公开(公告)号：US4946734A

公开(公告)日：1990-08-07

申请号：US122268

申请日：1987-11-18

申请人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Toshikazu Narahara

发明人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Toshikazu Narahara

IPC分类号： C08G73/06 ,  C08G73/12 ,  H05K1/03

CPC分类号： C08G73/121 ,  C08G73/06 ,  H05K1/0346 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721 ,  Y10T442/3594

摘要： A resin composition for printed circuit board and the printed circuit board in which said resin composition is used as substrate, said resin composition comprising one or more cyclic phosphonitrile compounds represented by the general formula [I] and/or [II] and an aromatic maleimide compound and/or an aromatic amine: ##STR1## wherein at least two of R's (R.sub.1 to R.sub.8) are groups represented by ##STR2##

公开(公告)号：US4070416A

公开(公告)日：1978-01-24

申请号：US605324

申请日：1975-08-18

申请人： Toshikazu Narahara ,  Katuo Sugawara ,  Yoshiharu Karasawa ,  Hitoshi Yokono ,  Junji Mukai ,  Tadashi Muroi

发明人： Toshikazu Narahara ,  Katuo Sugawara ,  Yoshiharu Karasawa ,  Hitoshi Yokono ,  Junji Mukai ,  Tadashi Muroi

IPC分类号： C08G18/00 ,  C08G18/79 ,  C08G59/40 ,  C08G69/06 ,  C08L63/00

CPC分类号： C08G18/791 ,  C08G18/003 ,  C08G59/4028 ,  C08G69/06 ,  C08G2105/02

摘要： A novel thermosetting resin can be obtained by mixing 1 equivalent or more of a polyfunctional isocyanate per 1 equivalent of a polyfunctional epoxide and then carrying out a polymerization reaction of the mixture in the presence of the catalyst which forms isocyanurate rings and oxazolidone rings so as to enable the mixture to form 2 or more isocyanurate rings directly connected with oxazolidone rings through an isocyanate residues.The resulting thermosetting resin has excellent electrical, chemical and impact resistances and excellent self-extinguishing properties. Said resin is used as an electric insulating material.

摘要翻译： 可以通过将1当量或更多个多官能异氰酸酯/ 1当量多官能环氧化物混合，然后在形成异氰脲酸酯环和恶唑烷酮环的催化剂存在下进行混合物的聚合反应，得到新的热固性树脂，以便 使得混合物通过异氰酸酯残基形成与恶唑烷酮环直接连接的2个或更多个异氰脲酸酯环。

公开(公告)号：US5212244A

公开(公告)日：1993-05-18

申请号：US772846

申请日：1991-10-08

申请人： Katuo Sugawara ,  Akio Takahashi ,  Junichi Katagiri ,  Akira Nagai ,  Masahiro Ono ,  Toshikazu Narahara

发明人： Katuo Sugawara ,  Akio Takahashi ,  Junichi Katagiri ,  Akira Nagai ,  Masahiro Ono ,  Toshikazu Narahara

IPC分类号： C08F279/02 ,  C08J5/24 ,  H05K1/03

CPC分类号： C08J5/24 ,  C08F279/02 ,  H05K1/0353 ,  C08J2351/00

摘要： The present invention provide a thermosetting resin composition comprising(a) a poly-p-hydroxstyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and from more than denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

摘要翻译： 本发明提供一种热固性树脂组合物，其包含（a）由通式（I）表示的聚对羟基苯乙烯衍生物，其中A为卤素基团，R 1为2至4个碳原子的链烯基或链烯酰基 m表示1〜4的数，大于1〜100的数，（b）环氧改性的聚丁二烯和（c）芳香族马来酰亚胺化合物，以及使用该树脂的预浸料坯和层压片 组成。

公开(公告)号：US5065285A

公开(公告)日：1991-11-12

申请号：US489549

申请日：1990-03-07

申请人： Akira Nagai ,  Katuo Sugawara ,  Masahiro Suzuki ,  Junichi Katagiri ,  Akio Takahashi

发明人： Akira Nagai ,  Katuo Sugawara ,  Masahiro Suzuki ,  Junichi Katagiri ,  Akio Takahashi

IPC分类号： H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/4626 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K3/0023 ,  H05K3/184 ,  H05K3/386

摘要： The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.

