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    Multicolor electronic devices and processes of forming the same by printing
    53.
    发明授权
    Multicolor electronic devices and processes of forming the same by printing 有权
    多色电子设备及其印刷方法

    公开(公告)号：US08616666B2

    公开(公告)日：2013-12-31

    申请号：US12746984

    申请日：2008-12-10

    Applicant: Nugent Truong ,  Matthew Stainer

    Inventor： Nugent Truong ,  Matthew Stainer

    IPC: B41J29/38 ,  B41J2/15 ,  B41J2/14 ,  B05D5/12 ,  B05D5/06

    CPC classification number: B41M3/00 ,  G02F1/133516

    Abstract: There is provided a method of printing a regular array of rows of subpixels on a workpiece. The subpixels have c different colors and have a subpixel pitch s. A printing head has z nozzles arranged in a row with a spacing p, where z=n1(c) and p=n2(s), the printhead being at a first position relative to the workpiece. There are c different printing inks, one for each of the c colors, and each of the printing inks is supplied to the nozzles in a regular alternating pattern. The method includes steps of printing a first set of z rows of subpixels with the printing head; moving the workpiece laterally relative to the printing head by a distance d1, where d1=n3(s); printing a second set of z rows of subpixels with the printing head; repeating the printing steps for a total of n2 sets of z rows of subpixels. Variables include: c, an integer greater than 1; n1, n2, and n3 which are the same or different and are independently selected from integers greater than 0, with the proviso that n2 is not a multiple of c.

    Abstract translation: 提供了一种在工件上打印子像素行的规则阵列的方法。 子像素具有不同的颜色并具有子像素间距s。 打印头具有排列成行的间隔为p的z个喷嘴，其中z = n1（c）和p = n2（s），打印头位于相对于工件的第一位置。 存在c种不同的印刷油墨，一种用于每种c颜色，并且每种印刷油墨以规则的交替图案供应给喷嘴。 该方法包括以下步骤：用打印头打印第一组z行子像素; 将工件相对于打印头横向移动距离d1，其中d1 = n3（s）; 用打印头打印第二组z行子像素; 重复总共n2组z行子像素的打印步骤。 变量包括：c，大于1的整数; n1，n2和n3，它们相同或不同，并且独立地选自大于0的整数，条件是n2不是c的倍数。

    Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices
    54.
    发明授权
    Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices 有权
    电子设备包括连接到衬底内的导电构件并用于形成电子器件的工艺的电极

    公开(公告)号：US08247824B2

    公开(公告)日：2012-08-21

    申请号：US11525660

    申请日：2006-09-22

    Applicant: Matthew Stainer ,  Matthew Stevenson ,  Stephen Sorich

    Inventor： Matthew Stainer ,  Matthew Stevenson ,  Stephen Sorich

    IPC: H01L29/18

    CPC classification number: H01L51/0096 ,  H01L27/3248 ,  H01L27/3262 ,  Y02E10/549 ,  Y02P70/521

    Abstract: An electronic device includes a substrate. The substrate includes a first pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart from each other. The first conductive member is connected to the first pixel driving circuit. The second conductive member is part of a power transmission line. The electronic device further includes a well structure overlying the substrate and defining a pixel opening, a via, and a channel. The pixel opening is connected to the via through the channel. In addition, the electronic device includes a first electronic component. The electronic component includes a first electrode that contacts the first conductive member in the pixel opening, a second electrode that contacts the second conductive member in the via, and an organic layer lying between the first and second electrodes.

    Abstract translation: 电子装置包括基板。 衬底包括第一像素驱动电路，第一导电构件和第二导电构件。 第一和第二导电构件彼此间隔开。 第一导电构件连接到第一像素驱动电路。 第二导电构件是输电线路的一部分。 电子装置还包括覆盖衬底并限定像素开口，通孔和通道的阱结构。 像素开口通过通道连接到通孔。 另外，电子设备包括第一电子部件。 电子部件包括与像素开口中的第一导电部件接触的第一电极，与通孔中的第二导电部件接触的第二电极以及位于第一和第二电极之间的有机层。

    Coated substrate and method of making same
    55.
    发明授权
    Coated substrate and method of making same 有权
    涂布基材及其制造方法

    公开(公告)号：US08067887B2

    公开(公告)日：2011-11-29

    申请号：US11721500

    申请日：2005-12-21

    Applicant: Paul Anthony Sant ,  Matthew Stainer

    Inventor： Paul Anthony Sant ,  Matthew Stainer

    IPC: H01L29/08 ,  G09G3/10 ,  B32B1/08

    CPC classification number: H01L27/3246 ,  H01L27/3283 ,  H01L51/0003 ,  Y10T428/13 ,  Y10T428/1352

    Abstract: Provided are containment structures having a substrate structure having a plurality of walls extending from a surface to define a space, wherein at least one of the walls has an overall negative slope; a first layer deposited in the space having a first surface energy no greater than 30 mN/m; and a second layer deposited on top of the first layer.

