portion. The particle deflector is arranged at the particle flow deflection portion and is activatable to deflect particles in the flow deflection portion and is configured to selectively prevent the particles from reaching the particle outflow portion. The particle source and particle sink are configured to cause a current path of the particles through the device.

公开(公告)号：US20190311976A1

公开(公告)日：2019-10-10

申请号：US16370193

申请日：2019-03-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Francesco SALAMONE ,  Cristiano Gianluca STELLA

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.

公开(公告)号：US20190310860A1

公开(公告)日：2019-10-10

申请号：US16375695

申请日：2019-04-04

Applicant: STMicroelectronics S.r.l.

Inventor： Pasquale Vastano ,  Amedeo Veneroso

IPC: G06F9/4401 ,  H04L9/08

Abstract: A method for managing storage of an operating system in an integrated circuit card, includes: subdividing an operating system into a plurality of operating system components; associating one or more operating system components of the plurality of operating system components to a descriptor indicating a version of the one or more operating system components; downloading the one or more operating system components to a memory of the integrated circuit card, wherein the downloading includes verifying if an operating system component stored in the integrated circuit card is a same version of the one or more operating system components being downloaded; based on the verifying, storing the one or more operating system components in the card if the version is different; and based on the verifying discarding the one or more operating system components from the download operation if the version is the same.