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公开(公告)号：US20070279520A1
公开(公告)日：2007-12-06
申请号：US11676813
申请日：2007-02-20
IPC分类号： H04N5/238
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L2224/13 , H04N5/2257
摘要： A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
摘要翻译： 提供了一种用于图像感测装置的封装模块。 封装模块包括其上具有光电元件阵列的基板，形成在光电元件阵列上的第一光学元件阵列，封装盖，其上具有与第一光学元件阵列相对的第二光学元件阵列，并且具有与 第一光学元件阵列; 以及间隔件，设置在封装盖和基板之间的接合区域上，用于调节封装盖和基板之间的距离。
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公开(公告)号：US20070069109A1
公开(公告)日：2007-03-29
申请号：US11395046
申请日：2006-03-30
申请人： Hsiao-Wen Lee
发明人： Hsiao-Wen Lee
IPC分类号： H01L27/00
CPC分类号： H01L27/14685 , H01L27/14603 , H01L27/14621 , H01L27/14625 , H01L27/14627
摘要： An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.
摘要翻译： 提供一种用于接收具有入射角的入射光和由此形成的光信号的图像感测装置。 图像感测装置包括微棱镜和微透镜，用于分别调节入射角度并会聚入射光，用于将光信号转换成电子信号的光传感器，以及用于处理电子信号的IC堆叠层。
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53.发明申请公开(公告)号：US20060174658A1
公开(公告)日：2006-08-10
申请号：US11378458
申请日：2006-03-17
申请人： Sheng-Lung Huang , Chia-Yao Lo , Kwang-Yao Huang , Shih-Yu Tu , Hsiao-Wen Lee , Sheng-Pan Huang , Sun-Bin Yin
发明人： Sheng-Lung Huang , Chia-Yao Lo , Kwang-Yao Huang , Shih-Yu Tu , Hsiao-Wen Lee , Sheng-Pan Huang , Sun-Bin Yin
IPC分类号： C03B37/075
CPC分类号： H01S3/06795 , H01S3/06708 , H01S3/06716
摘要： The present invention relates to a fiber having a core of crystal fiber doped with chromium and a glass cladding. The fiber has a gain bandwidth of more than 300 nm including 1.3 mm to 1.6 mm in optical communication, and can be used as light source, optical amplifier and tunable laser when being applied for optical fiber communication. The present invention also relates to a method of making the fiber. First, a chromium doped crystal fiber is grown by laser-heated pedestal growth (LHPG). Then, the crystal fiber is cladded with a glass cladding by codrawing laser-heated pedestal growth (CDLHPG). Because it is a high temperature manufacture process, the cladding manufactured by this method is denser than that by evaporation technique, and can endure relative high damage threshold power for the pumping light.
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54.发明申请公开(公告)号：US20060110122A1
公开(公告)日：2006-05-25
申请号：US10996749
申请日：2004-11-24
申请人： Sheng-Lung Huang , Chia-Yao Lo , Kwang-Yao Huang , Shih-Yu Tu , Hsiao-Wen Lee , Sheng-Pan Huang , Sun-Bin Yin
发明人： Sheng-Lung Huang , Chia-Yao Lo , Kwang-Yao Huang , Shih-Yu Tu , Hsiao-Wen Lee , Sheng-Pan Huang , Sun-Bin Yin
IPC分类号： G02B6/00
CPC分类号： H01S3/06795 , H01S3/06708 , H01S3/06716
摘要： The present invention relates to a fiber having a core of crystal fiber doped with chromium and a glass cladding. The fiber has a gain bandwidth of more than 300 nm including 1.3 mm to 1.6 mm in optical communication, and can be used as light source, optical amplifier and tunable laser when being applied for optical fiber communication. The present invention also relates to a method of making the fiber. First, a chromium doped crystal fiber is grown by laser-heated pedestal growth (LHPG). Then, the crystal fiber is cladded with a glass cladding by codrawing laser-heated pedestal growth (CDLHPG). Because it is a high temperature manufacture process, the cladding manufactured by this method is denser than that by evaporation technique, and can endure relative high damage threshold power for the pumping light.
