公开(公告)号：US20140065414A1

公开(公告)日：2014-03-06

申请号：US14005577

申请日：2012-03-22

申请人： Kazuyuki Tamura ,  Takashi Akutsu ,  Yuki Eto ,  Tomohide Hukuzaki

发明人： Kazuyuki Tamura ,  Takashi Akutsu ,  Yuki Eto ,  Tomohide Hukuzaki

IPC分类号： C09J7/02

CPC分类号： C09J7/0296 ,  B32B27/36 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2310/0831 ,  B32B2405/00 ,  C08G18/4825 ,  C08G18/672 ,  C08G18/755 ,  C08G18/8029 ,  C08G2170/40 ,  C09J7/25 ,  C09J7/29 ,  C09J175/16 ,  C09J2203/326 ,  C09J2475/006 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2809 ,  Y10T428/31551 ,  C08G18/48

摘要： The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

摘要翻译： 本发明的基膜是用于层压在半导体晶片上的压敏粘合片的基膜，其由以下组成：（A）固化产物层，其中包含聚醚多元醇聚氨酯（甲基）丙烯酸酯低聚物和 能量射线固化性单体通过能量射线照射而固化，（B）热塑性树脂层。 通过使用表面保护片，本发明通过凸起来保护晶片的电路侧，防止在研磨后表面时在电路侧的凸起的塌陷，并且防止在研磨表面上产生凹痕或裂纹。

公开(公告)号：US08372792B2

公开(公告)日：2013-02-12

申请号：US12668798

申请日：2008-08-08

申请人： Takashi Tanaka ,  Kazutaka Zenfuku

发明人： Takashi Tanaka ,  Kazutaka Zenfuku

IPC分类号： C11D7/50

CPC分类号： C11D7/265 ,  C11D7/263 ,  C11D7/3227 ,  C11D7/5022 ,  C11D11/0041 ,  H05K3/26

摘要： The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water.

摘要翻译： 本发明的目的是提供一种新颖的清洁剂组合物，其不仅可以通过火焰降低点火并且对环境的影响较小，而且还具有优异的性质，即溶解粘附在窄部分上的焊剂残余物或者在 用无铅焊料进行焊接的待清洁物体，并且可以减少水洗过程中物体的再污染。 本发明使用由特定的式表示的无卤素的有机溶剂（A） 由特定的式表示的胺系化合物（B） 不含氨基的螯合剂（C）; 并根据需要提供水。

公开(公告)号：US08318885B2

公开(公告)日：2012-11-27

申请号：US12772972

申请日：2010-05-03

申请人： Kimihiro Matsukawa ,  Takeshi Fukuda ,  Hideki Goda

发明人： Kimihiro Matsukawa ,  Takeshi Fukuda ,  Hideki Goda

IPC分类号： C08G77/28 ,  C08G77/04 ,  C08G77/06 ,  C08G77/08

CPC分类号： C09K3/10 ,  C08G18/44 ,  C08G18/755 ,  C08G59/4085 ,  C08G59/66 ,  C08G75/045 ,  C08L83/08 ,  C09D183/08 ,  Y10T428/10 ,  Y10T428/24942 ,  Y10T428/249921 ,  C08L2666/14

摘要： A curable resin composition which is easily cured by heating or ultraviolet irradiation and capable of forming a thick cured film due to low shrinkage. This curable resin composition enables to obtain a cured product satisfying various characteristics such as heat resistance, chemical resistance, high surface hardness and high refractive index. Also disclosed is a cured product obtained from such a composition. Specifically disclosed is a curable resin composition containing at least one substance selected from the group consisting of condensates (A) obtained by hydrolyzing and condensing a thiol group-containing alkoxysilane (a1) represented by the following general formula: R1Si(OR2)3  (1) (wherein, R1 represents a hydrocarbon group having at least one thiol group and 1-8 carbon atoms or an aromatic hydrocarbon group having at least one thiol group, and R2 represents a hydrogen atom, a hydrocarbon group having 1-8 carbon atoms or an aromatic hydrocarbon group), compounds (B) having an epoxy group, compounds (C) having an isocyanate group and compounds (D) having a carbon-carbon double bond.