    Abstract translation: 提供了具有基底结构的容纳结构，该基底结构具有从表面延伸以限定空间的多个壁，其中至少一个壁具有总的负斜率; 沉积在具有不大于30mN / m的第一表面能的空间中的第一层; 以及沉积在第一层的顶部上的第二层。

    Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices
    56.
    发明申请
    Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices 有权
    电子设备包括连接到衬底内的导电构件并用于形成电子器件的工艺的电极

    公开(公告)号：US20110169017A1

    公开(公告)日：2011-07-14

    申请号：US11525660

    申请日：2006-09-22

    Applicant: Matthew Stainer ,  Matthew Stevenson ,  Stephen Sorich

    Inventor： Matthew Stainer ,  Matthew Stevenson ,  Stephen Sorich

    IPC: H01L27/15 ,  H01L27/146 ,  H01L33/00 ,  H01L31/18

    CPC classification number: H01L51/0096 ,  H01L27/3248 ,  H01L27/3262 ,  Y02E10/549 ,  Y02P70/521

    Abstract: An electronic device includes a substrate. The substrate includes a first pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart from each other. The first conductive member is connected to the first pixel driving circuit. The second conductive member is part of a power transmission line. The electronic device further includes a well structure overlying the substrate and defining a pixel opening, a via, and a channel. The pixel opening is connected to the via through the channel. In addition, the electronic device includes a first electronic component. The electronic component includes a first electrode that contacts the first conductive member in the pixel opening, a second electrode that contacts the second conductive member in the via, and an organic layer lying between the first and second electrodes.

    Abstract translation: 电子装置包括基板。 衬底包括第一像素驱动电路，第一导电构件和第二导电构件。 第一和第二导电构件彼此间隔开。 第一导电构件连接到第一像素驱动电路。 第二导电构件是输电线路的一部分。 电子装置还包括覆盖衬底并限定像素开口，通孔和通道的阱结构。 像素开口通过通道连接到通孔。 另外，电子设备包括第一电子部件。 电子部件包括与像素开口中的第一导电部件接触的第一电极，与通孔中的第二导电部件接触的第二电极以及位于第一和第二电极之间的有机层。

    STRUCTURE FOR MAKING SOLUTION PROCESSED ELECTRONIC DEVICES
    57.
    发明申请
    STRUCTURE FOR MAKING SOLUTION PROCESSED ELECTRONIC DEVICES 审中-公开
    制造解决方案处理电子设备的结构

    公开(公告)号：US20100295036A1

    公开(公告)日：2010-11-25

    申请号：US12863701

    申请日：2009-01-29

    Applicant: Yaw-Ming A. Tsai ,  Matthew Stainer

    Inventor： Yaw-Ming A. Tsai ,  Matthew Stainer

    IPC: H01L51/10 ,  H01L51/40

    CPC classification number: H01L51/0005 ,  H01L27/3246 ,  H01L51/5088 ,  H01L51/5203 ,  H01L2227/323

    Abstract: There is provided a process for forming an organic electronic device wherein a TFT substrate having a non-planar surface has deposited over that substrate a planarization layer such that a substantially planar substrate, or planarized substrate, is formed. A multiplicity of thin first electrode structures having a first thickness and having tapered edges with a taper angle of no greater than 75° are formed over the planarized substrate. A multiplicity of active layers is formed over the planarized substrate. Then a buffer layer is formed by liquid deposition of a composition comprising a buffer material in a first liquid medium. The buffer layer has a second thickness which is at least 20% greater than the first thickness. A chemical containment pattern defining pixel openings is then formed over the buffer layer. A composition comprising a first active material in a second liquid medium is deposited into at least a portion of the pixel openings. Then a second electrode is formed.

    Abstract translation: 提供了一种用于形成有机电子器件的方法，其中具有非平面表面的TFT衬底已经在该衬底上沉积了平坦化层，使得形成基本平坦的衬底或平坦化衬底。 在平坦化的衬底上形成多个具有第一厚度并且具有不大于75°的锥角的锥形边缘的细的第一电极结构。 在平坦化的衬底上形成多个有源层。 然后通过在第一液体介质中液体沉积包含缓冲材料的组合物形成缓冲层。 缓冲层具有比第一厚度大至少20％的第二厚度。 然后在缓冲层上形成限定像素开口的化学容纳图案。 包含在第二液体介质中的第一活性材料的组合物沉积到像素开口的至少一部分中。 然后形成第二电极。

    Electronic devices and processes for forming the same
    58.
    发明授权
    Electronic devices and processes for forming the same 失效
    电子设备及其形成方法

    公开(公告)号：US07469638B2

    公开(公告)日：2008-12-30

    申请号：US11027133

    申请日：2004-12-30

    Applicant: Charles Douglas MacPherson ,  Dennis Damon Walker ,  Matthew Stainer ,  Christopher Todd Knudson ,  Gang Yu

    Inventor： Charles Douglas MacPherson ,  Dennis Damon Walker ,  Matthew Stainer ,  Christopher Todd Knudson ,  Gang Yu

    IPC: B41L39/00 ,  H05L51/30

    CPC classification number: H01L51/56 ,  H01L27/3211 ,  H01L27/3246 ,  H01L51/0005 ,  H05K3/1241 ,  Y10T428/24008

    Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.

    Abstract translation: 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。

    ELECTRONIC DEVICES AND PROCESSES FOR FORMING THE SAME
    60.
    发明申请
    ELECTRONIC DEVICES AND PROCESSES FOR FORMING THE SAME 审中-公开
    电子设备及其制造方法

    公开(公告)号：US20080173200A1

    公开(公告)日：2008-07-24

    申请号：US11972291

    申请日：2008-01-10

    Applicant: CHARLES DOUGLAS MACPHERSON ,  DENNIS DAMON WALKER ,  MATTHEW STAINER ,  CHRISTOPHER TODD KNUDSON ,  GANG YU

    Inventor： CHARLES DOUGLAS MACPHERSON ,  DENNIS DAMON WALKER ,  MATTHEW STAINER ,  CHRISTOPHER TODD KNUDSON ,  GANG YU

    IPC: B41L1/02

    CPC classification number: H01L51/56 ,  H01L27/3211 ,  H01L27/3246 ,  H01L51/0005 ,  H05K3/1241 ,  Y10T428/24008

    Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.

    Abstract translation: 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。

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