公开(公告)号：US08217907B2

公开(公告)日：2012-07-10

申请号：US12119938

申请日：2008-05-13

申请人： Tae Hun Kim ,  Han Su Kim

发明人： Tae Hun Kim ,  Han Su Kim

IPC分类号： G06F3/041

CPC分类号： G06F17/30905 ,  G06F3/04815 ,  G06F3/0483 ,  G06F3/0485 ,  G06F3/04883 ,  G06F2203/04802 ,  H04M1/72561

摘要： A mobile terminal and a method of controlling the mobile terminal are provided. Specifically, zooming in/out or shifting a display screen is facilitated. The mobile terminal includes a touchscreen for displaying a webpage including a plurality of areas, a wireless communication unit for accessing the Internet, and a control unit for shifting the displayed webpage in response to touching a first point of the displayed webpage and dragging from the first point to a second point on the displayed webpage, when the displayed webpage is shifted in a direction of the dragging.

摘要翻译： 提供了移动终端和控制移动终端的方法。 具体地说，放大/缩小或移动显示屏幕变得容易。 移动终端包括用于显示包括多个区域的网页的触摸屏，用于访问因特网的无线通信单元，以及响应于触摸所显示的网页的第一点并从第一个 指向所显示的网页上的第二点，当显示的网页沿着拖动的方向移动时。

公开(公告)号：US20110304575A1

公开(公告)日：2011-12-15

申请号：US13218351

申请日：2011-08-25

申请人： Tae Hun Kim

发明人： Tae Hun Kim

IPC分类号： G06F3/041

CPC分类号： G06F3/165 ,  G06F3/041 ,  G06F3/04883 ,  G06F3/04886 ,  G06F17/30752

摘要： An electronic device and a method for inputting information through touch input device of an electronic device is provided. The method inputs information including at least one of symbols and characters through touching of a screen displayed on the touch input device, and executes a specific application capable of processing the input information.

摘要翻译： 提供了一种通过电子设备的触摸输入设备输入信息的电子设备和方法。 该方法通过触摸在触摸输入设备上显示的屏幕来输入包括符号和字符中的至少一个的信息，并执行能够处理输入信息的特定应用。

公开(公告)号：USD648326S1

公开(公告)日：2011-11-08

申请号：US29373444

申请日：2011-04-08

申请人： Yu-Li Sung ,  Tai-Hyung Ju ,  Sung-Il Bang ,  Tae-Hun Kim ,  Sin-Wi Moon

设计人： Yu-Li Sung ,  Tai-Hyung Ju ,  Sung-Il Bang ,  Tae-Hun Kim ,  Sin-Wi Moon

公开(公告)号：USD647884S1

公开(公告)日：2011-11-01

申请号：US29373445

申请日：2011-04-08

申请人： Sin-Wi Moon ,  Tai-Hyung Ju ,  Sung-Il Bang ,  Tae-Hun Kim ,  Yu-Li Sung

设计人： Sin-Wi Moon ,  Tai-Hyung Ju ,  Sung-Il Bang ,  Tae-Hun Kim ,  Yu-Li Sung

公开(公告)号：US08031184B2

公开(公告)日：2011-10-04

申请号：US12016990

申请日：2008-01-18

申请人： Tae Hun Kim

发明人： Tae Hun Kim

IPC分类号： G06F3/045

CPC分类号： G06F3/165 ,  G06F3/041 ,  G06F3/04883 ,  G06F3/04886 ,  G06F17/30752

摘要： An electronic device and a method for receiving an input of information through a touch input device of the electronic device is provided. The method includes receiving information including at least one of symbols and characters through the input generated by touching of a screen displayed on the touch input device, and executing a specific application to process the received information.

摘要翻译： 提供了一种通过电子设备的触摸输入设备接收信息输入的电子设备和方法。 该方法包括通过触摸在触摸输入设备上显示的屏幕产生的输入以及执行特定的应用来处理所接收的信息来接收包括符号和字符中的至少一个的信息。

公开(公告)号：US08022528B2

公开(公告)日：2011-09-20

申请号：US12952434

申请日：2010-11-23

申请人： Tae-Hun Kim

发明人： Tae-Hun Kim

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L23/28

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of forming a stack-type semiconductor package includes preparing a lower printed circuit board including a plurality of interconnections and a plurality of ball lands for connection on an upper surface thereof. One or more first chips, which are electrically connected to the plurality of interconnections and sequentially stacked, are mounted on the lower printed circuit board. A lower molded resin compound is formed on the lower printed circuit board to cover the first chips, and is formed to have via holes exposing the ball lands for connection. An upper chip package, under which solder balls are formed, is aligned so that the solder balls correspond to the via holes of the lower molded resin compound, respectively. The solder balls are reflown to form connection conductors filling the via holes. A stack-type semiconductor package structure and an electronic system including the same are also provided.

