公开(公告)号：US4587162A

公开(公告)日：1986-05-06

申请号：US754449

申请日：1985-07-12

申请人： Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： C08L29/00 ,  B29C70/06 ,  B29L9/00 ,  B32B27/04 ,  B32B37/00 ,  C08J5/04 ,  C08J5/24 ,  C08L7/00 ,  C08L15/00 ,  C08L21/00 ,  C08L29/04 ,  C08L29/10 ,  C08L33/00 ,  C08L33/02 ,  C08L39/00 ,  C08L39/04 ,  C08L47/00 ,  H05K1/03 ,  B32B27/00 ,  G03C1/68

CPC分类号： H05K1/0346 ,  C08L15/00 ,  C08L39/04 ,  Y10T442/3528 ,  Y10T442/3667

摘要： A resin composition comprising a prepolymer of homopolymer or copolymer of isocyanuric acid derivative or cyanuric acid derivative, and a cyclized polybutadiene can give a laminate for multi-layer printed circuit boards excellent in heat resistance, dimensional stability and high-frequency electrical properties.

摘要翻译： 包含异氰脲酸衍生物或氰尿酸衍生物的均聚物或共聚物的预聚物和环化聚丁二烯的树脂组合物可以得到耐热性，尺寸稳定性和高频电性能优异的多层印刷电路板的层压体。

公开(公告)号：US4607094A

公开(公告)日：1986-08-19

申请号：US697530

申请日：1985-02-01

申请人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara ,  Akira Nagai

发明人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara ,  Akira Nagai

IPC分类号： C08G73/00 ,  C08G73/06 ,  C08L79/04 ,  C08G69/14

CPC分类号： C08G73/0655

摘要： The thermosetting resin composition of the present invention is prepared by mixing an aromatic cyanamide compound with a cyclic ester compound and/or a cyclic amide compound. Although a solventless type composition is preferable, the present invention is not limited thereto. The cured product of the present invention can be prepared by heating and curing said thermosetting resin composition. The obtained cured product of the present invention usually contains melamine rings, isomelamine rings and linear polyester and/or a linear polyamide units.

摘要翻译： 本发明的热固性树脂组合物通过将芳族氨基氰化合物与环状酯化合物和/或环状酰胺化合物混合来制备。 虽然优选无溶剂型组合物，但本发明不限于此。 本发明的固化物可以通过加热固化所述热固性树脂组合物来制备。 得到的本发明的固化物通常含有三聚氰胺环，异质单胺环和线性聚酯和/或线性聚酰胺单元。

公开(公告)号：US4486583A

公开(公告)日：1984-12-04

申请号：US525700

申请日：1983-08-23

申请人： Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Hirosada Morishita

发明人： Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Hirosada Morishita

IPC分类号： C08G73/00 ,  B32B27/04 ,  C08G73/06 ,  C08L79/04 ,  C08G73/08

CPC分类号： C08G73/0644 ,  Y10T428/31504

摘要： A polymer which has excellent heat resistance and mechanical properties which is useful as a molding material, contains the structural units having the following formulae [I] and [II]: ##STR1## wherein A and B each represents an at least divalent organic group having at least one aromatic ring such as a diphenyl ring; and m and n each represents a number of at least 1. The polymer is used in the form of a solution or varnish as an impregnating, laminating, bonding or film-forming coating or prepreg-forming varnish. A resin composition for forming the polymer contains an aromatic cyanamide compound and an aromatic amine which are reacted to form a prepolymer which, upon heating, is converted into a cured polymer having the structural units of formulae [I] and [II].

摘要翻译： 具有优异的耐热性和机械性能的聚合物可用作成型材料，含有具有下式[I]和[II]的结构单元：即具有异质单胺环的聚合物单元 （即，具有正常三聚氰胺环的聚合物单元）其中A和B各自表示至少具有至少一个芳环的二价有机基团，例如二苯基环; m和n各自表示至少为1的数量。聚合物以溶液或清漆的形式用作浸渍，层压，粘合或成膜涂层或预浸料形成清漆。 用于形成聚合物的树脂组合物含有芳香族氰酰胺化合物和芳族胺，它们反应形成预聚物，其在加热时转化为具有式[I]和[II]结构单元的固化聚合物。

公开(公告)号：US4393188A

公开(公告)日：1983-07-12

申请号：US233746

申请日：1981-02-12

申请人： Akio Takahashi ,  Motoyo Wajima ,  Ritsuro Tada ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

发明人： Akio Takahashi ,  Motoyo Wajima ,  Ritsuro Tada ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

IPC分类号： C08G73/00 ,  C08G59/40 ,  C08G59/50 ,  C08G59/56 ,  C08G73/12 ,  C08J5/24 ,  H05K1/03 ,  C08G59/06

CPC分类号： C08G73/12 ,  C08G59/4042 ,  C08G59/56 ,  C08G73/121 ,  C08J5/24 ,  H05K1/0346 ,  Y10T428/31511 ,  Y10T428/31721

摘要： A process for preparing a thermosetting maleimide type prepolymer which comprises reacting (A) a polyfunctional maleimide compound, (B) a bis-maleimide, (C) a diamine and (D) an epoxy compound. The maleimide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

摘要翻译： 一种制备热固性马来酰亚胺型预聚物的方法，其包括使（A）多官能马来酰亚胺化合物，（B）双马来酰亚胺，（C）二胺和（D）环氧化合物反应。 根据本发明的方法制备的马来酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中具有快速固化性和优异的溶解性，可以低成本获得。 因此，预聚物有利地用于生产具有良好耐热性，低吸湿性和对诸如铜箔的各种基材的良好粘附性的层压板。