摘要翻译： 通过在电路板的层之间采用特定的粘合剂层，使多层电路板中的各层之间的位错及其制造方法及其应用最小化。 粘合剂层由熔点高于用于形成多层（或叠层）电路板的温度的树脂的薄膜和熔点低于用于形成多层电路板的温度的粘合剂构成 。

公开(公告)号：US4587162A

公开(公告)日：1986-05-06

申请号：US754449

申请日：1985-07-12

申请人： Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： C08L29/00 ,  B29C70/06 ,  B29L9/00 ,  B32B27/04 ,  B32B37/00 ,  C08J5/04 ,  C08J5/24 ,  C08L7/00 ,  C08L15/00 ,  C08L21/00 ,  C08L29/04 ,  C08L29/10 ,  C08L33/00 ,  C08L33/02 ,  C08L39/00 ,  C08L39/04 ,  C08L47/00 ,  H05K1/03 ,  B32B27/00 ,  G03C1/68

CPC分类号： H05K1/0346 ,  C08L15/00 ,  C08L39/04 ,  Y10T442/3528 ,  Y10T442/3667

摘要： A resin composition comprising a prepolymer of homopolymer or copolymer of isocyanuric acid derivative or cyanuric acid derivative, and a cyclized polybutadiene can give a laminate for multi-layer printed circuit boards excellent in heat resistance, dimensional stability and high-frequency electrical properties.

摘要翻译： 包含异氰脲酸衍生物或氰尿酸衍生物的均聚物或共聚物的预聚物和环化聚丁二烯的树脂组合物可以得到耐热性，尺寸稳定性和高频电性能优异的多层印刷电路板的层压体。

公开(公告)号：US5215842A

公开(公告)日：1993-06-01

申请号：US638544

申请日：1991-01-08

申请人： Sukekazu Aratani ,  Shigeo Suzuki ,  Akira Hosoya ,  Katuo Sugawara ,  Toshiro Saito ,  Tsuneaki Kawanishi ,  Noriyuki Kinjo ,  Yasuo Katsuya ,  Akira Kageyama

发明人： Sukekazu Aratani ,  Shigeo Suzuki ,  Akira Hosoya ,  Katuo Sugawara ,  Toshiro Saito ,  Tsuneaki Kawanishi ,  Noriyuki Kinjo ,  Yasuo Katsuya ,  Akira Kageyama

IPC分类号： C07D215/12 ,  C07D233/64 ,  C07D235/04 ,  C07D263/32 ,  C07D263/56 ,  C07D277/28 ,  C07D277/66 ,  C07D277/84 ,  G03G5/06

CPC分类号： G03G5/0614 ,  C07D215/12 ,  C07D263/32 ,  C07D277/28 ,  G03G5/0631 ,  G03G5/0637 ,  G03G5/067

摘要： A photosensitive element for electrophotography has an electrically conductive substrate and a layer structure thereon comprising a charge generating substance and a charge transport substance. An improved charge transport substance is a derivative of triphenylamine in which at least 80% of the electrons in the highest occupied molecular orbital are located on the triphenylamine skeleton. Examples of such compounds have the following formula: ##STR1## wherein X is a an optionally substituted heterocyclic radical containing at least one ring nitrogen, Q is a single bond or --C.dbd.C--, and Z.sub.1, Z.sub.2 and Z.sub.3 are H, lower alkyl or alkoxy, aryl, NO.sub.2, CF.sub.3, --N(R').sub.2, --S--C.sub.6 H.sub.5 or --S(R').sub.2.

