公开(公告)号：US06950224B1

公开(公告)日：2005-09-27

申请号：US10922265

申请日：2004-08-18

申请人： Bing-Ru Chen ,  Wu-Cheng Kuo ,  Ming-Hung Chen ,  Jui-Ping Weng ,  Yeh-I Su ,  Hsiao-Wen Lee

发明人： Bing-Ru Chen ,  Wu-Cheng Kuo ,  Ming-Hung Chen ,  Jui-Ping Weng ,  Yeh-I Su ,  Hsiao-Wen Lee

IPC分类号： B81B3/00 ,  G02B26/00 ,  G02B26/08

CPC分类号： G02B26/0841

摘要： An electrostatic movable micro mirror chip includes an upper mirror plate and a lower electrode plate positioned and jointed together via pairs of fitting solder and positioning grooves. It improves the optical quality of the mirror chip by a lower joining temperature. The fitting and jointing achieves easy positioning and interconnection. The fabrication time and cost is less. The mirror in the mirror chip is plated with metallic coating on both sides so as to balance the stress and improve its flatness.

摘要翻译： 静电可移动微镜芯片包括上镜面板和下电极板，通过一对装配焊料和定位槽定位和接合在一起。 它通过较低的接合温度提高了镜片的光学质量。 装配和接合实现了容易的定位和互连。 制造时间和成本较低。 镜片中的镜子在两面镀金属涂层，以平衡应力并提高其平整度。

公开(公告)号：US07521724B2

公开(公告)日：2009-04-21

申请号：US11147185

申请日：2005-06-08

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L29/06 ,  H01L31/00 ,  H01L29/26 ,  H01L33/00 ,  H01L31/12 ,  H01L21/00 ,  H01L21/76

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

摘要翻译： 发光二极管（LED）封装及其制造方法包括由两个硅基材料和介于其间的绝缘层组成的绝缘体上硅（SOI）衬底。 蚀刻绝缘体上硅衬底的两种硅基材料，以分别形成反射腔和绝缘沟槽，以将绝缘体上硅衬底分成阳极和负电极的接触表面。 然后形成多个金属线以电连接两个硅基材料，使得LED芯片可以安装在反射腔上并且通过金属线电连接到绝缘体上硅衬底的相应电极。 因此，可以提高耐热性和热分散性，并且可以简化工艺。

公开(公告)号：US20060138436A1

公开(公告)日：2006-06-29

申请号：US11147185

申请日：2005-06-08

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

公开(公告)号：US20050286110A1

公开(公告)日：2005-12-29

申请号：US10929074

申请日：2004-08-27

申请人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Wu-Cheng Kuo ,  Chen-Yu Weng ,  Yu-Han Chieh

发明人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Wu-Cheng Kuo ,  Chen-Yu Weng ,  Yu-Han Chieh

IPC分类号： G02B6/26 ,  G02B6/35 ,  G02B26/00 ,  G02B26/08

CPC分类号： G02B6/3572 ,  G02B6/3516 ,  G02B6/3518 ,  G02B6/3566 ,  G02B6/3576 ,  G02B6/3584 ,  G02B26/085

摘要： A self-assembly structure of micro electromechanical optical switch utilizes residual stresses of three curved beams. The first curved beam pushes the base plate away from the substrate. The second curved beam lifts up the mirror slightly. Then, the third curved beam rotates the mirror vertical to the base plate and achieves self-assembly. In another embodiment, magnetic force and magnetic-activated elements are used.

摘要翻译： 微机电光开关的自组装结构利用三个弯曲梁的残余应力。 第一弯曲梁将基板推离基板。 第二弯曲梁稍微升起镜子。 然后，第三弯曲梁将镜子垂直于基板旋转并实现自组装。 在另一个实施例中，使用磁力和磁激元件。

公开(公告)号：US06771158B2

公开(公告)日：2004-08-03

申请号：US10307367

申请日：2002-12-02

申请人： Hsiao-Wen Lee ,  Wen-I Wu ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Jui-Ping Weng

发明人： Hsiao-Wen Lee ,  Wen-I Wu ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Jui-Ping Weng

IPC分类号： H01P110

CPC分类号： B81B3/0051 ,  B81B2201/038 ,  B81B2201/045 ,  B81B2203/053 ,  G02B26/001 ,  G02B26/0808

摘要： A micro electromechanical differential actuator is comprised of a suspension arm structure and/or a bridge structure to make a two-degree-of-freedom and bi-directional motion. The actuator support base can make out-of-plane or in-plane vertical and horizontal motions. The invention is applicable in optical micro electromechanical devices such as optical switches, variable optical attenuators, optical tunable filters, modulators, tunable VCSEL's, grating modulators, micro displays, and RF switches.

公开(公告)号：US07133185B2

公开(公告)日：2006-11-07

申请号：US10929074

申请日：2004-08-27

申请人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Wu-Cheng Kuo ,  Chen-Yu Weng ,  Yu-Han Chien

发明人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Wu-Cheng Kuo ,  Chen-Yu Weng ,  Yu-Han Chien

IPC分类号： G02F1/29 ,  G02B6/35 ,  G02B26/08

CPC分类号： G02B6/3572 ,  G02B6/3516 ,  G02B6/3518 ,  G02B6/3566 ,  G02B6/3576 ,  G02B6/3584 ,  G02B26/085

摘要： A self-assembly structure of micro electromechanical optical switch utilizes residual stresses of three curved beams. The first curved beam pushes the base plate away from the substrate. The second curved beam lifts up the mirror slightly. Then, the third curved beam rotates the mirror vertical to the base plate and achieves self-assembly. In another embodiment, magnetic force and magnetic-activated elements are used.