摘要翻译： 形成堆叠型半导体封装的方法包括制备包括多个互连的下印刷电路板和用于在其上表面上连接的多个焊盘。 电连接到多个互连并顺序堆叠的一个或多个第一芯片安装在下印刷电路板上。 在下印刷电路板上形成下模塑树脂化合物以覆盖第一芯片，并且形成为具有露出焊盘以用于连接的通孔。 将形成焊球的上部芯片封装对准，使得焊球分别对应于下部模制树脂化合物的通孔。 焊球被重新熔化以形成填充通孔的连接导体。 还提供了堆叠型半导体封装结构和包括其的电子系统。

公开(公告)号：US07965912B2

公开(公告)日：2011-06-21

申请号：US12161142

申请日：2007-02-27

申请人： Tae Hyung Rhee ,  Tae Hun Kim ,  Hyung Jae Lee ,  Byong Gwon You

发明人： Tae Hyung Rhee ,  Tae Hun Kim ,  Hyung Jae Lee ,  Byong Gwon You

IPC分类号： G02B6/34 ,  G02B6/12

CPC分类号： G02B6/12033 ,  G02B6/12016 ,  G02B6/1203

摘要： Two methods are presented in order to properly compensate the changes of the optical characteristics, which are caused by the optical path length change. First, a path length compensation method in which the additional optical path length, equivalent to the dicing kerf width of the substrate, is added onto the diced-to-be waveguide part of the AWG chip during the waveguide design process and fabrication process so that the compensated optical path length is maintained even after dicing. In addition, a position compensation method is provided in which an additional waveguide is added at the position shifted by a distance equivalent to the kerf width of the substrate such that the additional waveguide undergoes the minimized path length change after dicing is performed.

摘要翻译： 提出了两种方法来适当地补偿由光程长度变化引起的光学特性的变化。 首先，在波导设计过程和制造过程中，在AWG芯片的切割到波导部分上添加相当于基板的切割切口宽度的附加光程长度的路径长度补偿方法， 即使在切割之后也保持补偿光路长度。 此外，提供一种位置补偿方法，其中在与基板的切口宽度相等的距离处的位置处添加附加波导，使得附加波导在执行切割之后经历最小化的路径长度变化。

公开(公告)号：US07903191B2

公开(公告)日：2011-03-08

申请号：US12178224

申请日：2008-07-23

申请人： Young-Man Kim ,  Tae-Kyung Lee ,  Hwan-Jin Kim ,  Tae-Hun Kim

发明人： Young-Man Kim ,  Tae-Kyung Lee ,  Hwan-Jin Kim ,  Tae-Hun Kim

IPC分类号： G02F1/1333

CPC分类号： G02F1/133308 ,  G02F2001/133322

摘要： A display device includes a display panel displaying an image, a driving circuit substrate electrically connected to the display panel and having a contact member mounted on one side thereof, a frame accommodating the display panel and the driving circuit substrate and having a through hole, and an accommodating member arranged below the frame and coupled to the frame, wherein the contact member contacts the accommodating member through the through hole.

摘要翻译： 显示装置包括显示图像的显示面板，电连接到显示面板并具有安装在显示面板上的接触构件的驱动电路基板，容纳显示面板和驱动电路基板并具有通孔的框架， 布置在所述框架下方并且联接到所述框架的容纳构件，其中所述接触构件通过所述通孔接触所述容纳构件。

公开(公告)号：US20110047742A1

公开(公告)日：2011-03-03

申请号：US12990503

申请日：2008-05-07

申请人： Jae Woong Kim ,  Tae Hun Kim ,  Kyung Min Kim

发明人： Jae Woong Kim ,  Tae Hun Kim ,  Kyung Min Kim

IPC分类号： B60S1/40

CPC分类号： B60S1/3858 ,  B60S1/387 ,  B60S1/4003 ,  B60S1/4009 ,  B60S1/4067 ,  B60S1/4087 ,  B60S2001/4025 ,  B60S2001/4051 ,  B60S2001/4058

摘要： A wiper device for vehicles is disclosed. The wiper device (1) for vehicles according to the present invention provides compatible standardized parts, such that the wiper device can be applied to various kinds of drive arms having different shapes and sizes. Therefore, the degree of freedom in design for the standardization of products can be increased, thus markedly reducing the production costs. Furthermore, thanks to the standardization of products, the present invention can be easily adapted for mass production. Hence, there are industrial effects in that products can be economically produced, distributed and spread.

摘要翻译： 公开了一种用于车辆的刮水器装置。 根据本发明的用于车辆的刮水器装置（1）提供了兼容的标准化部件，使得刮水器装置可以应用于具有不同形状和尺寸的各种驱动臂。 因此，可以提高产品标准化设计的自由度，显着降低生产成本。 此外，由于产品的标准化，本发明可以容易地进行批量生产。 因此，产业有效果在于产品可以经济地生产，分散和传播。

公开(公告)号：US07851259B2

公开(公告)日：2010-12-14

申请号：US12201160

申请日：2008-08-29

申请人： Tae-Hun Kim

发明人： Tae-Hun Kim

IPC分类号： H01L21/48 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of forming a stack-type semiconductor package includes preparing a lower printed circuit board including a plurality of interconnections and a plurality of ball lands for connection on an upper surface thereof. One or more first chips, which are electrically connected to the plurality of interconnections and sequentially stacked, are mounted on the lower printed circuit board. A lower molded resin compound is formed on the lower printed circuit board to cover the first chips, and is formed to have via holes exposing the ball lands for connection. An upper chip package, under which solder balls are formed, is aligned so that the solder balls correspond to the via holes of the lower molded resin compound, respectively. The solder balls are reflown to form connection conductors filling the via holes. A stack-type semiconductor package structure and an electronic system including the same are also provided.

摘要翻译： 形成堆叠型半导体封装的方法包括制备包括多个互连的下印刷电路板和用于在其上表面上连接的多个焊盘。 电连接到多个互连并顺序堆叠的一个或多个第一芯片安装在下印刷电路板上。 在下印刷电路板上形成下模塑树脂化合物以覆盖第一芯片，并且形成为具有露出焊盘以用于连接的通孔。 将形成焊球的上部芯片封装对准，使得焊球分别对应于下部模制树脂化合物的通孔。 焊球被重新熔化以形成填充通孔的连接导体。 还提供了堆叠型半导体封装结构和包括其的电子系统。