公开(公告)号：US08463217B2

公开(公告)日：2013-06-11

申请号：US12128859

申请日：2008-05-29

申请人： Arya Reza Behzad

发明人： Arya Reza Behzad

IPC分类号： H04B1/18 ,  H04M1/00

CPC分类号： H04B1/005 ,  H04B1/30 ,  H04B1/406

摘要： A MIMO transceiver integrated circuit (IC) includes a plurality of multiple band direct conversion transmitter sections, a plurality of multiple band direct conversion receiver sections, and a local oscillation generation module. Each of the plurality of multiple band direct conversion transmitter sections includes a transmit baseband module and a multiple frequency band transmission module. Each of the plurality of multiple band direct conversion receiver sections includes a multiple frequency band reception module and a receiver baseband module. The local oscillation generation module is operably coupled to generate the first frequency band local oscillation when the multiple band MIMO transceiver IC is in a first mode and operably coupled to generate the second frequency band local oscillation when the multiple band MIMO transceiver IC is in a second mode.

摘要翻译： MIMO收发器集成电路（IC）包括多个多频带直接转换发射机部分，多个多频带直接转换接收机部分和本地振荡发生模块。 多个频带直接变换发送部中的每一个包括发送基带模块和多频带发送模块。 多个频带直接变换接收部中的每一个包括多频带接收模块和接收机基带模块。 当多频带MIMO收发器IC处于第一模式时，本地振荡产生模块可操作地耦合以产生第一频带本地振荡，并且当多频带MIMO收发器IC处于第二模式时可操作地耦合以产生第二频带本地振荡 模式。

公开(公告)号：US08437722B2

公开(公告)日：2013-05-07

申请号：US13537283

申请日：2012-06-29

申请人： John Walley ,  Jeyhan Karaoguz ,  Brima B. Ibrahim ,  Arya Reza Behzad ,  Vinko Erceg ,  David Rosmann

发明人： John Walley ,  Jeyhan Karaoguz ,  Brima B. Ibrahim ,  Arya Reza Behzad ,  Vinko Erceg ,  David Rosmann

IPC分类号： H04B1/06 ,  H04B7/00

CPC分类号： H04B1/1638 ,  H04B1/005

摘要： A transceiver includes a receiver section and a transmitter section. The receiver section converts an inbound Multiple Frequency Bands Multiple Standards (MFBMS) signal into a down converted signal, wherein the inbound MFBMS signal includes a desired signal component and an undesired signal component. In addition, the receiver section determines spectral positioning of the undesired signal component with respect to the desired signal component and adjusts at least one of the MFBMS signal and the down converted signal based on the spectral positioning to substantially reduce adverse affects of the undesired signal component on the desired signal component to produce an adjusted signal. The transmitter section converts an outbound symbol stream into an outbound MFBMS signal.

摘要翻译： 收发机包括接收机部分和发射机部分。 接收机部分将入站多频带多标准（MFBMS）信号转换为下变频信号，其中入站MFBMS信号包括期望的信号分量和不期望的信号分量。 此外，接收机部分确定相对于期望信号分量的不期望信号分量的频谱定位，并且基于频谱定位来调整MFBMS信号和下变频信号中的至少一个，以基本上减少不期望信号分量的不利影响 在所需的信号分量上产生经调整的信号。 发送器部分将出站符号流转换为出站MFBMS信号。

公开(公告)号：US08437718B2

公开(公告)日：2013-05-07

申请号：US13536467

申请日：2012-06-28

申请人： Colin Fraser ,  Mark Gonikberg ,  Arya Reza Behzad

发明人： Colin Fraser ,  Mark Gonikberg ,  Arya Reza Behzad

IPC分类号： H04B17/00

CPC分类号： H04B1/0028 ,  H03F1/3241 ,  H04B1/0475 ,  H04B17/11 ,  H04B2001/0425

摘要： A wireless device includes an antenna, Radio Frequency (RF) circuitry, and baseband processing circuitry. The baseband processing circuitry couples to the RF circuitry and is operable to determine operational calibrations settings that may include pre-distortion characteristics and RF signal path settings, both of which are determined via calibration operations. The calibration operations are initiated when an operational value of the wireless device compares unfavorably to at least one operational threshold. Monitoring circuitry coupled to the RF circuitry and to the baseband processing circuitry monitors operational characteristics of the RF circuitry. Calibration operations may be initiated based upon RF circuitry temperature, supply voltage, PA current, PA gain input level/average, among other triggers.