摘要翻译： 微机电光开关的自组装结构利用三个弯曲梁的残余应力。 第一弯曲梁将基板推离基板。 第二弯曲梁稍微升起镜子。 然后，第三弯曲梁将镜子垂直于基板旋转并实现自组装。 在另一个实施例中，使用磁力和磁激元件。

公开(公告)号：US08029160B2

公开(公告)日：2011-10-04

申请号：US11562949

申请日：2006-11-22

申请人： Wu-Cheng Kuo ,  Ya-Hui Chiang ,  Bing-Ru Chen ,  Hung-Lieh Hu ,  Kuo-Hsiang Chen

发明人： Wu-Cheng Kuo ,  Ya-Hui Chiang ,  Bing-Ru Chen ,  Hung-Lieh Hu ,  Kuo-Hsiang Chen

IPC分类号： F21V5/04 ,  F21V7/04

CPC分类号： F21V13/04 ,  F21S41/00

摘要： An illumination device includes a light source positioned on an illumination axis, a lens assembly having at least two biconvex lenses disposed on the illumination axis, and a reflector having a reflecting surface enclosing the lens assembly. The light source emits a first group of light beams which directly impinge of the lens assembly, and a second group of light beams which directly impinge on the reflector. The second group of light beams being reflected by the reflecting surface such that they surround the first group of light beams after being refracted by the lens assembly, without such second group of light beams impinging on the lens assembly.

摘要翻译： 照明装置包括位于照明轴上的光源，具有设置在照明轴上的至少两个双凸透镜的透镜组件以及包围透镜组件的反射表面的反射器。 光源发射直接撞击透镜组件的第一组光束和直接撞击反射器的第二组光束。 第二组光束被反射表面反射，使得它们在被透镜组件折射之后包围第一组光束，而没有入射在透镜组件上的第二组光束。

公开(公告)号：US20080074879A1

公开(公告)日：2008-03-27

申请号：US11562949

申请日：2006-11-22

申请人： Wu-Cheng Kuo ,  Ya-Hui Chiang ,  Bing-Ru Chen ,  Hung-Lieh Hu ,  Kuo-Hsiang Chen

发明人： Wu-Cheng Kuo ,  Ya-Hui Chiang ,  Bing-Ru Chen ,  Hung-Lieh Hu ,  Kuo-Hsiang Chen

IPC分类号： F21S8/00

CPC分类号： F21V13/04 ,  F21S41/00

摘要： An illumination device includes a light source generating initial light beams, a lens assembly disposed on an axis, and a reflector comprising a reflecting surface. The initial light beams include a first and second reference light beams traveling along a first and second positions, respectively. The first reference light beam passes through the lens assembly to form a first predetermined light beam traveling away from the light source. A first angle is substantially formed between the first position and the axis. The second reference light beam is reflected by the reflective surface to form a second predetermined light beam traveling away from the light source. A second angle is formed between the first and second positions. The first angle is less than or equal to the second angle. The initial light beams are guided by the lens assembly and the reflector to emit the light beams in a projecting mode.

摘要翻译： 照明装置包括产生初始光束的光源，设置在轴上的透镜组件和包括反射表面的反射器。 初始光束分别包括沿着第一和第二位置行进的第一和第二参考光束。 第一参考光束通过透镜组件以形成远离光源的第一预定光束。 第一角度基本上形成在第一位置和轴线之间。 第二参考光束被反射表面反射以形成远离光源的第二预定光束。 在第一和第二位置之间形成第二角度。 第一角度小于或等于第二角度。 初始光束由透镜组件和反射器引导，以投射模式发射光束。

公开(公告)号：US08735913B2

公开(公告)日：2014-05-27

申请号：US13078541

申请日：2011-04-01

申请人： Wu-Cheng Kuo

发明人： Wu-Cheng Kuo

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L25/0756 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The invention provides a light emitting semiconductor structure, which includes a substrate; a first LED chip formed on the substrate; an adhesion layer formed on the first LED chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate.

摘要翻译： 本发明提供一种发光半导体结构，其包括基板; 形成在基板上的第一LED芯片; 形成在第一LED芯片上的粘附层; 以及形成在所述粘合层上的第二发光二极管芯片，其中所述第二LED芯片具有电连接到所述基板的第一导线。

公开(公告)号：US08399969B2

公开(公告)日：2013-03-19

申请号：US12844590

申请日：2010-07-27

申请人： Kuo-Ching Chang ,  Wu-Cheng Kuo ,  Tzu-Han Lin

发明人： Kuo-Ching Chang ,  Wu-Cheng Kuo ,  Tzu-Han Lin

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L24/33 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/04042 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/32506 ,  H01L2224/335 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package and a fabrication method thereof are provided. The chip package includes a substrate and a chip disposed over the substrate. A solder layer is disposed between the chip and the substrate. A conductive pad is disposed between the solder layer and the substrate, wherein the conductive pad includes a first portion disposed under the solder layer, a second portion disposed away from the first portion and a connective portion disposed between the first portion and the second portion. The connective portion has a width which is narrower than a width of the first portion along a first direction perpendicular to a second direction extending from the first portion to the connective portion.

摘要翻译： 提供了芯片封装及其制造方法。 芯片封装包括衬底和布置在衬底上的芯片。 焊料层设置在芯片和衬底之间。 导电焊盘设置在焊料层和衬底之间，其中导电焊盘包括布置在焊料层下方的第一部分，远离第一部分设置的第二部分和设置在第一部分和第二部分之间的连接部分。 连接部分的宽度比沿着从第一部分延伸到连接部分的第二方向垂直的第一方向的第一部分的宽度窄。