公开(公告)号：US07989819B2

公开(公告)日：2011-08-02

申请号：US12397353

申请日：2009-03-04

Applicant: Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

Inventor： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC: H01L33/00

CPC classification number: H01L33/145 ,  H01L33/387

Abstract: A LED chip including a substrate, a semiconductor device layer, a current blocking layer, a current spread layer, a first electrode and a second electrode is provided. The semiconductor device layer is disposed on the substrate. The current blocking layer is disposed on a part of the semiconductor device layer and includes a current blocking segment and a current distribution adjusting segment. The current spread layer is disposed on a part of the semiconductor device layer and covers the current blocking layer. The first electrode is disposed on the current spread layer, wherein a part of the current blocking segment is overlapped with the first electrode. Contours of the current blocking segment and the first electrode are similar figures. Contour of the first electrode and is within contour of the current blocking segment. The current distribution adjusting segment is not overlapped with the first electrode.

Abstract translation: 提供了包括衬底，半导体器件层，电流阻挡层，电流扩散层，第一电极和第二电极的LED芯片。 半导体器件层设置在基板上。 电流阻挡层设置在半导体器件层的一部分上，并且包括电流阻挡段和电流分布调节段。 电流扩展层设置在半导体器件层的一部分上并覆盖电流阻挡层。 第一电极设置在电流扩展层上，其中电流阻挡段的一部分与第一电极重叠。 当前阻挡段和第一电极的轮廓是相似的图。 第一个电极的等高线并且在当前阻挡段的轮廓内。 电流分布调节段不与第一电极重叠。

公开(公告)号：US07985003B2

公开(公告)日：2011-07-26

申请号：US12197723

申请日：2008-08-25

Applicant: Wen-Lung Su ,  Chin-Chang Hsu ,  Hsuan-Chi Liu

Inventor： Wen-Lung Su ,  Chin-Chang Hsu ,  Hsuan-Chi Liu

IPC: F21S4/00 ,  F21V21/00

CPC classification number: B29C45/0025 ,  H01L33/483 ,  Y10S362/80

Abstract: A forming mold of a light-emitting member includes a frame, an upper mold and a lower mold, and the frame is provided with carriers, pins and supporting portions. The upper and lower molds match with each other to provide a forming space for the base of the light-emitting member. The forming space contains the carriers and a part of the supporting portions. One or more projections are disposed at the position where the brinks of the upper and lower molds contact the supporting portions. After injection molding, the burrs formed by a plastic material along the supporting portions can be concealed in the recesses that are formed corresponding to each of the projections, thereby reducing the influence of the burrs on the external size of the base.

Abstract translation: 发光构件的成形模具包括框架，上模具和下模具，并且框架设置有托架，销和支撑部分。 上模具和下模具彼此匹配以提供用于发光构件的基部的成形空间。 成形空间包含载体和支撑部分的一部分。 一个或多个突起设置在上模具和下模具的边缘接触支撑部分的位置处。 在注射成型之后，沿着支撑部分由塑料材料形成的毛刺可以隐藏在对应于每个突起形成的凹部中，从而减少毛刺对基部的外部尺寸的影响。

公开(公告)号：US20110165706A1

公开(公告)日：2011-07-07

申请号：US13046594

申请日：2011-03-11

Applicant: Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

Inventor： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC: H01L33/48

CPC classification number: H01L33/44 ,  H01L33/387 ,  Y10S438/951

Abstract: A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.

公开(公告)号：US07927901B2

公开(公告)日：2011-04-19

申请号：US12252370

申请日：2008-10-16

Applicant: Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

Inventor： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC: H01L21/00

CPC classification number: H01L33/44 ,  H01L33/387 ,  Y10S438/951

Abstract: A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.

Abstract translation: 提供一种制造发光二极管芯片的方法。 在该方法中，应用半色调掩模处理，灰度色调处理或多色调掩模处理，并与剥离处理相结合，以进一步减少发光二极管芯片的处理步骤。 在本发明中，一些部件也可以通过相同的工艺同时形成，以减少发光二极管芯片的工艺步骤。 因此，本发明中提供的发光二极管的制造方法降低了用于制造发光二极管的成本和时间。

公开(公告)号：US20110045622A1

公开(公告)日：2011-02-24

申请号：US12916642

申请日：2010-11-01

Applicant: Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

Inventor： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC: H01L33/02

CPC classification number: H01L33/20 ,  H01L33/38 ,  H01L33/46

Abstract: In a fabricating method of an LED, a first-type doped semiconductor material layer, a light emitting material layer, and a second-type doped semiconductor material layer are sequentially formed on a substrate. The first-type and second-type doped semiconductor material layers and the light emitting material layer are patterned to form a first-type doped semiconductor layer, an active layer, and a second-type doped semiconductor layer. The active layer is disposed on a portion of the first-type doped semiconductor layer. The second-type doped semiconductor layer is disposed on the active layer and has a first top surface. A wall structure is formed on the first-type doped semiconductor layer that is not covered by the active layer, and the wall structure surrounds the active layer and has a second top surface higher than the first top surface of the second-type doped semiconductor layer. Electrodes are formed on the first-type and second-type doped semiconductor layers.

