SECONDARY PROCESSOR MANAGEMENT ALLOWING DEEP SLEEP OF PRIMARY PROCESSOR

    公开(公告)号:US20170127349A1

    公开(公告)日:2017-05-04

    申请号:US14927117

    申请日:2015-10-29

    Applicant: NETGEAR, INC.

    Abstract: The invention is directed to a wireless communication device that includes: a radio unit for performing wireless communications with at least one external device; at least one battery for supplying power to the wireless communication device; and at least one processing unit for controlling the radio unit, wherein the at least one processing unit, includes: host processing unit configured to control execution of one or more active state operations; and a secondary processing unit, coupled to the host processing unit and the radio unit, configured to control execution of one or more low-priority operations while the host processing unit is powered down, wherein the secondary processing unit is further configured to determine if an active-state operation is pending, and if it is determined that an active state operation is pending, to power up the host processing unit to control execution of the active state operation.

    System and method for bridging to a LTE wireless communication network
    57.
    发明授权
    System and method for bridging to a LTE wireless communication network 有权
    用于桥接到LTE无线通信网络的系统和方法

    公开(公告)号:US09560691B2

    公开(公告)日:2017-01-31

    申请号:US14958758

    申请日:2015-12-03

    Applicant: NETGEAR, Inc.

    CPC classification number: H04W84/105 H04L12/4625 H04L69/18 H04W88/10 H04W92/20

    Abstract: A system and method for bridging user devices communicating according to a 3rd Generation (3G) communication protocol to a LTE wireless communication network, thereby enabling user devices that do not have sufficient signal strength for directly coupling to the LTE wireless communication network to nevertheless access such wireless communication systems and methods via a bridging system.

    Abstract translation: 一种用于将根据第三代(3G)通信协议进行通信的用户设备桥接到LTE无线通信网络的系统和方法,从而使得不具有足够的信号强度的用户设备直接耦合到LTE无线通信网络, 无线通信系统和方法通过桥接系统。

    System and method for configuring device connections in an extended network environment
    59.
    发明授权
    System and method for configuring device connections in an extended network environment 有权
    用于在扩展网络环境中配置设备连接的系统和方法

    公开(公告)号:US09468025B2

    公开(公告)日:2016-10-11

    申请号:US13974090

    申请日:2013-08-23

    Applicant: NETGEAR, Inc.

    CPC classification number: H04W76/10 H04W48/20

    Abstract: An extended network is configured to implement an extended management function to identify a wireless access device providing a highest quality wireless connection to a wireless device. The extended network includes a gateway wireless access device configured to enable communication between the extended network and an external network, at least one additional wireless access device in the extended network, and at least one wireless device having a wireless connection to a least one of an additional wireless access device and the gateway wireless access device. At least one wireless access device includes a processor executing the extended management function to identify the wireless access device providing the highest quality wireless connection based on wireless connection quality information transmitted from each wireless access device.

    Abstract translation: 扩展网络被配置为实现扩展管理功能以识别向无线设备提供最高质量无线连接的无线接入设备。 扩展网络包括被配置为实现扩展网络和外部网络之间的通信,扩展网络中的至少一个附加无线接入设备和至少一个无线设备的至少一个无线设备的网关无线接入设备, 附加无线接入设备和网关无线接入设备。 至少一个无线接入设备包括执行扩展管理功能的处理器,以基于从每个无线接入设备发送的无线连接质量信息来识别提供最高质量无线连接的无线接入设备。

    APPARATUS AND METHOD FOR AN INTEGRATED HEAT SINK AND ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD ASSEMBLY
    60.
    发明申请
    APPARATUS AND METHOD FOR AN INTEGRATED HEAT SINK AND ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD ASSEMBLY 审中-公开
    集成散热和电磁干扰(EMI)屏蔽装置的装置和方法

    公开(公告)号:US20160227673A1

    公开(公告)日:2016-08-04

    申请号:US14609753

    申请日:2015-01-30

    Applicant: NETGEAR, Inc.

    CPC classification number: H01L23/3672 H01L21/4882 H01L23/467 H01L23/552

    Abstract: A heat sink and an EMI shield are integrated via injection molding. The heat sink and the EMI shield may be molded together as an integrated unit with an intervening non-electrically conductive layer formed between the heat sink and the EMI shield during the injection molding process. The integrated molded unit could also be molded to a thermally conductive layer comprising another material such as an elastomer suitable for more precisely conforming to the contours of an electrical component for maximizing thermal transfer. Accordingly, the number of steps and amount of materials required to provide thermal dissipation and EMI protection for an electrical component may be reduced.

    Abstract translation: 散热器和EMI屏蔽通过注塑成型。 散热器和EMI屏蔽件可以作为集成单元被模制在一起,并且在注射成型过程期间在散热器和EMI屏蔽之间形成介于其间的非导电层。 集成模制单元也可以模制成导热层,该导热层包括其它材料,例如弹性体,其适合于更精确地符合电气部件的轮廓以最大限度地进行热转印。 因此,可以减少为电气部件提供散热和EMI保护所需的步骤数量和数量。

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