NONVOLATILE MEMORY DEVICE
    2.
    发明申请
    NONVOLATILE MEMORY DEVICE 有权
    非易失性存储器件

    公开(公告)号:US20120280298A1

    公开(公告)日:2012-11-08

    申请号:US13333693

    申请日:2011-12-21

    IPC分类号: H01L29/78 H01L21/28

    CPC分类号: H01L27/11582 H01L29/7926

    摘要: A nonvolatile memory device includes a first channel comprising a pair of first pillars vertically extending from a substrate and a first coupling portion positioned under the pair of first pillars and coupling the pair of first pillars, a second channel adjacent to the first channel comprising a pair of second pillars vertically extending from the substrate and a second coupling portion positioned under the pair of second pillars and coupling the pair of second pillars, a plurality of gate electrode layers and interlayer dielectric layers alternately stacked along the first and second pillar portions, and first and second trenches isolating the plurality of gate electrode layers between the pair of first pillar portions and between the pair of second pillar portions, respectively.

    摘要翻译: 非易失性存储器件包括第一通道,该第一通道包括从衬底垂直延伸的一对第一柱和位于一对第一柱之下并耦合该对第一柱的第一耦合部分,与第一通道相邻的第二通道,包括一对 从所述基板垂直延伸的第二柱和位于所述一对第二柱下方并耦合所述一对第二柱的第二连接部,沿着所述第一和第二柱部交替堆叠的多个栅电极层和层间电介质层, 以及第二沟槽,其分别在所述一对第一柱部分和所述一对第二柱部分之间隔离所述多个栅电极层。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME
    4.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME 有权
    半导体存储器件及其操作方法

    公开(公告)号:US20120120725A1

    公开(公告)日:2012-05-17

    申请号:US13297467

    申请日:2011-11-16

    IPC分类号: G11C16/16 G11C16/04

    摘要: A method of operating a semiconductor memory device includes a memory array having memory cell strings including a first and a second memory cell groups having memory cells, a first and a second dummy elements, a drain select transistor and a source select transistor, wherein the first memory cell group and the second memory cell group are arranged between the drain select transistor and the source select transistor; connecting electrically the first memory cell group to the second memory cell group during a program operation or a read operation of the first memory cell group or the second memory cell group; and performing separately an erase operation of the first memory cell group and an erase operation of the second memory cell group, selecting simultaneously one of the first dummy element and the second dummy element during the erase operation of the selected memory cell group.

    摘要翻译: 一种操作半导体存储器件的方法包括具有存储单元串的存储器阵列,存储单元串包括具有存储单元的第一和第二存储单元组,第一和第二虚设元件,漏极选择晶体管和源选择晶体管,其中第一 存储单元组和第二存储单元组布置在漏极选择晶体管和源极选择晶体管之间; 在第一存储单元组或第二存储单元组的编程操作或读操作期间将第一存储单元组电连接到第二存储单元组; 以及分别执行第一存储单元组的擦除操作和第二存储单元组的擦除操作,在所选存储单元组的擦除操作期间同时选择第一虚拟元件和第二虚设元件中的一个。

    LIGHT EMITTING DIODE WITH IMPROVED LUMINOUS EFFICIENCY
    5.
    发明申请
    LIGHT EMITTING DIODE WITH IMPROVED LUMINOUS EFFICIENCY 有权
    发光二极管具有提高的光效

    公开(公告)号:US20120049223A1

    公开(公告)日:2012-03-01

    申请号:US13209765

    申请日:2011-08-15

    IPC分类号: H01L33/58 H01L33/42

    摘要: Exemplary embodiments of the present invention relate to light emitting diodes. A light emitting diode according to an exemplary embodiment of the present invention includes a substrate having a first side edge and a second side edge, and a light emitting structure arranged on the substrate. The light emitting structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. A transparent electrode layer including a concave portion and a convex portion is arranged on the second conductivity-type semiconductor layer. A first electrode pad contacts an upper surface of the first conductivity-type semiconductor layer and is located near a center of the first side edge. Two second electrode pads are located near opposite distal ends of the second side edge to supply electric current to the second conductivity-type semiconductor layer. A first pad extension extends from the first electrode pad and a second pad extension extends from each of the two second electrode pads.