摘要翻译： 无线设备包括天线，射频（RF）电路和基带处理电路。 基带处理电路耦合到RF电路，并且可操作以确定可能包括预失真特性和RF信号路径设置的操作校准设置，这两者均通过校准操作确定。 当无线设备的操作值不利于至少一个操作阈值时，启动校准操作。 耦合到RF电路和基带处理电路的监控电路监视RF电路的操作特性。 校准操作可以基于RF电路温度，电源电压，PA电流，PA增益输入电平/平均值等触发。

公开(公告)号：US20130109325A1

公开(公告)日：2013-05-02

申请号：US13329297

申请日：2011-12-18

申请人： Ali Afsahi ,  Arya Reza Behzad

发明人： Ali Afsahi ,  Arya Reza Behzad

IPC分类号： H04B1/38

CPC分类号： H04B7/0689 ,  H04B17/13

摘要： A radio frequency (RF) section of an RF transceiver is coupled to an antenna structure that includes a plurality of antennas. The RF section includes a configuration controller operable to generate a control signal that selectively indicates a non-contiguous state in a non-contiguous mode of operation of the RF transceiver and a multi-input multi-output (MIMO) state in a MIMO mode of operation of the RF transceiver.

摘要翻译： RF收发器的射频（RF）部分耦合到包括多个天线的天线结构。 RF部分包括配置控制器，其可操作以产生选择性地指示RF收发器的非连续操作模式中的非连续状态的控制信号和MIMO模式中的多输入多输出（MIMO）状态 RF收发器的操作。

公开(公告)号：US08416883B2

公开(公告)日：2013-04-09

申请号：US13300781

申请日：2011-11-21

申请人： Arya Reza Behzad

发明人： Arya Reza Behzad

IPC分类号： H04L25/49

CPC分类号： H04L1/0035 ,  H03F1/3241 ,  H04B1/0475 ,  H04B2001/0425 ,  H04L25/03343 ,  H04L25/03828 ,  H04L27/2626

摘要： An integrated circuit radio transceiver and method therefor includes an integrated circuit radio transceiver operable to provide specified gain levels and transmit path filter responses to correspond with a selected power spectral density mask. Changes in gain may be provided solely digital gain changes or may include analog gain module gain changes. A transmitter selects from one of at least three masks to reduce or eliminate spectral regrowth out of band to satisfy EVM requirements. Circuitry is provided to allow a transceiver to determine in advance what pre-distortion compensation settings are required for the various gain settings.

摘要翻译： 集成电路无线电收发器及其方法包括集成电路无线电收发器，其可操作以提供指定的增益水平并且发送路径滤波器响应以对应于所选择的功率谱密度掩模。 增益的变化可能仅提供数字增益变化，或者可能包括模拟增益模块增益变化。 发射机从至少三个掩模中的一个选择以减少或消除带外的频谱再生长以满足EVM要求。 提供电路以允许收发器预先确定各种增益设置需要什么预失真补偿设置。

公开(公告)号：US20130082800A1

公开(公告)日：2013-04-04

申请号：US13248787

申请日：2011-09-29

申请人： Ahmadreza Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

发明人： Ahmadreza Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC分类号： H01P3/00

CPC分类号： H01P3/00 ,  B81B7/008 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2207/03 ,  H01H59/0009 ,  H01L23/5222 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L41/0986 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2924/1461 ,  H01P1/06 ,  H01P1/18 ,  H01P1/182 ,  H01P3/121 ,  H01Q13/20 ,  H01L2924/00

摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

公开(公告)号：US20130082403A1

公开(公告)日：2013-04-04

申请号：US13248745

申请日：2011-09-29

申请人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

发明人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

IPC分类号： H01L23/522

CPC分类号： H01L25/0657 ,  G02B6/12002 ,  G02B6/43 ,  H01L23/5222 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2225/1005 ,  H01L2924/1461 ,  H01P3/00 ,  H01P3/12 ,  H01P3/121 ,  H04L7/0091 ,  H01L2924/00

摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

公开(公告)号：US08412142B2

公开(公告)日：2013-04-02

申请号：US12550555

申请日：2009-08-31

申请人： John Walley ,  David Rosmann ,  Brima B. Ibrahim ,  Arya Reza Behzad ,  Jeyhan Karaoguz ,  Vinko Erceg