摘要翻译： 一种固化性树脂组合物，其通过加热或紫外线照射容易固化，并且能够由于低收缩而形成厚固化膜。 该固化性树脂组合物能够得到满足耐热性，耐化学性，高表面硬度，高折射率等各种特性的固化物。 还公开了由这种组合物获得的固化产物。 具体公开了含有选自由以下通式表示的含硫醇基的烷氧基硅烷（a1）得到的冷凝物（A）中的至少一种以上的固化性树脂组合物：R1Si（OR2）3（1 ）（其中，R1表示具有至少一个硫醇基和1-8个碳原子的烃基或具有至少一个硫醇基的芳族烃基，R 2表示氢原子，具有1-8个碳原子的烃基或 芳香族烃基），具有环氧基的化合物（B），具有异氰酸酯基的化合物（C）和具有碳 - 碳双键的化合物（D）。

公开(公告)号：US08211845B2

公开(公告)日：2012-07-03

申请号：US12999471

申请日：2009-08-17

申请人： Keita Tanaka ,  Takashi Tanaka

发明人： Keita Tanaka ,  Takashi Tanaka

IPC分类号： C11D7/16 ,  C11D7/26 ,  C11D7/32 ,  C11D7/50 ,  B08B3/04

CPC分类号： B23K1/206 ,  B23K3/08 ,  C11D7/16 ,  C11D7/265 ,  C11D7/3227 ,  C11D11/0047 ,  H05K3/26

摘要： An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid.The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.

摘要翻译： 本发明的目的是提供一种清洁剂组合物，其具有理想的清洁性能，并且即使在清洁通过使用无铅焊剂产生的物体时也容易与预漂洗水分离; 以及使用可以减少废液量的预漂洗方法的无铅助焊剂去除系统。 本发明使用清洁剂组合物用于无铅助焊剂，其包含（A）特定的二醇醚; （B）特定的聚氧化烯胺; 和（C）螯合剂，其为选自（c1）脂肪族羟基羧酸螯合剂和（c2）（多）磷酸螯合剂中的至少一种的螯合剂。

公开(公告)号：US20110244326A1

公开(公告)日：2011-10-06

申请号：US12672887

申请日：2008-07-14

申请人： Hitotoshi Murase ,  Toshio Otagiri ,  Kyoichi Kinoshita ,  Katsufumi Tanaka ,  Manabu Miyoshi

发明人： Hitotoshi Murase ,  Toshio Otagiri ,  Kyoichi Kinoshita ,  Katsufumi Tanaka ,  Manabu Miyoshi

IPC分类号： H01M4/62 ,  H01M4/139

摘要： It is an assignment to be solved to provide an electrode for secondary battery, electrode in which the active material is suppressed from coming off or falling down from the electricity collector, and that has excellent cyclic performance.It is characterized in that, in an electrode for secondary battery, the electrode being manufactured via an application step of applying a binder resin and an active material onto a surface of electricity collector, said binder resin is an alkoxysilyl group-containing resin that has a structure being specified by formula (I): wherein “R1” is an alkyl group whose number of carbon atoms is from 1 to 8; “R2” is an alkyl group or alkoxyl group whose number of carbon atoms is from 1 to 8; and “q” is an integer of from 1 to 100.

摘要翻译： 为了提供二次电池用电极，抑制活性物质从集电体脱落或掉落的电极，具有优异的循环性能，是要解决的问题。 其特征在于，在二次电池用电极中，电极通过将粘合剂树脂和活性物质涂布在集电体的表面上的施加步骤制造，所述粘合剂树脂是含有烷氧基甲硅烷基的树脂，其具有 结构由式（I）表示：其中“R1”是碳原子数为1至8的烷基; “R2”是碳原子数为1〜8的烷基或烷氧基; “q”为1〜100的整数。

公开(公告)号：US20110094545A1

公开(公告)日：2011-04-28

申请号：US12999471

申请日：2009-08-17

申请人： Keita Tanaka ,  Takashi Tanaka

发明人： Keita Tanaka ,  Takashi Tanaka

IPC分类号： B08B3/04 ,  C11D3/60

CPC分类号： B23K1/206 ,  B23K3/08 ,  C11D7/16 ,  C11D7/265 ,  C11D7/3227 ,  C11D11/0047 ,  H05K3/26

摘要： An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid.The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.

