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111 条记录 (耗时 0.031 秒)

    Ink-jet head for providing accurate positioning of nozzles of segment chips on a holder
    51.
    发明授权
    Ink-jet head for providing accurate positioning of nozzles of segment chips on a holder 失效
    喷墨头用于提供分段芯片的喷嘴在支架上的精确定位

    公开(公告)号：US5971522A

    公开(公告)日：1999-10-26

    申请号：US948255

    申请日：1997-10-09

    申请人： Masahiro Ono ,  Akihiko Miyaki ,  Takumi Kawamura

    发明人： Masahiro Ono ,  Akihiko Miyaki ,  Takumi Kawamura

    IPC分类号： B41J2/045 ,  B41J2/055 ,  B41J2/14 ,  B41J2/145 ,  B41J2/16 ,  B41J2/01

    CPC分类号： B41J2/145 ,  B41J2/14274 ,  B41J2202/19 ,  B41J2202/20

    摘要： An ink-jet head includes a holder having first reference surfaces arrayed at a predetermined pitch in a main scanning direction. A plurality of segment chips is held on the holder. Each of the plurality of segment chips has an ink chamber plate and nozzles, each of the ink chamber plates having a flat surface on which grooves forming ink chambers are arrayed in a row perpendicular to the main scanning direction. Each of the ink chamber plates has a second reference surface extending from and coplanar with the flat surface. The second reference surfaces of the ink chamber plates of the plurality of segment chips are in contact with the first reference surfaces of the holder so that the nozzles of the respective segment chips are positioned on the holder at the pitch in the main scanning direction, and the plurality of segment chips are fixed to the holder.

    摘要翻译： 喷墨头包括具有在主扫描方向上以预定间距排列的第一参考表面的保持器。 多个片段保持在保持器上。 多个片段中的每一个均具有墨室板和喷嘴，每个墨室板具有平坦表面，在该平坦表面上形成墨室的槽垂直于主扫描方向排列。 每个墨室板具有从平表面延伸并且与平坦表面共面的第二参考表面。 多个分段芯片的墨室板的第二基准表面与保持器的第一参考表面接触，使得各个分段芯片的喷嘴以主扫描方向以间距定位在支架上，并且 多个片段芯片固定在保持器上。

    Heat-resistant resin from aromatic cyanamide compound and aromatic amine compound
    57.
    发明授权
    Heat-resistant resin from aromatic cyanamide compound and aromatic amine compound 失效
    芳香族氰胺化合物和芳香胺化合物的耐热树脂

    公开(公告)号：US4486583A

    公开(公告)日：1984-12-04

    申请号：US525700

    申请日：1983-08-23

    申请人： Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Hirosada Morishita

    发明人： Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Hirosada Morishita

    IPC分类号： C08G73/00 ,  B32B27/04 ,  C08G73/06 ,  C08L79/04 ,  C08G73/08

    CPC分类号： C08G73/0644 ,  Y10T428/31504

    摘要： A polymer which has excellent heat resistance and mechanical properties which is useful as a molding material, contains the structural units having the following formulae [I] and [II]: ##STR1## wherein A and B each represents an at least divalent organic group having at least one aromatic ring such as a diphenyl ring; and m and n each represents a number of at least 1. The polymer is used in the form of a solution or varnish as an impregnating, laminating, bonding or film-forming coating or prepreg-forming varnish. A resin composition for forming the polymer contains an aromatic cyanamide compound and an aromatic amine which are reacted to form a prepolymer which, upon heating, is converted into a cured polymer having the structural units of formulae [I] and [II].

    摘要翻译： 具有优异的耐热性和机械性能的聚合物可用作成型材料，含有具有下式[I]和[II]的结构单元：即具有异质单胺环的聚合物单元 （即，具有正常三聚氰胺环的聚合物单元）其中A和B各自表示至少具有至少一个芳环的二价有机基团，例如二苯基环; m和n各自表示至少为1的数量。聚合物以溶液或清漆的形式用作浸渍，层压，粘合或成膜涂层或预浸料形成清漆。 用于形成聚合物的树脂组合物含有芳香族氰酰胺化合物和芳族胺，它们反应形成预聚物，其在加热时转化为具有式[I]和[II]结构单元的固化聚合物。

    Semiconductor integrated circuit
    59.
    发明授权
    Semiconductor integrated circuit 有权
    半导体集成电路

    公开(公告)号：US09136717B2

    公开(公告)日：2015-09-15

    申请号：US13040891

    申请日：2011-03-04

    申请人： Kyouichi Kashima ,  Yoshitaka Fukushima ,  Masahiro Ono ,  Tetsuro Hirano

    发明人： Kyouichi Kashima ,  Yoshitaka Fukushima ,  Masahiro Ono ,  Tetsuro Hirano

    IPC分类号： H02H3/00 ,  H02H7/00 ,  H02J7/00 ,  H02H9/00 ,  H02H3/20 ,  H02H9/04 ,  H02H3/22

    CPC分类号： H02J7/0016

    摘要： A circuit device connected between a neighboring pair of terminals in a semiconductor integrated circuit is protected from electrostatic damage due to a surge voltage when the surge voltage is applied between the neighboring pair of terminals. The semiconductor integrated circuit is formed to include terminals P0-P14, MOS transistors MN0-MN15 in diode connection, protection diode circuits HD0-HD14, MOS transistors T1-T14 for discharging electricity from batteries, a battery voltage detection control circuit and a clamp circuit for overvoltage protection. Each of the MOS transistors T1-T14 for discharging electricity from the batteries is connected between each neighboring pair of the terminals P0-P14 through wirings. Each of the MOS transistors MN1-MN14 in diode connection is connected between each neighboring pair of the terminals.

    摘要翻译： 当在相邻的一对端子之间施加浪涌电压时，连接在半导体集成电路中的相邻的一对端子之间的电路装置被防止由于浪涌电压的静电损伤。 半导体集成电路形成为包括端子P0-P14，二极管连接的MOS晶体管MN0-MN15，保护二极管电路HD0-HD14，用于从电池放电的MOS晶体管T1-T14，电池电压检测控制电路和钳位电路 用于过电压保护。 用于从电池放电的MOS晶体管T1-T14中的每一个通过布线连接在每个相邻的一对端子P0-P14之间。 二极管连接的MOS晶体管MN1〜MN14中的每一个连接在每个相邻的一对端子之间。