Abstract:
In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented.
Abstract:
A flash memory device and method of fabricating the same, wherein a width at the top of a floating gate is narrower than that at the bottom of the floating gate. The area of the floating gate can be reduced while maintaining the overlap area between the control gate and the floating gate. Therefore, inter-cell interference can be reduced without lowering program speed.
Abstract:
Methods are disclosed for erasing a flash memory cell including: (a) a semiconductor substrate, (b) a gate, (c) a source, (d) a drain, (e) a well, the gate including: (1) a tunnel oxide film, (2) a floating gate, (3) a dielectric film and (4) a control gate stacked on the semiconductor substrate. In one of the disclosed methods, a negative bias voltage is applied to the control gate, the source and drain are floated, a positive bias voltage is applied to the well to thereby create a positive bias voltage in the source and the drain, a ground voltage is applied to the well at a first time while maintaining the negative bias voltage a the control gate; and subsequently a ground voltage is applied to the control gate.
Abstract:
A method of manufacturing a nonvolatile memory device wherein first gate lines and second gate lines are formed over a semiconductor substrate. The first gate lines are spaced-from each other at a first width, the second gate lines are spaced-from each other at a second width, and the first width is wider than the second width. A first ion implantation process of forming first junction regions in the semiconductor substrate between the first gate lines and the second gate lines is performed. A second ion implantation process of forming second junction regions in the respective first junction regions between the first gate lines is then performed.
Abstract:
The present invention relates to a method of operating a non-volatile memory device. In an aspect of the present invention, the method includes performing a first program operation on the entire memory cells, measuring a first program speed of a reference memory cell, storing the first program speed in a program speed storage unit, repeatedly performing a program/erase operation until before a number of the program/erase operation corresponds to a specific reference value, when the number of the program/erase operation corresponds to the specific reference value, measuring a second program speed of the reference memory cell, calculating a difference between the first program speed and the second program speed, resetting a program start voltage according to the calculated program speed difference, and performing the program/erase operation based on the reset program start voltage.
Abstract:
A programming method of a non-volatile memory device may include providing a memory device in which a first word line is preprogrammed in an erase operation of a memory block, pre-programming a second word line according to a program command, and programming the first word line.
Abstract:
An erase operating time can be shortened and an erase operating characteristic can be improved in a flash memory device. The flash memory device includes a plurality of memory cell blocks, an operating voltage generator and a controller. Each of the plurality of memory cell blocks includes memory cells connected to a plurality of word lines. A voltage generator is configured to apply an erase voltage to a memory cell block selected for an erase operation, and change a level of the erase voltage if an attempt of the erase operation is not successful. A controller is configured to control the voltage generator to apply a first erase voltage to a memory cell block selected for an erase operation. The first erase voltage corresponds to a previous erase voltage that was used successfully in completing a previous erase operation. The first erase voltage is an erase voltage that is used in a first erase attempt for the erase operation.
Abstract:
A method of programming a flash memory device including performing a first program for programming cells to a first state and a second state higher than the first state, and performing a second program simultaneously together with the first program, for programming cells to the second state and a third state higher than the second state.
Abstract:
Disclosed herein are a NAND flash memory device and a method of forming a well of the NAND flash memory device. Triple wells of a NAND flash memory device are formed within a cell region in plural. A cell block including flash memory cells is formed on the triple wells. Accordingly, during an erase operation of a flash memory device, a stress time for non-selected blocks can be reduced and erase disturbance can be also prevented, through the plurality of the wells. Further, capacitance between the triple P wells and the triple N well is reduced since triple P wells are divided. Therefore, well bias charging and discharging time can be reduced and an overall erase time budget can be thus reduced.
Abstract:
A method for operating a flash memory device includes applying a first program voltage Vp1 to a plurality of word lines of memory cells. Threshold voltages of the memory cells are measured to obtain a first threshold voltage distribution for the memory cells. A second program voltage Vp2 is applied to the word lines of the memory cells that had been programmed with the first program voltage Vp1. The threshold voltages of the memory cells that have been programmed with the second program voltage Vp2 are measured to obtain a second threshold voltage distribution for the memory cells. A determination is made whether or not the memory cells that have been programmed with the second program voltage have been programmed properly. If the memory cells are determined to have been programmed properly, then the second program voltage is defined as an ending bias for a programming operation. If the memory cells are determined not to have been programmed properly, the memory cells are programmed using a third program voltage that is higher than the second program voltage.