摘要翻译： 本发明的目的是提供一种清洁剂组合物，其具有理想的清洁性能，并且即使在清洁通过使用无铅焊剂产生的物体时也容易与预漂洗水分离; 以及使用可以减少废液量的预漂洗方法的无铅助焊剂去除系统。 本发明使用清洁剂组合物用于无铅助焊剂，其包含（A）特定的二醇醚; （B）特定的聚氧化烯胺; 和（C）螯合剂，其为选自（c1）脂肪族羟基羧酸螯合剂和（c2）（多）磷酸螯合剂中的至少一种的螯合剂。

公开(公告)号：US20100215937A1

公开(公告)日：2010-08-26

申请号：US12772972

申请日：2010-05-03

申请人： Kimihiro Matsukawa ,  Takeshi Fukuda ,  Hideki Goda

发明人： Kimihiro Matsukawa ,  Takeshi Fukuda ,  Hideki Goda

IPC分类号： C08L83/08 ,  B32B17/10

CPC分类号： C09K3/10 ,  C08G18/44 ,  C08G18/755 ,  C08G59/4085 ,  C08G59/66 ,  C08G75/045 ,  C08L83/08 ,  C09D183/08 ,  Y10T428/10 ,  Y10T428/24942 ,  Y10T428/249921 ,  C08L2666/14

摘要： A curable resin composition which is easily cured by heating or ultraviolet irradiation and capable of forming a thick cured film due to low shrinkage. This curable resin composition enables to obtain a cured product satisfying various characteristics such as heat resistance, chemical resistance, high surface hardness and high refractive index. Also disclosed is a cured product obtained from such a composition. Specifically disclosed is a curable resin composition containing at least one substance selected from the group consisting of condensates (A) obtained by hydrolyzing and condensing a thiol group-containing alkoxysilane (a1) represented by the following general formula: R1Si(OR2)3  (1) (wherein, R1 represents a hydrocarbon group having at least one thiol group and 1-8 carbon atoms or an aromatic hydrocarbon group having at least one thiol group, and R2 represents a hydrogen atom, a hydrocarbon group having 1-8 carbon atoms or an aromatic hydrocarbon group), compounds (B) having an epoxy group, compounds (C) having an isocyanate group and compounds (D) having a carbon-carbon double bond.

摘要翻译： 一种固化性树脂组合物，其通过加热或紫外线照射容易固化，并且能够由于低收缩而形成厚固化膜。 该固化性树脂组合物能够得到满足耐热性，耐化学性，高表面硬度，高折射率等各种特性的固化物。 还公开了由这种组合物获得的固化产物。 具体公开了含有选自由以下通式表示的含硫醇基的烷氧基硅烷（a1）得到的冷凝物（A）中的至少一种以上的固化性树脂组合物：R1Si（OR2）3（1 ）（其中，R1表示具有至少一个硫醇基和1-8个碳原子的烃基或具有至少一个硫醇基的芳族烃基，R 2表示氢原子，具有1-8个碳原子的烃基或 芳香族烃基），具有环氧基的化合物（B），具有异氰酸酯基的化合物（C）和具有碳 - 碳双键的化合物（D）。

公开(公告)号：US20080115861A1

公开(公告)日：2008-05-22

申请号：US11794203

申请日：2005-12-27

申请人： Fumio Ishiga ,  Yasuo Chiba ,  Kazushige Kajita

发明人： Fumio Ishiga ,  Yasuo Chiba ,  Kazushige Kajita

IPC分类号： B23K35/36

CPC分类号： C22C13/00 ,  B22F2998/00 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  H05K3/3484 ,  C22C1/0483

摘要： A flux for a lead-free solder that is able to reduce “void(s) appear within solder joint”, “void(s) appear within solder joint”, and “solder-balling” without impairing general solderabilities. The flux for a lead-free solder comprising 6-55 wt % of a polyvalent alcohol ester of a resin acid (a1) as a base resin (A). Further, a solder paste comprising the said flux for a lead-free solder and a lead-free solder powder provides a very small number of void(s) or a very small amount thereof.