公开(公告)号：US5041478A

公开(公告)日：1991-08-20

申请号：US533815

申请日：1990-06-06

申请人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Toshikazu Narahara

发明人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Toshikazu Narahara

IPC分类号： C08G73/06 ,  C08G73/12 ,  H05K1/03

CPC分类号： C08G73/121 ,  C08G73/06 ,  H05K1/0346 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721 ,  Y10T442/3594

摘要： A resin composition for printed circuit board and the printed circuit board in which said resin composition is used as substrate, said resin composition comprising one or more cyclic phosphonitrile compounds represented by the general formula [I] and/or [II] and an aromatic maleimide compound and/or an aromatic amine: ##STR1## wherein at least two of R's (R.sub.1 to R.sub.8) are groups represented by ##STR2##

公开(公告)号：US4784917A

公开(公告)日：1988-11-15

申请号：US854507

申请日：1986-04-22

申请人： Keiko Tawara ,  Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Keiko Tawara ,  Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： C08L25/00 ,  C08F290/12 ,  C08F299/00 ,  C08J5/24 ,  C08L7/00 ,  C08L9/00 ,  C08L21/00 ,  C08L25/18 ,  C08L33/00 ,  C08L47/00 ,  H05K1/03 ,  B32B17/10 ,  B32B27/08 ,  B32B27/34

CPC分类号： C08L25/18 ,  C08F290/124 ,  C08F299/00 ,  C08J5/24 ,  C08L9/00 ,  H05K1/0326 ,  Y10T428/31645 ,  Y10T428/31746 ,  Y10T428/3175

摘要： A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.

摘要翻译： 一种热固性树脂组合物，其包含作为必要组分（a）预聚物，其包含通式为其中A表示氢或卤素原子的聚（对羟基苯乙烯）衍生物或具有2〜 4个碳原子，m表示1〜4的数，n表示1〜100的数，（b）1,2-聚丁二烯或其衍生物。 通过使用这种新型树脂组合物和常规设备和方法，可以容易地获得能够生产适合用于多层印刷电路板的低介电常数的层压材料的无粘性预浸料，其改善了接合铜箔的剥离强度， 机械强度，阻燃性和耐热性。

公开(公告)号：US4738900A

公开(公告)日：1988-04-19

申请号：US854766

申请日：1986-04-23

申请人： Masahiro Ono ,  Akio Takahashi ,  Katuo Sugawara ,  Ritsuro Tada ,  Akira Nagai ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Masahiro Ono ,  Akio Takahashi ,  Katuo Sugawara ,  Ritsuro Tada ,  Akira Nagai ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： B32B15/08 ,  B32B15/088 ,  C08G73/00 ,  C08G73/06 ,  C08G73/10 ,  C08G73/12 ,  C08J5/24 ,  H01B3/30 ,  H01L23/14 ,  H05K1/03 ,  H05K3/46 ,  C08F283/00

CPC分类号： H05K1/0346 ,  C08G73/12 ,  H01B3/303 ,  H01L23/145 ,  H05K1/0313 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/31721

摘要： Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.

摘要翻译： 通过加热热固性聚合性组合物而得到的固化树脂，所述组合物包含通过加热聚合的放热聚合温度范围内的至少两种聚合性化合物基本上彼此重合，例如芳香族马来酰亚胺化合物和芳香族氨基氰化合物 ，通过加热聚合显示基本上一个放热聚合峰的组成具有良好的耐热性，并且可以获得能够直接装载LSI芯片和芯片载体的具有良好耐热性的层叠高密度布线板 ，使用组合。

公开(公告)号：US4710854A

公开(公告)日：1987-12-01

申请号：US24894

申请日：1987-03-10

申请人： Minoru Yamada ,  Motoyo Wajima ,  Akira Masaki ,  Akio Takahashi ,  Keiichirou Nakanishi ,  Katuo Sugawara

发明人： Minoru Yamada ,  Motoyo Wajima ,  Akira Masaki ,  Akio Takahashi ,  Keiichirou Nakanishi ,  Katuo Sugawara

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K1/14

CPC分类号： H05K3/4626 ,  H05K1/024 ,  H05K1/0237 ,  H05K1/0346 ,  H05K1/115 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0191 ,  H05K2201/09327 ,  H05K2201/09536 ,  H05K3/4623

摘要： A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).

摘要翻译： 多层布线板结构包括在每个导体层之间交错的多个导体层和绝缘层。 导体层包括功率（或接地）线层和信号线层，并且在由信号线层插入的功率（接地）线层之间使用具有较低相对介电常数的一种类型的绝缘层和具有较高相对介电常数的另一种类型的绝缘层 （s）。