公开(公告)号：US06869348B1

公开(公告)日：2005-03-22

申请号：US10680995

申请日：2003-10-07

申请人： Larry A. Spiegel

发明人： Larry A. Spiegel

IPC分类号： B24B37/04 ,  B24B1/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A long-lasting retaining ring for wafer carriers used in chemical mechanical planarization. A groove is disposed around the retaining ring, with the groove opening facing the mounting plate. A ridge is disposed in the groove. A bladder is disposed in the groove and is pressed between the ridge and the mounting plate. Pressure in the bladder can be maintained or adjusted to deform the bladder and thereby force the retaining ring onto the polishing pad as the retaining ring is worn. Prior to adding pressure to the bladder, the ridge forces the bladder to very closely conform to the dimensions of the groove. Thus, during use, bladder deformation is not wasted on conforming the bladder to the groove shape, but instead can be used to force the retaining ring further in the direction of the pad. The ridge thereby increases the distance the retaining ring can move towards the pad.

公开(公告)号：US06866564B2

公开(公告)日：2005-03-15

申请号：US10315746

申请日：2002-12-10

申请人： Alan Strasbaugh ,  Salman M. Kassir

发明人： Alan Strasbaugh ,  Salman M. Kassir

IPC分类号： B24B1/00 ,  B24B37/30 ,  H01L21/00 ,  H01L21/304 ,  H01L21/683

CPC分类号： B24B37/30 ,  H01L21/67132 ,  Y10T156/1092 ,  Y10T156/17 ,  Y10T156/1744

摘要： A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A tool for applying tape to a chuck, as described herein, facilitates this method.

摘要翻译： 背面研磨晶片的方法，其中将后研磨带或垫施加到卡盘而不是施加到晶片。 当每个晶片顺序地放置在带或垫（背景）上，然后从带上取出时，将背面研磨带或垫留在卡盘上。 如本文所述的用于将胶带施加到卡盘的工具有助于该方法。

公开(公告)号：US20050009349A1

公开(公告)日：2005-01-13

申请号：US10860381

申请日：2004-06-01

申请人： Salman Kassir

发明人： Salman Kassir

IPC分类号： H01L21/306 ,  H01L21/302 ,  B08B1/02 ,  H01L21/461

CPC分类号： H01L21/30608 ,  Y10S438/977

摘要： A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a warm solution of KOH to the backside of the wafer while the wafer spins. The wafer may be supported on a rotatable platform adapted to direct the flow of chilled, deionized water underneath the device side of the wafer. The chilled water supports the wafer and protects the devices built-up on the wafer from the corrosive effects of KOH and from thermal damage.

摘要翻译： 通过去除晶片衬底的一小部分来减轻薄晶片上的表面应力的方法，通过在晶片旋转的同时将KOH的温溶液施加到晶片的背面来去除衬底。 晶片可以被支撑在可旋转的平台上，适于引导冷却的去离子水在晶片的器件侧下方的流动。 冷却水支撑晶片，保护晶片上积聚的器件免受KOH的腐蚀和热损伤。

公开(公告)号：US20040229545A1

公开(公告)日：2004-11-18

申请号：US10785393

申请日：2004-02-23

申请人： Strasbaugh

发明人： Stephan H. Wolf

IPC分类号： B24B049/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12

摘要： An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

摘要翻译： 用于CMP的晶片抛光垫组件包括用于在抛光过程中感测晶片的反射率的光学传感器，并产生相应的信号，并将该信号从旋转焊盘传输到组件的固定部分。 信号通过非接触耦合，如感性耦合或光耦合，在被转换为能够进行非接触传输的信号格式之后传输掉。

公开(公告)号：US20040157536A1

公开(公告)日：2004-08-12

申请号：US10717032

申请日：2003-11-18

申请人： Strasbaugh

发明人： Alan Strasbaugh ,  Salman M. Kassir

IPC分类号： B24B001/00 ,  B24B007/19

CPC分类号： B24B41/061 ,  B24B7/228 ,  B24B37/30 ,  H01L21/67132

摘要： A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.