摘要翻译： 用于无铅焊料的助焊剂，能够减少焊点内的​​“空隙”，“焊点内出现空隙”和“焊接球”，而不会损害一般的焊接性。 用于无铅焊料的助熔剂，其包含6至55重量％的作为基础树脂（A）的树脂酸（a 1）的多价醇酯。 此外，包含用于无铅焊料的所述焊剂和无铅焊料粉末的焊膏提供非常少量的空隙或非常少量的空隙。

公开(公告)号：US5880240A

公开(公告)日：1999-03-09

申请号：US952926

申请日：1997-11-26

申请人： Takaharu Tsuno

发明人： Takaharu Tsuno

IPC分类号： C08F212/14 ,  C08F212/36 ,  C08F2/18 ,  C08F212/12

CPC分类号： C08F212/36 ,  C08F212/14

摘要： An alkyl-containing porous resin with a specific surface area of 50 to 600 m.sup.2 /g, the resin being prepared by polymerizing a monomer mixture of, based on the total weight of the monomers, 15 to 97% by weight of divinylbenzene, 0 to 82% by weight of at least one aromatic monovinyl monomer selected from the group consisting of styrene, methylstyrene and ethylvinylbenzene and 3 to 50% by weight of a vinylbenzyloxyalkane derivative represented by the formula ##STR1## wherein n is an integer of 1 to 18, a process for its preparation and its use.The porous resin of the invention is capable of fully exhibit its modified functions based on the variations of chemical and structural environments on the surface of resin, the functions being modified by introducing alkyl groups having varying chain lengths.

摘要翻译： PCT No.PCT / JP97 / 01049 Sec。 371日期：1997年11月26日 102（e）日期1997年11月26日PCT 1997年3月27日PCT公布。 公开号WO97 / 36950 PCT 日期1997年10月9日一种比表面积为50〜600m 2 / g的含烷基的多孔树脂，其树脂通过使基于单体总重量的单体混合物聚合15〜97重量％ 的二乙烯基苯，0至82重量％的至少一种选自苯乙烯，甲基苯乙烯和乙基乙烯基苯的芳族单乙烯基单体和3至50重量％由式（1）表示的乙烯基苄氧基烷烃衍生物，其中n 是1〜18的整数，其制备方法及其用途。 本发明的多孔树脂能够基于树脂表面上的化学和结构环境的变化来充分发挥其改性的功能，其功能是通过引入具有不同链长度的烷基来改性的。

公开(公告)号：US5808133A

公开(公告)日：1998-09-15

申请号：US796344

申请日：1997-02-07

申请人： Takaharu Tsuno ,  Hideki Kobayashi

发明人： Takaharu Tsuno ,  Hideki Kobayashi

IPC分类号： C07C29/149 ,  C07C31/27 ,  C07C51/09 ,  C07C51/31 ,  C07C69/00 ,  C07C69/74

CPC分类号： C07C69/00 ,  C07C29/149 ,  C07C31/278 ,  C07C51/09 ,  C07C51/31 ,  C07B2200/09 ,  C07C2103/00 ,  C07C2103/91

摘要： The invention provides an alicyclic bifunctional compound represented by the formula ##STR1## wherein R is a carboxyl group, a lower alkoxycarbonyl group or a hydroxymethyl group and n is 0 or 1.

摘要翻译： 本发明提供由式（1）表示的脂环式双官能化合物，其中R为羧基，低级烷氧基羰基或羟甲基，n为0或1。