Abstract translation: 在LED的制造方法中，在衬底上依次形成第一掺杂半导体材料层，发光材料层和第二掺杂半导体材料层。 图案化第一类型和第二类型掺杂半导体材料层和发光材料层以形成第一掺杂半导体层，有源层和第二掺杂半导体层。 有源层设置在第一掺杂半导体层的一部分上。 第二掺杂半导体层设置在有源层上并具有第一顶表面。 在第一型掺杂半导体层上形成壁结构，其不被有源层覆盖，并且壁结构围绕有源层，并且具有比第二类型掺杂半导体层的第一顶表面高的第二顶表面 。 电极形成在第一和第二掺杂半导体层上。

公开(公告)号：US20100261299A1

公开(公告)日：2010-10-14

申请号：US12496644

申请日：2009-07-02

Applicant: Wen-Sung Chang ,  Cheng-Ta Kuo

Inventor： Wen-Sung Chang ,  Cheng-Ta Kuo

IPC: H01L21/56 ,  H01L33/00

CPC classification number: H01L33/52 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A packaging process of a light emitting diode (LED) is provided. First, an LED chip is bonded with a carrier to electrically connect to each other. After that, the carrier is heated to raise the temperature thereof. Next, an encapsulant is formed on the heated carrier by a dispensing process to encapsulate the LED chip, wherein the viscosity of the encapsulant before contacting the carrier is lower than that of the encapsulant after contacting the carrier. Thereafter, the encapsulant is cured.

Abstract translation: 提供了一种发光二极管（LED）的封装工艺。 首先，将LED芯片与载体接合以彼此电连接。 之后，载体被加热以升高其温度。 接下来，通过分配工艺在加热的载体上形成密封剂以封装LED芯片，其中在与载体接触之前，密封剂在与载体接触之前的粘度低于封装剂的粘度。 此后，密封剂固化。

公开(公告)号：US20100237367A1

公开(公告)日：2010-09-23

申请号：US12497703

申请日：2009-07-06

Applicant: Yu-Chun Lee ,  Ya-Hsien Chang ,  Cheng-Ta Kuo

Inventor： Yu-Chun Lee ,  Ya-Hsien Chang ,  Cheng-Ta Kuo

IPC: H01L33/00

CPC classification number: H01L33/501 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package includes a carrier, an LED chip, an encapsulant, a plurality of phosphor particles, and a plurality of anti-humidity particles. The LED chip is disposed on and electrically connected to the carrier. The encapsulant encapsulates the LED chip. The phosphor particles and the anti-humidity particles are distributed within the encapsulant. A first light emitted from the LED chip excites the phosphor particles to emit a second light. Some of the anti-humidity particles are adhered onto a surface of the phosphor particles, while the other anti-humidity particles are not adhered onto the surface of the phosphor particles. The anti-humidity particles absorb H2O so as to avoid H2O from being reacted with the phosphor particles. The LED package of the present application has favorable water resistance.

Abstract translation: 发光二极管（LED）封装包括载体，LED芯片，密封剂，多个荧光体颗粒和多个抗湿颗粒。 LED芯片设置在载体上并与其电连接。 密封剂封装了LED芯片。 荧光体颗粒和抗湿颗粒分布在密封剂内。 从LED芯片发射的第一个光线使荧光体颗粒发射第二个光。 一些抗湿颗粒附着在荧光体颗粒的表面上，而其它的防湿颗粒不附着在荧光体颗粒的表面上。 抗湿颗粒吸收H2O，以避免H2O与荧光体颗粒反应。 本申请的LED封装具有良好的耐水性。

公开(公告)号：USD765753S1

公开(公告)日：2016-09-06

申请号：US29542783

申请日：2015-10-16

Applicant: LEXTAR ELECTRONICS CORP.

Designer： Han-Chung Hsu ,  Shih-Chieh Chin

公开(公告)号：USD715971S1

公开(公告)日：2014-10-21

申请号：US29420396

申请日：2012-05-08

Applicant: Yung-Long Jian ,  Hui-Ying Chen ,  Jiun-Shi Huang

Designer： Yung-Long Jian ,  Hui-Ying Chen ,  Jiun-Shi Huang

公开(公告)号：US08760077B2

公开(公告)日：2014-06-24

申请号：US13689111

申请日：2012-11-29

Applicant: Lextar Electronics Corp. ,  Lextar Electronics Corporation

Inventor： Jin-Yong Jiang

IPC: H05B37/02

CPC classification number: H05B37/0218 ,  A01G7/045 ,  Y02B20/40 ,  Y02B20/46 ,  Y02P60/149

Abstract: A plant illumination apparatus includes a light source module including a first light source and a second light source generating lights having different wavelengths, an environment-detecting module detecting an external environment to obtain a real-time environment parameter, and a control module connected to the light source module and the environment-detecting module. The control module includes a processor unit and a storage unit storing a database of plant growing environment parameters. The processor unit loads at least one preset growing environment parameter corresponding to a plant growth timing from the database of plant growing environment parameters, and compares the preset growing environment parameter with the real-time environment parameter to output at least one comparison result. The processor unit adjusts the first light source and the second light source according to the comparison result, so that an adjusted environment parameter matches the preset growing environment parameter.

Abstract translation: 工厂照明装置包括：光源模块，包括第一光源和产生具有不同波长的光的第二光源，环境检测模块检测外部环境以获得实时环境参数;以及控制模块， 光源模块和环境检测模块。 控制模块包括处理器单元和存储植物生长环境参数数据库的存储单元。 所述处理器单元从所述植物生长环境参数的数据库加载至少一个对应于植物生长时间的预定生长环境参数，并将所述预设生长环境参数与所述实时环境参数进行比较以输出至少一个比较结果。 处理器单元根据比较结果调整第一光源和第二光源，使得调整后的环境参数与预设的生长环境参数相匹配。