发明人： John Walley ,  David Rosmann ,  Brima B. Ibrahim ,  Arya Reza Behzad ,  Jeyhan Karaoguz ,  Vinko Erceg

IPC分类号： H04B1/26

CPC分类号： H04L27/0002 ,  H04B1/0003 ,  H04B1/005

摘要： A wireless device includes processing circuitry, a receiver section, a transmitter section, and an antenna. The processing circuitry determines a set of information signals of a RF Multiple Frequency Bands Multiple Standards (MFBMS) signal. The receiver section down-converts a portion of the RF MFBMS signal by one or more respective shift frequencies to produce a corresponding baseband/low Intermediate Frequency (BB/IF) information signal from which the processing circuitry extracts data. The transmitter section converts a respective BB/IF information signal received from the processing circuitry by a respective shift frequency to produce a corresponding RF information signal and a combiner that combines the RF information signals to form a RF MFBMS signal. The receiver section and the transmitter section include ADCs and/or DACs, respectively, that are adjustable based upon characteristics of the RF MFBMS signal, the BB/IF MFBMS signal, and/or based upon signals carried therein, e.g., modulation type, SNR requirements, etc.

摘要翻译： 无线设备包括处理电路，接收机部分，发射机部分和天线。 处理电路确定RF多频带多标准（MFBMS）信号的一组信息信号。 接收器部分将RF MFBMS信号的一部分下变频一个或多个相应的移位频率，以产生相应的基带/低中频（BB / IF）信息信号，处理电路从该信号信号中提取数据。 发射机部分将从处理电路接收到的相应BB / IF信息信号转换相应的移位频率，以产生对应的RF信息信号和组合RF信号信号以形成RF MFBMS信号的组合器。 接收机部分和发射机部分分别包括基于RF MFBMS信号，BB / IF MFBMS信号的特性和/或基于其中携带的信号可调节的ADC和/或DAC，例如调制类型，SNR 要求等

公开(公告)号：US08358978B2

公开(公告)日：2013-01-22

申请号：US12264426

申请日：2008-11-04

申请人： Vinko Erceg ,  David Rosmann ,  Brima B. Ibrahim ,  Jeyhan Karaoguz ,  John Walley ,  Arya Reza Behzad

发明人： Vinko Erceg ,  David Rosmann ,  Brima B. Ibrahim ,  Jeyhan Karaoguz ,  John Walley ,  Arya Reza Behzad

IPC分类号： H04B1/00

CPC分类号： H04W72/042 ,  H04W16/14 ,  H04W72/02 ,  H04W72/085 ,  H04W88/06

摘要： A multiservice communication device includes a plurality of transceivers that wirelessly transceive network data with a corresponding plurality of networks in accordance with a corresponding plurality of network protocols, wherein the plurality of transceivers includes at least one cognitive radio transceiver that is configured based on cognitive transceiver configuration data received from a management unit in communication with the multiservice communication device via a control channel.

摘要翻译： 多业务通信设备包括多个收发器，其根据相应的多个网络协议与相应的多个网络无线地收发网络数据，其中所述多个收发器包括基于认知收发机配置来配置的至少一个认知无线电收发信机 从经由控制信道与多业务通信设备通信的管理单元接收的数据。

公开(公告)号：US08351855B2

公开(公告)日：2013-01-08

申请号：US12877942

申请日：2010-09-08

申请人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Michael Boers ,  Ahmadreza Reza Rofougaran ,  Sam Ziqun Zhao

发明人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Michael Boers ,  Ahmadreza Reza Rofougaran ,  Sam Ziqun Zhao

IPC分类号： H04B5/00

CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

摘要： Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.

摘要翻译： 本文公开了用于在没有欧姆接触的情况下提供接近耦合的系统，装置和方法。 这样的系统包括彼此无线耦合的多个无线功能组件（WEC）。 每个WEC包括金属基元件，衬底和将金属基元件与衬底分离的半导体层。 信号被配置为通过金属基元件和衬底之间的邻近耦合（例如，磁耦合，电耦合和/或电磁耦合）传输，而在金属基元件和衬底之间没有欧姆接触 基质。 在一个示例中，多个WEC的第一子集共同位于第一芯片上，并且多个WEC的第二子集共同位于第二芯片上。 第一芯片和第二芯片可以位于单个设备中或者位于单独的设备中。