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公开(公告)号：US20050286110A1
公开(公告)日：2005-12-29
申请号：US10929074
申请日：2004-08-27
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Wu-Cheng Kuo , Chen-Yu Weng , Yu-Han Chieh
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Wu-Cheng Kuo , Chen-Yu Weng , Yu-Han Chieh
CPC分类号： G02B6/3572 , G02B6/3516 , G02B6/3518 , G02B6/3566 , G02B6/3576 , G02B6/3584 , G02B26/085
摘要： A self-assembly structure of micro electromechanical optical switch utilizes residual stresses of three curved beams. The first curved beam pushes the base plate away from the substrate. The second curved beam lifts up the mirror slightly. Then, the third curved beam rotates the mirror vertical to the base plate and achieves self-assembly. In another embodiment, magnetic force and magnetic-activated elements are used.
摘要翻译： 微机电光开关的自组装结构利用三个弯曲梁的残余应力。 第一弯曲梁将基板推离基板。 第二弯曲梁稍微升起镜子。 然后，第三弯曲梁将镜子垂直于基板旋转并实现自组装。 在另一个实施例中，使用磁力和磁激元件。
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公开(公告)号：US06950224B1
公开(公告)日：2005-09-27
申请号：US10922265
申请日：2004-08-18
申请人： Bing-Ru Chen , Wu-Cheng Kuo , Ming-Hung Chen , Jui-Ping Weng , Yeh-I Su , Hsiao-Wen Lee
发明人： Bing-Ru Chen , Wu-Cheng Kuo , Ming-Hung Chen , Jui-Ping Weng , Yeh-I Su , Hsiao-Wen Lee
CPC分类号： G02B26/0841
摘要： An electrostatic movable micro mirror chip includes an upper mirror plate and a lower electrode plate positioned and jointed together via pairs of fitting solder and positioning grooves. It improves the optical quality of the mirror chip by a lower joining temperature. The fitting and jointing achieves easy positioning and interconnection. The fabrication time and cost is less. The mirror in the mirror chip is plated with metallic coating on both sides so as to balance the stress and improve its flatness.
摘要翻译： 静电可移动微镜芯片包括上镜面板和下电极板，通过一对装配焊料和定位槽定位和接合在一起。 它通过较低的接合温度提高了镜片的光学质量。 装配和接合实现了容易的定位和互连。 制造时间和成本较低。 镜片中的镜子在两面镀金属涂层，以平衡应力并提高其平整度。
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公开(公告)号：US08860056B2
公开(公告)日：2014-10-14
申请号：US13308715
申请日：2011-12-01
申请人： Chi Xiang Tseng , Hsiao-Wen Lee , Tien-Ming Lin , Min-Sheng Wu
发明人： Chi Xiang Tseng , Hsiao-Wen Lee , Tien-Ming Lin , Min-Sheng Wu
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L27/153 , H01L33/504 , H01L33/508 , H01L2933/0041
摘要： The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.
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公开(公告)号：US08757845B2
公开(公告)日：2014-06-24
申请号：US13194538
申请日：2011-07-29
申请人： Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： F21V7/07
CPC分类号： F21K9/50 , F21K9/60 , F21K9/90 , F21V3/02 , F21V3/0625 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
摘要： The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.
摘要翻译： 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管（LED）装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖，其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。
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59.发明申请LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING 有权带注射成型电气连接器的发光二极管灯模块公开(公告)号：US20120088397A1
公开(公告)日：2012-04-12
申请号：US12899999
申请日：2010-10-07
申请人： Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
CPC分类号： B29C45/0001 , B29C45/14262 , B29C45/14311 , B29C45/14639 , B29K2705/02 , F21S4/20 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01R43/24 , Y10T29/53
摘要： The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.
摘要翻译： 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。
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公开(公告)号：US08143084B2
公开(公告)日：2012-03-27
申请号：US12356347
申请日：2009-01-20
申请人： Hsiao-Wen Lee
发明人： Hsiao-Wen Lee
IPC分类号： H01L21/00
CPC分类号： H01L27/14685 , H01L27/14603 , H01L27/14621 , H01L27/14625 , H01L27/14627
摘要： An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.
摘要翻译： 提供一种用于接收具有入射角的入射光和由此形成的光信号的图像感测装置。 图像感测装置包括微棱镜和微透镜，用于分别调节入射角度并会聚入射光，用于将光信号转换成电子信号的光传感器，以及用于处理电子信号的IC堆叠层。
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