摘要翻译： 背面研磨晶片的方法，其中将后研磨带或垫施加到卡盘而不是施加到晶片。 当将每个晶片顺序地放置在带或垫上的背景中，背面研磨胶带或垫留在卡盘上，背景在背面漂洗，从带上移除，然后在前侧和背面清洁。 如本文所述的用于将胶带施加到卡盘的工具有助于该方法。

公开(公告)号：US20040142636A1

公开(公告)日：2004-07-22

申请号：US10626490

申请日：2003-07-22

申请人： Strasbaugh

发明人： Chris Melcer

IPC分类号： B24B049/00

CPC分类号： B24B37/04 ,  B24B49/10 ,  B24B57/02 ,  Y10T137/0379

摘要： A CMP slurry pumping system and method which uses the slurry pump inlet pressure as input to the pump controller, and the controller adjusts pump speed to account for variations in inlet pressure.

摘要翻译： 使用浆料泵入口压力作为泵控制器的输入的CMP浆料泵送系统和方法，并且控制器调节泵速度以考虑入口压力的变化。

公开(公告)号：US20040087146A1

公开(公告)日：2004-05-06

申请号：US10065589

申请日：2002-10-31

申请人： Strasbaugh, a California corporation

发明人： Allan Paterson ,  David G. Halley

IPC分类号： H01L021/44

CPC分类号： H01L21/6835 ,  G01N1/32 ,  G01R31/2886 ,  G01R31/2898 ,  H01L2221/6834

摘要： A method for preparing a semiconductor wafer for whole wafer backside inspection is disclosed. The frontside of the wafer is covered with a protective frontside substrate and the backside portion of the wafer is thinned using conventional techniques. The whole wafer backside is then polished and a backside substrate, preferably of transparent material is juxtaposed to the backside of the wafer, such as with an adhesive or with a frame. The frontside substrate is then removed, exposing electronic devices for device inspection. The backside of the wafer is maintained open or available to backside inspection such as emission microscopy techniques used to detect defects which emit light.

摘要翻译： 公开了一种用于整体晶片背面检查的半导体晶片的制备方法。 晶片的正面被保护性前沿衬底覆盖，并且使用常规技术使晶片的背面部分变薄。 然后抛光整个晶片背面，并且优选透明材料的背面基底例如用粘合剂或框架并置到晶片的背面。 然后去除前侧基板，暴露电子装置用于装置检查。 晶片的背面保持开放或可用于背面检查，例如用于检测发光的缺陷的发射显微镜技术。

公开(公告)号：US20030216107A1

公开(公告)日：2003-11-20

申请号：US10146494

申请日：2002-05-14

申请人： Strasbaugh, Inc.

发明人： Greg Barbour

IPC分类号： B24B049/12

CPC分类号： B24B37/205 ,  B24B49/12

摘要： A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly.

摘要翻译： 一种抛光垫，具有不会对晶片工件造成过度磨损的光学组件。 光学组件设置在垫内，使得其可以响应于施加到光学组件的力而移动。

公开(公告)号：US5961169A

公开(公告)日：1999-10-05

申请号：US124160

申请日：1998-07-27

申请人： Bill Kalenian ,  Terry L. Lentz

发明人： Bill Kalenian ,  Terry L. Lentz

IPC分类号： B65G49/07 ,  B24B37/30 ,  B25J15/06 ,  H01L21/00 ,  H01L21/67 ,  H01L21/677 ,  H01L21/683 ,  B26J15/06 ,  B66C1/02

CPC分类号： H01L21/6838 ,  B24B37/30 ,  B25J15/0616 ,  H01L21/67259 ,  Y10S294/907 ,  Y10S414/141

摘要： Apparatus for use in a semiconductor wafer polishing machine of a type in which the wafer is picked up and held by a suction cup effect between the wafer and a resilient diaphragm on the wafer carrier. The apparatus permits the presence or absence of a wafer on the carrier to be sensed so that this information can be used in controlling the operation of the machine. In normal operation, a vacuum is applied to a downwardly-opening plenum that is covered by a resilient diaphragm. The present invention is the addition to the wafer carrier of an air conduit opening into the plenum through an air port and connected to an orifice so that air can flow through the orifice, through the air conduit and the air port into the plenum at a rate that is slow relative to the capacity of the vacuum pump. The present invention further requires the addition of a pressure sensor for sensing the pressure in the air conduit or alternatively in the vacuum conduit. The sensed pressure in the vacuum conduit is lower in the absence of a wafer than in the presence of a wafer, and the sensed pressure in the air conduit is greater in the absence of a wafer than it is when a wafer is present.

