Abstract:
A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.
Abstract:
A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.
Abstract:
Information indicating the reason for a failure of template matching is provided. Difference information between a first image, which is referred to as a template, and a third image that is selected by the operator from a second image and that is larger than the template is displayed.
Abstract:
An inspection apparatus and method are provided, wherein even when an image that cannot be processed by a current image processing algorithm is input to an image processing unit while a working line is in operation, the inspection can be continued by newly generating an image processing algorithm optimized in keeping with a particular image. The apparatus includes an erroneous recognition detector, a teacher data generator and a switching unit for switching the current image processing algorithm to a new image processing algorithm generated based on an updated teacher data group. As a result, the inspection can be continued without extremely decreasing the accuracy even when an unexpected image is input to the working line.
Abstract:
An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.
Abstract:
It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.
Abstract:
An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.
Abstract:
A pattern matching apparatus comprising: means for storing photographed image data of a semiconductor device; means for storing CAD data of said semiconductor device; an information input means for inputting information on the white band width contained in said image data; a pattern extracting means for extracting a pattern on the semiconductor device from said image data by using the white band width information; and a matching means for matching said pattern with the CAD data.
Abstract:
It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles [obtained at] irradiated from a surface portion of said sample [irradiated with] in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample [as viewed from a direction of said charged particle beam source,] based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.
Abstract:
An apparatus for calculating a normalized correlation coefficient used as a similarity evaluation measure by using image data values of pixels in a template image and image data values of pixels in a subimage, included in a search image, corresponding to the template image, has a memory that stores image data values of pixels in the search image and calculating means that calculate a sum of image data values of pixels in the template image and a sum of image data values of pixels in the first rectangular region in the search image or a sum of squares of image data values of pixels in the template image and a sum of squares of image data values of pixels in the first rectangular region in the search image. Normalized correlation coefficient calculating means calculate a normalized correlation coefficient on the basis of the sum of image data values of pixels in the template image and the sum of image data values of pixels in the first rectangular region in the search image, or the sum of squares of image data values of pixels in the template image and the sum of squares of image data values of pixels in the first rectangular region in the search image.