公开(公告)号：US07287919B2

公开(公告)日：2007-10-30

申请号：US11148607

申请日：2005-06-08

申请人： Hsun-Kai Chan ,  Ta-Yu Liu

发明人： Hsun-Kai Chan ,  Ta-Yu Liu

IPC分类号： G03D5/06 ,  G03D5/00

CPC分类号： G03D5/04 ,  G03F7/3042

摘要： The invention discloses a developing apparatus and a developing process. Wherein the developing process comprises following steps. First, a developing apparatus and a substrate are provided, wherein the developing apparatus comprises a conveyer and a nozzle. Then, the substrate is conveyed along a first direction by the conveyer, and the nozzle is driven to move along a second direction opposite to the first direction, wherein the nozzle sprays a developer over the substrate as moving. As mentioned above, the non-uniformity of development can be reduced.

摘要翻译： 本发明公开了一种显影装置和显影方法。 其中开发过程包括以下步骤。 首先，提供显影装置和基板，其中显影装置包括输送机和喷嘴。 然后，通过输送机沿着第一方向输送基板，并且驱动喷嘴沿与第一方向相反的第二方向移动，其中喷嘴将显影剂喷射在基板上作为移动。 如上所述，可以减少发展的不均匀性。

公开(公告)号：US20070187816A1

公开(公告)日：2007-08-16

申请号：US11548066

申请日：2006-10-10

申请人： Michael Bauer ,  Kai Chan

发明人： Michael Bauer ,  Kai Chan

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/05599 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/92247

摘要： A semiconductor component with a semiconductor chip and an adhesive film, and a method for its production is disclosed. In one embodiment, the semiconductor component has the adhesive film, which is internally prestressed and is adhesive on both faces, between the rear face of the semiconductor chip and a chip connecting surface on a circuit mount.

摘要翻译： 公开了具有半导体芯片和粘合膜的半导体部件及其制造方法。 在一个实施例中，半导体部件具有在半导体芯片的后表面和电路基座之间的芯片连接表面上的内部预应力的粘合剂膜，并且在两个表面上是粘合剂。