    摘要翻译: 本发明的示例性实施例涉及发光二极管。 根据本发明的示例性实施例的发光二极管包括具有第一侧边缘和第二侧边缘的基板和布置在基板上的发光结构。 发光结构包括第一导电型半导体层,有源层和第二导电型半导体层。 在第二导电型半导体层上配置有包含凹部和凸部的透明电极层。 第一电极焊盘接触第一导电类型半导体层的上表面并且位于第一侧边缘的中心附近。 两个第二电极焊盘位于第二侧边缘的相对的远端附近,以向第二导电类型半导体层提供电流。 第一焊盘延伸部从第一电极焊盘延伸,并且第二焊盘延伸部从两个第二电极焊盘中的每一个延伸。

    LIGHT EMITTING DIODE HAVING DISTRIBUTED BRAGG REFLECTOR
    6.
    发明申请
    LIGHT EMITTING DIODE HAVING DISTRIBUTED BRAGG REFLECTOR 有权
    具有分布式BRAGG反射器的发光二极管

    公开(公告)号:US20120025244A1

    公开(公告)日:2012-02-02

    申请号:US13100879

    申请日:2011-05-04

    IPC分类号: H01L33/58

    摘要: Exemplary embodiments of the present invention provide light-emitting diodes having a distributed Bragg reflector. A light-emitting diode (LED) according to an exemplary embodiment includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. A first distributed Bragg reflector is arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector to reflect light emitted from the light-emitting structure. The first distributed Bragg reflector has a reflectivity of at least 90% with respect to light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range. The first distributed Bragg reflector has a laminate structure having an alternately stacked SiO2 layer and Nb2O5 layer.

    摘要翻译: 本发明的示例性实施例提供了具有分布式布拉格反射器的发光二极管。 根据示例性实施例的发光二极管(LED)包括布置在基板的第一表面上的发光结构,所述发光结构包括第一导电类型半导体层,第二导电类型半导体层, 以及插入在第一导电型半导体层和第二导电型半导体层之间的有源层。 第一分布式布拉格反射器布置在基板的与第一表面相对的第二表面上,第一分布布拉格反射器用于反射从发光结构发射的光。 第一分布布拉格反射器相对于蓝色波长范围内的第一波长的光,绿色波长范围内的第二波长的光和红色波长范围内的第三波长的光具有至少90%的反射率。 第一分布布拉格反射器具有层叠结构,其具有交替层叠的SiO 2层和Nb 2 O 5层。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    8.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME 失效
    半导体存储器件及其制造方法

    公开(公告)号:US20090140319A1

    公开(公告)日:2009-06-04

    申请号:US12133775

    申请日:2008-06-05

    申请人: Sang Hyun OH

    发明人: Sang Hyun OH

    IPC分类号: H01L29/788 H01L21/336

    摘要: A semiconductor memory devices and a method of fabricating the same includes sequentially stacking a tunnel insulating layer, a first nano-grain film, a conductive layer for a floating gate, and a second nano-grain film over a semiconductor substrate, forming a trench by etching the second nano-grain film, the conductive layer for the floating gate, the first nano-grain film, the tunnel insulating layer, and the semiconductor substrate, gap-filling the trench with an insulating layer, thus forming an isolation layer, and forming a third nano-grain film on sidewalls of the conductive layer for the floating gate.

    摘要翻译: 半导体存储器件及其制造方法包括在半导体衬底上依次堆叠隧道绝缘层,第一纳米晶粒膜,浮栅的导电层和第二纳米晶粒膜,通过 蚀刻第二纳米晶粒膜,用于浮置栅极的导电层,第一纳米晶粒膜,隧道绝缘层和半导体衬底,用绝缘层填充沟槽,从而形成隔离层,以及 在用于浮动栅极的导电层的侧壁上形成第三纳米晶粒膜。