公开(公告)号：US3963796A

公开(公告)日：1976-06-15

申请号：US104398

申请日：1971-01-06

申请人： Hitoshi Yokono ,  Akio Nishikawa ,  Ritsuro Tada ,  Yasuo Miyadera

发明人： Hitoshi Yokono ,  Akio Nishikawa ,  Ritsuro Tada ,  Yasuo Miyadera

IPC分类号： C08G59/52 ,  C08G45/06

CPC分类号： C08G59/52 ,  Y10S525/934

摘要： An epoxy resin composition having a remarkably improved storage stability and an excellent hardening characteristic when heated, which comprises an epoxy resin and an aromatic amino carboxylic acid or a derivative thereof as a hardener for the epoxy resin. This composition can be molded by injection molding, heretofore being deemed inapplicable to epoxy resin compositions, whereby the molded articled of epoxy resin can be produced with a high molding efficiency.

摘要翻译： 包含环氧树脂和芳香族氨基羧酸或其衍生物作为环氧树脂的硬化剂的具有显着提高的储存稳定性和优异的硬化特性的环氧树脂组合物。 该组合物可以通过注塑成型，迄今为止被认为不适用于环氧树脂组合物，由此可以以高模塑效率制造环氧树脂的模制接头。

公开(公告)号：US3984373A

公开(公告)日：1976-10-05

申请号：US455408

申请日：1974-03-27

申请人： Akio Takahashi ,  Motoyo Wajima ,  Ritsuro Tada

发明人： Akio Takahashi ,  Motoyo Wajima ,  Ritsuro Tada

IPC分类号： C08G59/40 ,  C08G59/42 ,  C08G59/44 ,  C08G30/14

CPC分类号： C08G59/4042 ,  C08G59/4284 ,  C08G59/44 ,  Y10S260/24 ,  Y10T428/31525

摘要： An epoxy resin composition containing an N,N'-unsaturated amic acid compound represented by the general formula, HOCO--R.sub.2 --CONH--R.sub.1 --Y, wherein R.sub.1 is a divalent group having 2 or more carbon atoms, R.sub.2 is a divalent group having a carbon-to-carbon double bond, and Y is ##EQU1## or --NHCO--R.sub.2 --COOH. The composition is characterized, by being favorable in curing characteristics, heat resistance, and flame retardance.

摘要翻译： 含有由通式HOCO-R2-CONH-R1-Y表示的N，N'-不饱和酰胺酸化合物的环氧树脂组合物，其中R 1是具有2个或更多个碳原子的二价基团，R 2是具有 碳 - 碳双键，Y是CO-AN角-22 CO或-NHCO-R2-COOH。 该组合物的特征在于有利于固化特性，耐热性和阻燃性。

公开(公告)号：US4784917A

公开(公告)日：1988-11-15

申请号：US854507

申请日：1986-04-22

申请人： Keiko Tawara ,  Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Keiko Tawara ,  Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： C08L25/00 ,  C08F290/12 ,  C08F299/00 ,  C08J5/24 ,  C08L7/00 ,  C08L9/00 ,  C08L21/00 ,  C08L25/18 ,  C08L33/00 ,  C08L47/00 ,  H05K1/03 ,  B32B17/10 ,  B32B27/08 ,  B32B27/34

CPC分类号： C08L25/18 ,  C08F290/124 ,  C08F299/00 ,  C08J5/24 ,  C08L9/00 ,  H05K1/0326 ,  Y10T428/31645 ,  Y10T428/31746 ,  Y10T428/3175

摘要： A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.

摘要翻译： 一种热固性树脂组合物，其包含作为必要组分（a）预聚物，其包含通式为其中A表示氢或卤素原子的聚（对羟基苯乙烯）衍生物或具有2〜 4个碳原子，m表示1〜4的数，n表示1〜100的数，（b）1,2-聚丁二烯或其衍生物。 通过使用这种新型树脂组合物和常规设备和方法，可以容易地获得能够生产适合用于多层印刷电路板的低介电常数的层压材料的无粘性预浸料，其改善了接合铜箔的剥离强度， 机械强度，阻燃性和耐热性。

公开(公告)号：US4738900A

公开(公告)日：1988-04-19

申请号：US854766

申请日：1986-04-23

申请人： Masahiro Ono ,  Akio Takahashi ,  Katuo Sugawara ,  Ritsuro Tada ,  Akira Nagai ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Masahiro Ono ,  Akio Takahashi ,  Katuo Sugawara ,  Ritsuro Tada ,  Akira Nagai ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： B32B15/08 ,  B32B15/088 ,  C08G73/00 ,  C08G73/06 ,  C08G73/10 ,  C08G73/12 ,  C08J5/24 ,  H01B3/30 ,  H01L23/14 ,  H05K1/03 ,  H05K3/46 ,  C08F283/00

CPC分类号： H05K1/0346 ,  C08G73/12 ,  H01B3/303 ,  H01L23/145 ,  H05K1/0313 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/31721

摘要： Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.

摘要翻译： 通过加热热固性聚合性组合物而得到的固化树脂，所述组合物包含通过加热聚合的放热聚合温度范围内的至少两种聚合性化合物基本上彼此重合，例如芳香族马来酰亚胺化合物和芳香族氨基氰化合物 ，通过加热聚合显示基本上一个放热聚合峰的组成具有良好的耐热性，并且可以获得能够直接装载LSI芯片和芯片载体的具有良好耐热性的层叠高密度布线板 ，使用组合。