摘要翻译： 一种用于半导体晶片抛光机的装置，其中晶片被拾取并通过晶片和晶片载体上的弹性膜片之间的吸盘效应保持。 该装置允许感测载体上的晶片的存在或不存在，使得该信息可以用于控制机器的操作。 在正常操作中，真空被施加到由弹性隔膜覆盖的向下开口的通风室。 本发明是通过空气端口进入通风室并连接到孔口的空气管道的晶片载体的添加，使得空气可以以一定速率流过孔口，通过空气管道和空气端口进入集气室 这相对于真空泵的容量是缓慢的。 本发明还需要添加用于感测空气管道中的压力或可选地在真空管道中的压力传感器。 真空导管中感测到的压力在不存在晶片的情况下比在晶片存在时更低，并且在没有晶片的情况下，空气管道中感测到的压力比存在晶片时更大。

公开(公告)号：US3782042A

公开(公告)日：1974-01-01

申请号：US3782042D

申请日：1972-07-03

申请人： STRASBAUGH R

发明人： STRASBAUGH R

IPC分类号： B24B13/02

CPC分类号： B24B13/02

摘要： A lens grinding and polishing unit wherein either the workpiece or lap is supported by a laterally oscillatable head and the other is held atop a non-rotating flexible spindle (e.g. aluminum) which is simultaneously flexed at different speeds and courses in a repetative pattern compounded by rotation thereabout of (a) an inner tubular housing which eccentrically embraces the spindle at a circumference intermediate its length, and (b) an intermediate tubular housing spaced outward from the inner housing and which eccentrically bears on the inner housing adjacent the same circumferential area, separated from the inner housing by a ball bearing raceway. The intermediate housing is outwardly surrounded by a fixed housing from which it is separated by another ball bearing raceway, and all three generally concentric housings are mounted within an outermost dome of somewhat flexible material, the dome being supportingly transected by the spindle at a circumference between the carried lap and the top of the inner rotatable housing, so as to be jointly flexed by oscillation of the spindle. Both rotatable housings are pulley-operated from an electric motor which also oscillates the head (carrying the workpiece), thus totally eliminating cam and gear mechanisms previously employed in polishers. Adjacent units located in a cabinet can be operated by a single motor. Such units also carry a pneumatic element to supply down-pressure for the head, and provide circulation of lubricating fluid to the lap.

摘要翻译： 一种透镜研磨和抛光单元，其中工件或搭接件由横向可摆动的头支撑，而另一个被保持在不旋转的柔性主轴（例如铝）的顶部，同时以不同的速度弯曲，并以重复的图案复合， （a）在其长度的中心处偏心地围绕心轴的内部管状壳体，以及（b）与内部壳体间隔开并且与邻近相同圆周区域偏心地承载在内部壳体上的中间管状壳体， 通过滚珠轴承滚道与内壳分离。 中间壳体被固定的壳体向外包围，由另一个球轴承滚道与之分开，并且所有三个大致同心的壳体安装在一些柔性材料的最外面的圆顶中，该圆顶由主轴支撑地横跨在主轴之间的圆周处 携带搭搭和内部可旋转壳体的顶部，以便通过主轴的振动共同弯曲。 两个可旋转的外壳都是由电机驱动的，该电动机也使头部（承载工件）摆动，从而完全消除了先前在抛光机中使用的凸轮和齿轮机构。 位于机柜中的相邻单元可以由单个电机操作。 这种单元还携带气动元件以为头部供应下压，并且将润滑流体提供给搭接圈。